• Title/Summary/Keyword: thermal properties and mechanical properties

Search Result 2,732, Processing Time 0.031 seconds

PROPERTIES OF PLASMA SPRAYED COATINGS

  • Ding, C.X.;Zhang, Y.F.;Xia, J.Y.
    • Journal of the Korean Vacuum Society
    • /
    • v.4 no.S2
    • /
    • pp.58-63
    • /
    • 1995
  • Plasma spray has attracted attention as an effective method for obtaining protective coatings. In this paper, the physical, mechanical and thermal properties of coatings are reviewed. The microstructural features of the coatings are described. The relationship between the properties of coatings and their microstructure is also discussed. Plasma sprayed coatings are used to reduce wear and improve thermal protection on a large number of components in various industries. In some cases, the conditions of application are very aggressive and therefore the resulting maintenance costs are expensive. Improved coating materials and appropriate properties of coatings are the most promising ways to solve these problems[1,2]. The optimum coating properties depend on the microstructure of coatings[1-5]. In this paper, some ceramic coatings frequently used in industries were reported. The physical, mechanical and thermal properties of ceramic coatings are reviewed. The microstructure features of coatings are addressed. The relationship between the microstructure of coatings and their properties are discussed.

  • PDF

Effect of Adding SiO2 and Al2O3 on Mechanical Properties of Zircon (SiO2와 Al2O3 첨가가 지르콘의 기계적 특성에 미치는 영향)

  • Cho, Bum-Rae
    • Korean Journal of Materials Research
    • /
    • v.21 no.4
    • /
    • pp.220-224
    • /
    • 2011
  • Zircon has excellent thermal, chemical, and mechanical properties, but it is hard to make a dense sintered product because of dissociation during the sintering process. This study analyzes how the addition of $SiO_2$ and $Al_2O_3$ affects the mechanical properties of sintered zircon, particularly in regards to reducing the thermal dissociation and improving the mechanical properties of $ZrSiO_4$. Zircon specimens containing different amounts of $SiO_2$ and $Al_2O_3$ were prepared and sintered to observe how the mechanical properties of $ZrSiO_4$ changed according to the differing amount of $SiO_2$ and $Al_2O_3$. The $ZrSiO_4$ that was used for the starting material was ground by ball mill to an average particle size of 3 ${\mu}m$. The $SiO_2$ and $Al_2O_3$ that was used for additives were ground to an average particle size of 3 ${\mu}m$ and 0.5 ${\mu}m$, respectively. Adding $SiO_2$ resulted in transformation in the liquid phase at high temperatures, which had little effect on suppressing the thermal dissociation but enhanced the mechanical properties of $ZrSiO_4$. When $Al_2O_3$ was added, the mechanical properties of $ZrSiO_4$ decreased due to the formation of pores and abnormal grains in the microstructure of the sintered zircon.

Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame (LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구)

  • Lee, Chang-Hun;Kim, Ki-Chul;Kim, Young-Sung
    • Journal of Welding and Joining
    • /
    • v.30 no.3
    • /
    • pp.32-37
    • /
    • 2012
  • Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

Thermal properties and mechanical properties of dielectric materials for thermal imprint lithography

  • Kwak, Jeon-Bok;Cho, Jae-Choon;Ra, Seung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2006.06a
    • /
    • pp.242-242
    • /
    • 2006
  • Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

  • PDF

Mechanical Properties of in Recyclate HIPS with Concentration of Fly Ash (再生 HIPS에 石炭灰 첨가에 따른 기계적 특성)

  • 안태광;김덕현
    • Resources Recycling
    • /
    • v.10 no.2
    • /
    • pp.34-40
    • /
    • 2001
  • Post-consumer dairy HIPS bottles were gathered and recycled by the following processes; crushing into flakes, chemical treatment for the purpose of elimination aluminium caps, washing, and separation from other plastics, such as PP, PE, plasticized PVC These HIPS flakes were extruded into the chips using a single screw extruder. Recyclate HIPS chips were mixed with fly ash as an additive in the range of 5-50 wt%, which were formed from coal power plant. Recyclate HIPS chips mixed with fly ash were molded to investigate thermal and mechanical properties. Their samples, thermal and mechanical properties were measured via DSC, TGA, UTM, and impact strength analysis. The probable mechanical properties exhibited the range of 5∼30% fly ash contents for their applications.

  • PDF

Characteristic Studies of Plasma Treated unidirectional Hildegardia Populifolia Fabric

  • Prasad, C. Venkata;Lee, D.W.;Sudhakara, P.;Jagadeesh, D.;Kim, B.S.;Bae, S.I.;Song, J.I.
    • Composites Research
    • /
    • v.26 no.1
    • /
    • pp.54-59
    • /
    • 2013
  • This study deals with effect of plasma treatment on the properties of unidirectional ligno cellulosic fabric Hildegardia Populofolia (HDP) fabric. Thermal stability of the fabric was determined by differential scanning calorimetry (DSC) and Thermo gravimetric analysis (DSC). Morphological properties was analyzed by SEM analysis and found that the surface was rough upon plasma treatment which provides good interfacial adhesion with matrix during composite fabrication. Thermal stability and mechanical properties of the plasma treated fabric slightly increases compare to alkali and untreated fabric. It was observed that tensile properties of the fabric increases upon plasma treatment due to the formation of rough surface. SEM analysis indicates formation of rough surface on plasma treatment which helps in increasing the interfacial interaction between the matrix (hydrophobic) and fabric (hydrophilic).

