• 한국정밀공학회지
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• 제30권8호
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• pp.802-808
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• 2013

Thermal barrier coating (TBC) is used to protect substrates and extend the operating life of gas turbines in power plant and aeronautical applications. The major causes of failure of such coatings is spallation, which results from thermal stress due to a thermal expansion coefficient mismatch between the top coating and the bond coating layers. In this paper, the effects of the material properties and the thickness of the top coating layer on thermal stresses were evaluated using the finite element method and the equation for the thermal expansion coefficient mismatch stress. In addition, we investigated a design technique for the top coating whereby thermal resistance is exploited.

• 한국전기전자재료학회논문지
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• 제25권6호
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• pp.431-434
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• 2012

In this paper, heat-releasing sheets made of AlN powder and acryl binder as thermoset were prepared using tape casting method. The crystal structure and morphology, the thermal properties as nonvolatile solid content and thermal conductivity, and the surface resistance of heat-releasing sheet were measured by using X-ray diffractometer, field emission-scanning electron microscopy, thermo gravimetric analyzer and laser flash instrument, and surface resistance meter. It was proved that thermal conductivity is greatly affected by the content of binder in heat-releasing sheet. Superior thermal conductivity above 3.5 W/mK and suface resistance were obtained at heat-releasing sheet with above 90% of AlN powder.

• 전자공학회논문지SC
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• 제43권5호
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• pp.60-67
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• 2006

우주 비행체 전자장비의 신뢰도를 예측하고 최적화하기 위해 탑재장치 내 부품의 온도 예측이 필수적으로 요구된다. 본 논문에서는 전자장비 부품의 온도 예측방법에 관해 기술하고 있다. 본 예측 방법은 PCB 기판의 열전도도를 등방성모델로 설정하여 등가 열전도도를 계산하고 열력 모델을 이용하여 열 저항 행렬을 생성하였으며, 중첩의 원리를 이용하여 각 부품들의 온도를 예측하였다. 또한 본 논문의 온도 예측방법을 이용하여 전장품 소자의 열해석 결과와 상용 프로그램을 이용한 온도 계산 결과를 비교 분석하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.172-174
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• 2003

In this paper, a 2D axisymmetric model of thermoelectric Finite Element Method (FEM) is developed to analyze the transient thermal behavior of Resistance Spot Welding (RSW) process using commercial software, called ANSYS. The determination of the contact resistance at the faying surface is moderately simplified to reduce the calculating time, while the temperature dependent material properties, phase change and convectional boundary conditions are taken account fur the improvement of the calculated accuracy. The thermal history of the whole process (including cooling) and temperature distributions for any position in the weldment is obtained through the analysis.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.153-157
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• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• Nuclear Engineering and Technology
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• 제55권10호
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• pp.3860-3865
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• 2023

A metallic microcell UO₂ pellet has a microstructure where a metal wall is connected to overcome the low thermal conductivity of the UO₂ fuel pellet. It has been verified that metallic microcell fuel pellets provide an impressive reduction of the fuel centerline temperature through a Halden irradiation test. However, it is difficult to predict the effective thermal conductivity of these pellets and researchers have had to rely on measurement and use of the finite element method. In this study, we designed a unit microcell model using a thermal resistance circuit to calculate the effective thermal conductivity on the basis of the microstructure characteristics by using the aspect ratio and compared the results with those of reported metallic UO₂ microcell pellets. In particular, using the thermal conductivity calculated by our model, the fuel centerline temperature of Cr microcell pellets on the 5th day of the Halden irradiation test was predicted within 6% error from the measured value.

• 대한설비공학회지:설비저널
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• 제17권4호
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• pp.377-381
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• 1988

Effects of thermal resistance of mold during freezing processes have been investigated. Saturated liquid is chosen to present one-dimensional quasi-steady solution and this solution is compared with numerical solutions. Front tracking finite element method has been applied for the numerical solutions. Results show that mold should be considered as well as phase change material except the cases when the very thin mold with relatively high thermal conductivity is used.

• 한국광학회지
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• 제25권4호
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• pp.221-224
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• 2014

고출력 LED 소자의 활용이 많아지면서, 온도상승 문제를 극복하고 신뢰성을 향상해야 하는 요구가 높아짐에 따라 광원 패키지의 방열이 매우 중요해졌다. 패키지에 칩을 접합하는 열전달 물질(TIM, Thermal Interface Material)은 열전도도가 높은 물질과 폴리머를 혼합하여 재료 자체의 열전달 특성을 향상시키는 방안이 사용되어 왔으나, 실제 패키지의 열 특성은 칩 부착계면의 높은 열저항으로 인해 기대에 미치지 못하고 있다. 본 연구는 diamond 분말과 epoxy의 혼합으로 열 특성을 개선함에 있어서, 과산화수소를 적용하면서도 기포를 효율적으로 제거하여, 각 계면의 친화성을 높이고 전체 점도를 낮추어 diamond 분말의 분산을 촉진하고, 결과적으로 대부분의 경우에 전체 열 저항을 약 30% 이상 개선하였다.

• 설비공학논문집
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• 제6권2호
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• pp.78-92
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• 1994

Thermal performance of pipe network of continuous heating system controlled by thermostat and flow control valve was simulated in consideration of radiation heat transfer and solved by linear analysis method. Thermal performance of real apartment building with radiant floor heating system was simulated by equivalence heat resistance-capacity method. This method enables to simulate the unsteady variation of temperature or each element of building. Heat transfer characteristics of each element were also investigated.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.