• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.11
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• pp.915-920
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• 2013

Units developed for a real satellite should pass space environmental tests and launch environment tests. Thermal Vacuum Test, one of the space environmental test, simulates extreme thermal environment encountered in on-orbit operation of satellite. Many payloads which adapt non-traditional, brand-new technology are developed by developers who is not familiar to space engineering field. There might be some possibility of mistakes which result in serious problem due to lack of experience, especially from planning to performing thermal vacuum test. In this paper, brief overview of thermal environmental test related to a satellite development is summarized in order to prepare and perform the thermal test.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.11a
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• pp.76-79
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• 2007

From the previous researches about flow characteristic of micro-nozzle， we found that viscosity and back pressure induced heavy losses in micro nozzle. To overcome thess losses, we began to study new conceptual micro propulsion system that is thermal transpiration based micro propulsion system. It has no moving parts and can pump the gaseous propellant by temperature gradient only (cold to hot). Most of previous research on thermal transpiration is in its early stage and mainly studied for application to small vacuum facility or gas chromatography in ambient condition using nanoporous material like aerogel. In this study, we focus on basic research of propulsion system based on thermal transpiration using polyimide material in vacuum conditions.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2008.03a
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• pp.866-870
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• 2008

In this study, we designed cold gas propulsion system with minimum 0.25 mm nozzle and micro-thrust measurement system to analyze flow characteristic of micro propulsion system in ambient and vacuum condition. Argon and Nitrogen are used for propellant and the result of experiments is compared with CFD analysis and theory. But there is a point where reduced scale versions of conventional propulsion systems will no longer be practical. Therefore, a fundamentally different approach to propulsion systems was taken. That is thermal transpiration based micro propulsion system. It has no moving parts such as lubricants, pressurizing system and can pump the gaseous propellant by temperature gradient only(cold to hot). We are advancing basic research of propulsion system based on thermal transpiration in vacuum conditions and had tried experiment process and theoretical access in advance. To characterize membrane of Knudsen pump, we select Polyimide material that has low thermal conductivity(0.29 W/mK) and can stand high temperature($300^{\circ}C$) for long time. And we fabricated hole diameter 1, 0.5, 0.2, 0.1 mm using precision manufacturing. Experimental results show that pressure gradient efficiency of Knudsen pump is increased to maximum 82% according to Knudsen number and thick membranes are more effective than thin membranes in transition flow regime.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.195-195
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• 2015

반도체 제조 시 ohmic contact을 형성하고, barrier metal layer형성을 위해 NH3 기체를 사용하는 rapid thermal nitridation (RTN)은 반도체 공정에 있어 매우 중요한 핵심 기술이다. 그러나 공정 진행 시 발생하는 공정 부산물에 의한 chamber오염으로 인해 매우 정확히 입사 되어야 할 thermal energy의 controllability가 저하되고 있어, 미세 공정능력 구현의 한계에 부닥치고 있다. 본 연구에서는 quartz plate liner를 적용하여 RTN 공정에서 발생하는 공정 부산물인 ammonium chloride (NH4Cl)의 chamber 표면 증착을 최소화하였고, 공정 진행 온도의 controllability를 확보하였다.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.33 no.5
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• pp.399-402
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• 2000

Very little information is known on the canning of fishery products by vacuum pack. In this paper, some fundamental process conditions for the canning of fishery products were investigated. Moisture-controlled mackerel pike, shrimp and oyster were packed in lacquered cans with spice and additives. After sealing, pressure of the cans were reduced by do-aeration through specially designed gas-tight silicone rubber plug previously attacked to the lid. On this investigation, vacuum can prior to thermal processing were set up to 15, 30, 45 and 60 cmHg, The higher vacuum in cans showed the more quick heat transfer in thermal processing. tinder 60 cmHg vacuum, the heat transfer was more quick than that of the conventional water packed products, Under 15 cmHg, however, the heat transfer was markedly increased by air which acted as an insulator in conductive heat transfer. These results demonstrated that high vacuum was essential secure for the heat processing in vacuum pack.

• Applied Science and Convergence Technology
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• v.25 no.3
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• pp.56-60
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• 2016

The ALD process is an adequate technique to meet the requirements that come with the downscaling of semiconductor devices. To obtain thin films of the desired standard, it is essential to understand the thermal decomposition properties of the precursors. As such, this study examined the thermal decomposition properties of TEMAHf precursors and its effect on the formation of $HfO_2$ thin films. FT-IR experiments were performed before deposition in order to analyze the thermal decomposition properties of the precursors. The measurements were taken in the range of $135^{\circ}C-350^{\circ}C$. At temperatures higher than $300^{\circ}C$, there was a rapid decrease in the absorption peaks arising from vibration of $Sp^3$ C-H stretching. This showed that the precursors experienced rapid decomposition at around $275^{\circ}C-300^{\circ}C$. $HfO_2$ thin films were successfully deposited by Atomic Layer Deposition (ALD) at $50^{\circ}C$ intervals between $150^{\circ}C$ to $400^{\circ}C$; the deposited films were characterized using a reflectometer, X-ray photoelectron spectroscopy (XPS), Grazing Incidence X-ray Diffraction (GIXRD), and atomic force microscopy (AFM). The results illustrate the relationship between the thermal decomposition temperature of TEMAHf and properties of thin films.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.5
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• pp.2267-2271
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• 2011

This study was focused on getting p-type copper-oxide thin-film semiconductors suitable for p-channel thin-film transistors. Vacuum thermal evaporation and thermal annealing were used to get copper-oxide thin-film semiconductor having properties adoptable as an active layer of thin-film transistors. n-type thin films having electron carrier density of about $10^{22}\;cm^{-3}$ before thermal annealing was converted to p-type thin films having hole carrier density of about $10^{16}\;cm^{-3}$ as the thermal annealing conditions were optimized.

• Aerospace Engineering and Technology
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• v.10 no.1
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• pp.39-44
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• 2011

A system of measurement for the thermal diffusivity of porous materials was developed. Although there are several measurement systems for thermal diffusivity, it is typically difficult to measure the thermal diffusivity of porous materials. This paper presents a measurement system for thermal diffusivity that utilizes a cyclic heating method along with the verification of the measured device. To verify the cyclic heating method, the available reference data of aceramic specimen was utilized. To apply the system to an actual porous material, polystyrene foam was tested. The thermal diffusivity of the polystyrene foam under vacuum was reduced by 63%. The measured values from both tests were in good agreement with the reference values, as they were within 10% of these values.

• 한국전산유체공학회:학술대회논문집
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• 2011.05a
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• pp.230-235
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• 2011

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and was developed by KARI for communication, ocean and meteorological observations. COMS was tested under vacuum and very law temperature conditions in order to correlate thermal model and to verify thermal design. The test was performed by using KARI large thermal vacuum chamber. The COMS S/C thermal model was successfully correlated versus the 2 thermal balance test phases. After model correlation, temperatures deviation of all individual unit were less than $5^{\circ}C$ and global deviation and standard deviation also satisfied the requirements, less than $2^{\circ}C$ and $3^{\circ}C$. The final flight prediction was performed by using the correlated thermal model.