• 제목/요약/키워드: thermal shock strength

검색결과 136건 처리시간 0.024초

용사법에 의해 제작된 금속/세라믹 경사기능 재료의 기계적 특성 (Mechanical Properties of Metal/Ceramic FGM made by Thermal Spraying Method)

  • 김영식;남기우;김현수;오명석;김귀식
    • 동력기계공학회지
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    • 제2권3호
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    • pp.41-48
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    • 1998
  • This study was aimed at development of fabrication process of functionally graded materials(FGM), consisting of metal and ceramic by thermal spraying method. NiCrAIY/$Al_2O_3$ FGM were made by using plasma spraying onto the SS400 carbon steel substrate. And mechanical properties such as microhardness, thermal shock resistance and adhesive strength of the coating layer were investigated. Adhesive strength was evaluated by acoustic emission method. It was resulted that NiCrAIY/$Al_2O_3$ FGM made by thermal spraying method showed excellent thermal shock resistance and adhesive strength compared to the other lamellar structures of sprayed coatings and that AE is useful tool to evaluate the defect of thermal sprayed coating layer.

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Sn-3Ag-0.5Cu계 솔더를 이용한 자동차 전장 부품 접합부의 열충격 특성에 관한 연구 (A Study of Thermal Shock Characteristics on the Joints of Automotive Application Component using Sn-3Ag-0.5Cu Solder)

  • 전유재;손선익;김도석;신영의
    • 한국전기전자재료학회논문지
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    • 제23권8호
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    • pp.611-616
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    • 2010
  • This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

ZrO2가 코디어라이트-뮬라이트 세라믹스의 기계적 강도 및 내열충격성에 미치는 영향 (Effects of ZrO2 Addition on Mechanical Strength and Thermal Shock Resistance of Cordierite-Mullite Ceramics)

  • 임진현;김시연;여동훈;신효순;정대용
    • 한국재료학회지
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    • 제28권12호
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    • pp.719-724
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    • 2018
  • Cordierite composed of an alumina-silica-magnesia compound has a low coefficient of thermal expansion(CTE) and excellent thermal shock resistance. It also has a low dielectric constant and high electrical insulation. However, due to low mechanical strength, it is limited for use in a ceramic heater. In this study, $ZrO_2$ is added to an 80 wt% cordierite-20 wt% mullite composition, and the effect of $ZrO_2$ addition on the mechanical strength and thermal shock resistance is investigated. With an increasing addition of $ZrO_2$, cordierite-mullite formed $ZrO_2$, $ZrSiO_4$ and spinel phases. With sintering conducted at $1400^{\circ}C$ with the addition of 5 wt% $ZrO_2$ to 80 wt% cordierite-20 wt% mullite, the most dense microstructure forms along with an excellent mechanical strength with a 3-point flexural strength of 238MPa. When this composition is quenched in water at ${\Delta}T=400^{\circ}C$, the 3-point flexural strength is maintained. Moreover, when this composition is cooled from $800^{\circ}C$ to air, the 3-point flexural strength is maintained even after 100 cycles. In addition, the CTE is measured as $3.00{\times}10^{-6}{\cdot}K^{-1}$ at $1000^{\circ}C$. Therefore, 80 wt% cordierite-20 wt% mullite with 5 wt% $ZrO_2$ is considered to be appropriate as material for a ceramic heater.

Experimental Study Shock Waves in Superfluid Helium Induced by a Gasdynamic Shock Wave Impingement

  • Yang, Hyung-Suk;Nagai, Hiroki;Murakami, Masahide;Ueta, Yasuhiro
    • 한국초전도저온공학회:학술대회논문집
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    • 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
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    • pp.43-47
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    • 2000
  • Two modes of shock waves, a compression shock wave and a thermal shock wave, propagating in He II have been investigated. The shock waves are at a time generated by the impingement of a gasdynamic shock wave onto a He II free surface in the newly developed superfluid shock tube facility. Superconductive temperature sensors, piezo-type pressure transducers and visualization photograph were used for the measurement of them and the phenomena induced by them were investigated in detail. It is found that the compression by a compression shock wave in He II causes temperature drop because He II has negative thermal expansion coefficient. the thermal shock wave is found to be of a single triangular waveform with a limited shock strength. The waveform is similar to that generated by stepwise strong heating from an electrical heater for relatively long heating time. In the experiments at the temperatures near the lambda temperature, no thermal shock wave is sometimes detected in shock compressed He II. It can be understood that shock compression makes He Ii convert to He I in which no thermal shock wave is excited.

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Thermal Shock Resistance and Thermal Expansion Behavior of $Al_2TiO_5$ Ceramics

  • Kim, Ik-Jin
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 2000년도 Proceedings of 2000 International Nano Crystals/Ceramics Forum and International Symposium on Intermaterials
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    • pp.179-193
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    • 2000
  • Aluminium titanate (Al₂TiO5) with an excellent thermal shock resistant and a low the expansion coefficient was obtained by solid solution with MgO, SiO₂, and ZrO₂ in the Al₂TiO5 lattice or in the grain boundary solution through electrofusion in an arc furnace. However, these materials have low mechanical strength due to the presence of microcracks developed by a large difference in thermal expansion coefficients along crystallographic axes. Pure Al₂TiO5 tends to decompose into α-Al₂O₃ and TiO₂-rutile in the temperature range of 750-1300℃ that rendered it apparently useless for industrial applications. Several thermal shock tests were performed: Long therm thermal annealing test at 1100℃ for 100h; and water quenching from 950 to room temperature (RT). Cyclic thermal expansion coefficients up to 1500℃ before and after decomposition tests was also measured using a dilatometer, changes in the microstructure, thermal expansion coefficients, Young's modulus and strengths were determined. The role of microcracks in relation to thermal shock resistance and thermal expansion coefficient is discussed.

