• Title/Summary/Keyword: thermal vacuum

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A Study on the Thermal Characteristics of Agriculture Products in the Process of Low Temperature Vacuum Drying - With Cayenne as the Object Product for Drying - (농산물의 저온진공건조 열적 특성에 관한 연구 - 고추를 중심으로 -)

  • Choe, S.Y.
    • Journal of Power System Engineering
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    • v.5 no.1
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    • pp.44-49
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    • 2001
  • Low temperature vacuum drying technique shows very excellent energy efficiency and prominent drying performances compared with the conventional hot air drying technique. This study was focused on the thermal characteristics of the low temperature vacuum drying technique. From the results of this study, it was confirmed that the time consumption for drying with the new drying technique could be shortened to about 1/3 of the time consumption with the conventional hot air drying technique under the same drying conditions for wet products. Also, the maximum drying rate with the new drying technique reached to about $0.35kg/m^2h$ at about 400% of moisture content.

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Evaluation of the required cooling capacity of the Cryocooler in the vacuum system (극저온냉동기 직냉형 진공시스템의 냉동부하 평가)

  • 홍용주;박성제;김효봉;최영돈
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.02a
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    • pp.171-173
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    • 2003
  • The cryostat or dewar have been widely used for making and maintaining cryogenic and vacuum environments. The thermal performances of such cryogenic vacuum system mainly depend on the radiation heat transfer between hot and cold surface The characteristics of radiation heat transfer are complicated, because amounts of heat transfer depend on view factor, emissivities, and areas of thermal elements. In this study, the analysis of the radiation heat transfer in the small cryogenic vacuum system was performed using the surface to surface radiation model for evaluation of the required cooling capacity of the cryocooler.

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Mechanical and thermal properties of MWCNT-reinforced epoxy nanocomposites by vacuum assisted resin transfer molding

  • Lee, Si-Eun;Cho, Seho;Lee, Young-Seak
    • Carbon letters
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    • v.15 no.1
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    • pp.32-37
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    • 2014
  • Multi-walled carbon nanotube (MWCNT)/epoxy composites are prepared by a vacuum assisted resin transfer molding (VARTM) method. The mechanical properties, fracture surface morphologies, and thermal stabilities of these nanocomposites are evaluated for epoxy resins with various amounts of MWCNTs. Composites consisting of different amounts of MWCNTs displayed an increase of the work of adhesion between the MWCNTs and the matrix, which improved both the tensile and impact strengths of the composites. The tensile and impact strengths of the MWCNT/epoxy composite improved by 59 and 562% with 0.3 phr of MWCNTs, respectively, compared to the epoxy composite without MWCNTs. Thermal stability of the 0.3 phr MWCNT/epoxy composite increased compared to other epoxy composites with MWCNTs. The enhancement of the mechanical and thermal properties of the MWCNT/epoxy nanocomposites is attributed to improved dispersibility and strong interfacial interaction between the MWCNTs and the epoxy in the composites prepared by VARTM.

A Study on the Thermal Characteristics of Vacuum Membrane Distillation Module (VMD 모듈의 열성능 특성 연구)

  • Joo, Hong-Jin;Yang, Yong-Woo;Kwak, Hee-Youl
    • Journal of the Korean Solar Energy Society
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    • v.34 no.5
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    • pp.23-31
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    • 2014
  • This study was accomplished to get the foundation design data of VMD(Vacuum Membrane Distillation) system for Solar Thermal VMD plant. VMD experiment was designed to evaluate thermal performance of VMD using PVDF(polyvinylidene fluoride) hollow fiber hydrophobic membranes. The total membrane surface area in a VMD module is $5.3m^2$. Experimental equipments to evaluate VMD system consists of various parts such as VMD module, heat exchanger, heater, storage tank, pump, flow meter, micro filter. The experimental conditions to evaluate VMD module were salt concentration, temperature, flow rate of feed sea water. Salt concentration of feed water were used by aqueous NaCl solutions of 25g/l, 35g/l and 45g/l concentration. As a result, increase in permeate flux of VMD module is due to the increasing feed water temperature and feed water flow rate. Also, decrease in permeate flux of VMD module is due to increasing salinity of feed water. VMD module required about 590 kWh/day of heating energy to produce $1m^3/day$ of fresh water.

FGM-TBC의 열충격 특성에 미치는 진공 플라즈마 용사조건의 영향

  • Jeong, Yeong-Hun;Byeon, Eung-Seon;Nam, Uk-Hui;Lee, Gu-Hyeon;Gang, Jeong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.524-524
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    • 2012
  • Thermal Barrier Coating (TBC)은 미사일, 로켓발사체와 같이 고온에 노출되는 장비를 열로부터 보호하기 위한 코팅이다. 일반적인 Thermal Barrier Coating (TBC)은 모재와 코팅층간의 낮은 접합력과 높은 열충격으로 인한 박리가 많이 나타난다. 그래서 접합력을 높이고, 열충격을 줄이기 위해 모재와 코팅층 사이에 본드코팅층을 만든 Duplex - Thermal Barrier Coating (Duplex-TBC)이 개발되었다. 그러나 Duplex - Thermal Barrier Coating (Duplex-TBC)은 금속재료인 본드코팅층과 세라믹재료인 탑코팅층 사이에서 박리가 많이 발생한다. 이러한 문제점을 해결하기 위해 두 가지 분말을 동시에 코팅하여 본드코팅과 탑코팅의 경계가 없는 Functional Gradient Material - Thermal Barrier Coating (FGM-TBC)의 연구가 필요하다. 본 연구에서는 Functional Gradient Material - Thermal Barrier Coating (FGM-TBC)의 열충격 특성에 미치는 진공 플라즈마 용사 조건의 영향을 조사하였다. Functional Gradient Material - Thermal Barrier Coating (FGM-TBC)는 진공 플라즈마 용사장치를 사용하여 Cu-Cr 합금위에 코팅하였다. 거리, Carrier gas flow, 그리고 챔버 내부의 압력을 달리하여 제조하였다. 사용한 분말은 본드코팅용으로 Amdry 962와 내열 세라믹코팅을 위해 204NS를 사용하였고, 각각 분말 공급조건을 조절하여 두 분말의 비율을 달리하였다. 제조한 Functional Gradient Material - Thermal Barrier Coating (FGM-TBC) 코팅은 전기로에서 50분간 가열한 후, 수조에서 10분간 냉각하는 열충격 실험을 통해 열차폐 성능을 평가 하였다. 이러한 과정에서 진공 플라즈마 용사 조건 및 FGM 조성과 비율이 내열충격 특성에 미치는 영향을 미세조직학적 관점에서 고찰하였다.

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Study on the Thermal Dissipation Characteristics of 16-chip LED Package with Chip Size (16칩 LED 패키지에서 칩 크기에 따른 방열특성 연구)

  • Lee, Min-San;Moon, Cheol-Hee
    • Journal of the Korean Vacuum Society
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    • v.21 no.4
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    • pp.185-192
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    • 2012
  • p-n junction temperature and thermal resistance of Light Emitting Diode (LED) package are affected by the chip size due to the change of the thermal density and the external quantum efficiency considering the heat dissipation through conduction. In this study, forward voltage was measured for two different size LED chips, 24 mil and 40 mil, which consist constitute 16-chip package. p-n junction temperature and thermal resistance were determined by thermal transient analysis, which were discussed in connection with the electrical characteristics of the LED chip and the structure of the LED package.