• Journal of the Korean Society for Precision Engineering
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• v.30 no.8
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• pp.802-808
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• 2013

Thermal barrier coating (TBC) is used to protect substrates and extend the operating life of gas turbines in power plant and aeronautical applications. The major causes of failure of such coatings is spallation, which results from thermal stress due to a thermal expansion coefficient mismatch between the top coating and the bond coating layers. In this paper, the effects of the material properties and the thickness of the top coating layer on thermal stresses were evaluated using the finite element method and the equation for the thermal expansion coefficient mismatch stress. In addition, we investigated a design technique for the top coating whereby thermal resistance is exploited.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.6
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• pp.431-434
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• 2012

In this paper, heat-releasing sheets made of AlN powder and acryl binder as thermoset were prepared using tape casting method. The crystal structure and morphology, the thermal properties as nonvolatile solid content and thermal conductivity, and the surface resistance of heat-releasing sheet were measured by using X-ray diffractometer, field emission-scanning electron microscopy, thermo gravimetric analyzer and laser flash instrument, and surface resistance meter. It was proved that thermal conductivity is greatly affected by the content of binder in heat-releasing sheet. Superior thermal conductivity above 3.5 W/mK and suface resistance were obtained at heat-releasing sheet with above 90% of AlN powder.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.5 s.311
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• pp.60-67
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• 2006

Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.172-174
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• 2003

In this paper, a 2D axisymmetric model of thermoelectric Finite Element Method (FEM) is developed to analyze the transient thermal behavior of Resistance Spot Welding (RSW) process using commercial software, called ANSYS. The determination of the contact resistance at the faying surface is moderately simplified to reduce the calculating time, while the temperature dependent material properties, phase change and convectional boundary conditions are taken account fur the improvement of the calculated accuracy. The thermal history of the whole process (including cooling) and temperature distributions for any position in the weldment is obtained through the analysis.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.153-157
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• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• Nuclear Engineering and Technology
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• v.55 no.10
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• pp.3860-3865
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• 2023

A metallic microcell UO₂ pellet has a microstructure where a metal wall is connected to overcome the low thermal conductivity of the UO₂ fuel pellet. It has been verified that metallic microcell fuel pellets provide an impressive reduction of the fuel centerline temperature through a Halden irradiation test. However, it is difficult to predict the effective thermal conductivity of these pellets and researchers have had to rely on measurement and use of the finite element method. In this study, we designed a unit microcell model using a thermal resistance circuit to calculate the effective thermal conductivity on the basis of the microstructure characteristics by using the aspect ratio and compared the results with those of reported metallic UO₂ microcell pellets. In particular, using the thermal conductivity calculated by our model, the fuel centerline temperature of Cr microcell pellets on the 5th day of the Halden irradiation test was predicted within 6% error from the measured value.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.17 no.4
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• pp.377-381
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• 1988

Effects of thermal resistance of mold during freezing processes have been investigated. Saturated liquid is chosen to present one-dimensional quasi-steady solution and this solution is compared with numerical solutions. Front tracking finite element method has been applied for the numerical solutions. Results show that mold should be considered as well as phase change material except the cases when the very thin mold with relatively high thermal conductivity is used.

• Korean Journal of Optics and Photonics
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• v.25 no.4
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• pp.221-224
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• 2014

We present a method for manufacturing a TIM used for packaging a high-power LED. In this method a mixture of diamond powder and hydrogen peroxide is used as a filler epoxy. The thermal resistance of the TIM with hydrogen peroxide was improved by about 30% over the thermal resistance of the TIM without hydrogen peroxide. We demonstrate that as a result the heat generated from the chip is easily dissipated through the TIM.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.6 no.2
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• pp.78-92
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• 1994

Thermal performance of pipe network of continuous heating system controlled by thermostat and flow control valve was simulated in consideration of radiation heat transfer and solved by linear analysis method. Thermal performance of real apartment building with radiant floor heating system was simulated by equivalence heat resistance-capacity method. This method enables to simulate the unsteady variation of temperature or each element of building. Heat transfer characteristics of each element were also investigated.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.