• International Journal of Fluid Machinery and Systems
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• 제2권1호
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• pp.55-60
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• 2009

The present study investigated temperature and thermal stress distributions in a film cooling system with normal injection cooling flow. 3D-numerical simulations using the FEM commercial code ANSYS were conducted to calculate distributions of temperature and thermal stresses. In the simulations, the surface boundary conditions used the surface heat transfer coefficients and adiabatic wall temperature which were converted from the Sherwood numbers and impermeable wall effectiveness obtained from previous mass transfer experiments. As a result, the temperature gradients, in contrast to the adiabatic wall temperature, were generated by conduction between the hot and cold regions in the film cooling system. The gradient magnitudes were about 10~20K in the y-axis (spanwise) direction and about 50~60K in the x-axis (streamwise) direction. The high thermal stresses resulting from this temperature distribution appeared in the side regions of holes. These locations were similar to those of thermal cracks in actual gas turbines. Thus, this thermal analysis can apply to a thermal design of film cooling holes to prevent or reduce thermal stresses.

• Structural Engineering and Mechanics
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• 제22권3호
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• pp.331-349
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• 2006

The stresses and deflections in a laminated rectangular plate under thermal vibration are determined by using the moving least squares differential quadrature (MLSDQ) method based on the first order shear deformation theory. The weighting coefficients used in MLSDQ approximation are obtained through a fast computation of the MLS shape functions and their partial derivatives. By using this method, the governing differential equations are transformed into sets of linear homogeneous algebraic equations in terms of the displacement components at each discrete point. Boundary conditions are implemented through discrete grid points by constraining displacements, bending moments and rotations of the plate. Solving this set of algebraic equations yields the displacement components. Then substituting these displacements into the constitutive equation, we obtain the stresses. The approximate solutions for stress and deflection of laminated plate with cross layer under thermal load are obtained. Numerical results show that the MLSDQ method provides rapidly convergent and accurate solutions for calculating the stresses and deflections in a multi-layered plate of cross ply laminate subjected to thermal vibration of sinusoidal temperature including shear deformation with a few grid points.

• 콘크리트학회논문집
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• 제13권3호
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• pp.228-236
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• 2001

매스콘크리트 구조물에서 발생하는 온도응력을 예측하기 위해 많은 연구가 해석적인 방법과 실험적인 방법을 통해 수행되어왔다. 그러나 이러한 해석적인 방법과 실험적인 방법으로 온도응력을 예측하는 것은 한계가 있다. 해석적인 방법은 콘크리트의 탄성계수, 열팽창계수와 같은 물성치를 정확히 알아야 한다. 그리고 실험적인 방법은 대부분이 실제 구조물이나 모형구조물을 통하여 직접 온도응력을 측정한다. 그러나 이와 같은 방법은 경제적인 문제뿐만 아니라 현장의 불확실한 조건들을 감수해야 한다. 본 연구에서는 온도응력을 실내에서 직접적으로 측정할 수 있는 시험장치를 개발하였다. 개발된 온도응력 시험장치는 콘크리트와 다른 열팽창계수를 갖는 재료를 이용하여 실제 구조물에서 발생할 수 있는 콘크리트의 내/외부 구속에 의한 온도응력의 변화를 구현할 수 있으며, 이를 정량적으로 예측할 수 있다. 실험은 해석을 통해 얻은 온도이력을 구현할 수 있는 항온항습조에서 수행하였고, 온도응력은 장비에 부착된 변형률게이지를 통해 얻은 변형률을 이용하여 계산하였다. 개발된 장비의 검증을 위해 매립게이지를 이용하여 온도응력을 측정하는 실험을 동시에 수행하였고, 이 결과에 의하면 개발된 시험장치는 불확실한 콘크리트의 초기재령 물성치를 고려하여 보다 정확하게 온도응력을측정할 수 있으며, 검증실험 결과에 의해 그 객관성과 타당성을 입증할 수 있었다.

• Progress in Superconductivity
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• 제11권1호
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• pp.52-56
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• 2009

Temperature distributions and thermal stresses were calculated and analyzed to investigate the effect of the artificial holes to the transient behaviors of the superconductors which was cooled in liquid nitrogen. Three dimensional finite element method was used to calculated the transient temperature and thermal stresses in the superconductors. The cooling speed of the superconductors with holes is faster than those without holes. Because the thermal stresses calculated in the superconductors can be relaxed by the distributed holes, the volume of the peak tensile stress decreases during the cooling in liquid nitrogen. If optimal metal, which can maintain the relaxation of thermal stresses, is used to fill and reinforce the artificial holes, the probability of failure of the superconductors may be decreased by the decrease of volume of peak tensile stress.

• 대한기계학회논문집A
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• 제30권12호
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• pp.1543-1550
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• 2006

Since the performance of joints usually determines the structural efficiency of composite structures, an extensive knowledge of the behavior of adhesive joints and the related effect on joint strength is essential for design purposes. In this study, the torque capacity of adhesive joints was predicted using the combined thermal and mechanical analyses when the adherend was a composite tube. A finite element analysis was performed to evaluate residual thermal stresses developed in the joint, and mechanical s stresses in the adhesive were calculated including both the nonlinear adhesive behavior and the behavior of composite tubes. Three different joint failure modes were considered to predict joint failure: interfacial failure, adhesive bulk failure, and adherend failure. The influence of the composite adherend stacking angle on the residual thermal stresses was investigated, and how the residual thermal stresses affect the joint strength was also discussed. Finally, the predicted results were compared with experimental results available in literature.

• 대한기계학회논문집A
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• 제29권4호
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• pp.526-533
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• 2005

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

• 동력기계공학회지
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• 제5권2호
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• pp.36-42
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• 2001

This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2007년도 정기 학술대회 논문집
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• pp.265-270
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• 2007

According to previous research, welding-induced residual stresses in steel structures can significantly affect the fatigue behaviour. Usually, high tensile residual stresses up to the yield strength are conservatively assumed at the weld toes. This conservative assumption can result in misleading fatigue assessments. Thee welding-induced residual stresses need be known in advance for a reliable fatigue assessment, which becomes possible to an increasing extent by numerical welding simulation. In this study, a fatigue Analysis technique for steel structures with welding induced residual stress is presented. First, We calculate the history of temperature according with welding process. Secondly, residual stress with a welding thermal history was evaluated by non-linear thermal stress analysis and lastly, fatigue strength is estimated with modified Goodman equation which can consider the effect of mean stress level.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2001년도 가을 학술발표회 논문집
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• pp.363-368
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• 2001

Abutments in Kumdang bridge are massive concrete structures of which total height is l0m, length is 30m, and width is 7m. Therefore, there is every probability that early age thermal cracking such as hydration heat occur. We measure heat of hydration, strains of rebar, and stresses of concrete abutment during construction. Using analysis of measuring data, we examine thermal stresses, and make use of results as method which control thermal cracking. Finally, we develope thermal stress analysis program which have pre/post processor to be easy of accessing and the usefulness of that is estimated through comparison of results.