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티타니아 세라믹 熔射皮膜의 强度向上에 관한 硏究 (A Study on the strengthening of titania ceramic coating layer on the steel substrate)

  • 김영식
    • Journal of Welding and Joining
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    • 제10권4호
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    • pp.181-189
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    • 1992
  • The purpose of this investigation is to examine the effects of the strengthening treatments on the mechanical properties of the flame-sprayed titania ceramic coating layer. The strengthening treatments for flame sprayed specimens were carried out in 12 different conditions in vaccum furance. The mechanical properties such as microhardness, thermal shock resistance, adhesive strength and erosion resistance were tested for the sprayed specimens after strengthening treatments. And it was clear that the mechanical properties of coating layer were much improved by the strengthening treatments. The results obtained are summarized as follows; 1. It was shown that the metallurgical bond was formed between substrate and coating layer by the strengthening treatments and that thermal shock resistance and adhesive strength were remarkably raised. 2. Microhardness of coating lay was considerably increased by the strengthening treatments. 3. Erosion resistance and porosity of coating layer were slightly improved by the strengthening treatments.

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다양한 유무연 도금 리드프레임에 적용된 Sn-8Zn-3Bi 솔더 접합부의 열충격 신뢰성 평가 (Reliability of Sn-8Zn-3Bi Solder Paste Applied to Lead and Lead-free Plating on Lead-frame under Thermal Shock Test)

  • 한성원;조일제;신영의
    • 마이크로전자및패키징학회지
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    • 제14권2호
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    • pp.35-40
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    • 2007
  • Sn-8Zn-3Bi 무연 솔더 페이스트의 접합부신뢰성 및 적합성을 평가하기 위해 유(SnPb) 무연(Sn, SnBi)도금된 Cu 리드프레임 QFP(Quad Flat Packager)를 사용하여 열충격 조건 하에서의 인장 강도의 변화 및 파괴 기구에 대한 분석을 실시하였다. 리드 도금의 종류에 상관없이 모든 시험 시편에서 열충격 사이클 수의 증가에 비례하여 접합부의 취성 특성이 강화되어 인장 강도가 감소하는 것을 확인하였다. 하지만, 접합부에는 열팽창 계수의 차이에 의해 야기될 수 있는 미세 균열은 발견되지 않았다. 단면 관찰 및 변위 이력 곡선 분석을 통하여 열충격 사이클 수의 증가에 따른 인강 강도의 감소는 접합부의 파괴 기구의 변화에 기인되었음을 확인하였다. 본 실험을 통해 Sn-3Zn-3Bi 솔더의 유 무연 도금 Cu 리드프레임과의 우수한 작업 특성과 열충격 환경 하에서도 우수한 기계적 접합 특성을 유지하는 것을 확인할 수 있었다.

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침전법으로 제조한 $Al_2O_3$-$ZrO_2$계 세라믹스의 열충격 거동 (Thermal Shock Behavior of $Al_2O_3$-$ZrO_2$ Ceramics Prepared by a Precipitation Method)

  • 홍기곤;이홍림
    • 한국세라믹학회지
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    • 제28권1호
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    • pp.11-18
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    • 1991
  • A precipitation method, one of the most effective liquid phase reaction methods, was adopted in order to prepare high-tech Al2O3/ZrO2 composite ceramics, and the effects of stress-induced phase transformation of ZrO2 on thermal shock behavior of Al2O3-ZrO2 ceramics were investigated. Al2(SO4)3.18H2O, ZrOCl2.8H2O and YCl3.6H2O were used as starting materials and NH4OH as a precipitation agent. Metal hydroxides were obtained by single precipitation(process A) and co-precipitation(process B) method at the condition of pH=7, and the composition of Al2O3-ZrO2 composites was fixed as Al2O3-15v/o ZrO2(+3m/o Y2O3). Critical temperature difference showing rapid strength degradation by thermal shock showed higher value in Al2O3/ZrO2 composites(process A : 20$0^{\circ}C$, process B : 215$^{\circ}C$) than in Al2O3(175$^{\circ}C$). The improvement of thermal shock property for Al2O3/ZrO2 composites was mainly due to the increase of strength at room temperature by adding ZrO2. The strength degradation was more severe for the sample with higher strength at room temperature. Crack initiation energies by thermal shock showed higher values in Al2O3/ZrO2 composites than in Al2O3 ceramics due to increase of fracture toughness by ZrO2.

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금속/세라믹 계면 물성 분석 (Metal/ceramic Interface Mechanical Property Analysis)

  • 김송희;강형석
    • 산업기술연구
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    • 제24권A호
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    • pp.9-15
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    • 2004
  • The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

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Low Ag 조성의 Sn-0.3Ag-0.7Cu 및 Sn-3.0Ag-0.5Cu 무연솔더 접합부의 열충격 신뢰성 (Thermal Shock Reliability of Low Ag Composition Sn-0.3Ag-0.7Cu and Near Eutectic Sn-3.0Ag-0.5Cu Pb-free Solder Joints)

  • 홍원식;오철민
    • 대한금속재료학회지
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    • 제47권12호
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    • pp.842-851
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    • 2009
  • The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.