• Korean Journal of Optics and Photonics
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• v.20 no.2
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• pp.118-122
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• 2009

An optical sheet with microlens array (MLA) is designed and fabricated as a substitute for the prism sheets of LCD backlight. Using photoresist thermal reflow, MLAs were fabricated on PET film with thickness of $100{\mu}m$, and we measured the change of MLA profile in terms of exposure time, reflow temperature and reflow time.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.105-115
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• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1063-1068
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• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.30-35
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• 2020

A microlens has been fabricated by various methods such as a thermal reflow, hot embossing, diamond milling, etc. However, these methods require a relatively complex process to control the microlens shape. In this work, we report on a simple and cost-effective method to fabricate a cylindrical microlens (CML), which can diffuse light widely. We have employed a slot-die head with the dual plate (a meniscus guide with a protruded μ-tip and a shim with a slit channel) for coating of a narrow stripe using poly(methyl methacrylate) (PMMA). We have shown that the higher the coating gap, the lower the maximum coating speed, which causes an increase in the stripe width and thickness. The coated PMMA stripe has the concave shape. To make it in the shape of a convex microlens, we have applied the thermal reflow method. When the stripe thickness is small, however, its effect is negligible. To increase the stripe thickness, we have increased the number of repeated coating. With this scheme, we have fabricated the CML with the width of 223 ㎛ and the thickness of 7.3 ㎛. Finally, we have demonstrated experimentally that the CML can diffuse light widely, a feature demanded for light extraction efficiency of organic light-emitting diodes (OLEDs) and suppression of moiré patterns in displays.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.323-324
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• 2012

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.1
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• pp.1-9
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• 2002

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.23-28
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• 2013

Microlens array as basic element of the optical system have been fabricated with various focal length (mainly with long focal length) depending on the purpose of application. In this paper, the microlens arrays were fabricated for observing fluorescent images within sol-gel. Though the fluorescent signal is very low, the microlens array can help obtaining clear images through extracting the fluorescent light from sol-gel. We fabricated microlens arrays with short focal length, which can extract the light using photoresist thermal reflow method. In the experiment, the diameter of microlens decreased after thermal reflow because the solvent within the photoresist was vaporized. Therefore, to compensate the shape error by this reduction, microlens diameter in photomask was altered and spin-coat recipe of photoresist were modified.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.