Research Trends of High-entropy Alloys (고엔트로피 합금의 연구동향)

  • Park, Pureunsol;Lee, Ho Joon;Jo, Youngjun;Gu, Bonseung;Choi, Won June;Byun, Jongmin
    • Journal of Powder Materials
    • /
    • v.26 no.6
    • /
    • pp.515-527
    • /
    • 2019
  • High-entropy alloys (HEAs) are generally defined as solid solutions containing at least 5 constituent elements with concentrations between 5 and 35 atomic percent without the formation of intermetallic compounds. Currently, HEAs receive great attention as promising candidate materials for extreme environments due to their potentially desirable properties that result from their unique structural properties. In this review paper, we aim to introduce HEAs and explain their properties and related research by classifying them into three main categories, namely, mechanical properties, thermal properties, and electrochemical properties. Due to the high demand for structural materials in extreme environments, the mechanical properties of HEAs including strength, hardness, ductility, fatigue, and wear resistance are mainly described. Thermal and electrochemical properties, essential for the application of these alloys as structural materials, are also described.

Effect of Thermophysical Properties on Stress Transfer Function ofr Thermal Fatigue Analysis (열피로 해석시 응력전달함수에 미치는 열적 재료 성질의 영향)

  • Kim, Yeong-Jin;Seok, Chang-Seong;Park, Jong-Ju
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.20 no.1
    • /
    • pp.172-179
    • /
    • 1996
  • For mechanical systems operating at high tempertature, thermal fatigue phenomenon has been recognized as a major cause of mechanical component failures. To evaluate cumulative fatigue damage as a conesquence of thermal fatugue on real time, the stress tranfer function(Green's function) approach is popularly used. The objective of this paper is to investigate the effect of thermophsical properties on the stress tranfer function. For this purpose a modified Green's function approach considering temperature-dependent thermophysical properties is proposed. Two case studies were performed and the proposed approach agrees well with full finite element analysis.

Thermal modeling of microcellular foamed polymer matrix (초미세 발포 성형 고분자 물질의 열전달 모델링)

  • Moon, Byeong_Gi;Cha, Sung-Woon;Oh, Sei-Woong
    • Proceedings of the KSME Conference
    • /
    • 2000.04b
    • /
    • pp.367-372
    • /
    • 2000
  • By the means of microcellular (earning, we can make polymers with $10{\mu}m$ sized gas bubbles. After the $CO_2$ gas bubbles solve, diffuse and leave the polymer matrix, the thermal properties of polymer matrix are changed. Expecially, thermal conductivity becomes low. So, the polymer matrixes with gas bubbles can be used as insulator In this paper, we make model after microcellular foamed polymer matrix to know the change of thermal properties. Most of all, the purpose of this paper is the mlcrocellular foamed polymer matrix's availability as a insulator Beside of thermal properties the surface of microcellular foamed polymer is polished and easy to be colored. Above all the mechanical properties are better than the other insulator. So, microcellular foamed polymer can be used as exterior of building or it can be replaced as a tile.

  • PDF

An Nondestructive Evaluation of Degraded Damage for Superaustenitic Stainless Steel (슈퍼 오스테나이트 스테인리스강의 열화손상에 대한 비파괴적 평가)

  • Kwon, Il-Hyun;Baek, Seung-Se;Iino, Y.;Yu, Hyo-Sun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.26 no.7
    • /
    • pp.1332-1339
    • /
    • 2002
  • This research was undertaken to clarify effects of thermal aging on electrochemical and mechanical properties of superaustenitic stainless steel and to detect the material degradation nondestructively. The steel was artificially aged at $300{\sim}650^{\circ}C$ for $240{\sim}10,000h$ and the mechanical properties were investigated at $-196{\sim}650^{\circ}C$ using small punch(SP) test. Also, the change in electrochemical properties caused by effects of thermal aging on superaustenitic stainless steel was investigated using electrochemical anodic polarization test in a KOH electrolyte. Carbides and ${\eta}-phase(Fe_2Mo)$ precipitated in the grain boundaries seem to deteriorate the mechanical properties by decreasing cohesive strength in the grain boundaries and to promote the current density observed in electrochemical polarization curves, The electrochemical and mechanical properties of superaustenitic stainless steel decreased significantly in the specimen aged at $650^{\circ}C$ corresponding to the sensitization temperature for conventional austenitic stainless steels.