• Title/Summary/Keyword: thermal process

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Development of 2-inch Plastic Film STN LCD

  • Park, Sung-Kyu;Han, Jeong-In;Kim, Won-Keun;Kwak, Min-Gi
    • Journal of Information Display
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    • v.1 no.1
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    • pp.14-19
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    • 2000
  • Due to distinct properties of plastic substrates such as poor thermal resistance, non-rigidness and high thermal expansion, it is difficult to fabricate plastic film LCDs by conventional LCD processes. Poor thermal resistance and high thermal expansion of substrates induced deformation of substrates surface, mismatch of thermal expansion between ITO electrodes and substrates resulted in defects in the ITO electrodes during the high temperature process. Defects of ITO electrodes and non-uniform cell gap caused by non-rigid and flexible properties were also observed in the pressuring process. Based on in these observations, we used a newly developed material and fabrication process to prevent deformation of substrates, defects of electrodes and to maintain uniform cell gap. The maximum temperature of the process is limited up to $110^{\circ}C$ and pressure loaded during the process is five times less than conventional one. With these invented processes and materials, we obtained highly reliable Plastic Film STN LCDs whose electro-optical characteristics are better than or equivalent to those of typical glass LCDs.

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Study of Thermal Behaviors on sub-50 nm Copper Nanoparticles by Selective Laser Sintering Process for Flexible Applications (선택적 레이저 공정을 이용한 구리 나노 입자의 소결 특징 분석 및 플렉서블 전자 소자 제작 기술 개발에 관한 연구)

  • Gwon, Jin-Hyeong;Jo, Hyeon-Min;Lee, Ha-Beom;Eom, Hyeon-Jin;Go, Seung-Hwan
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.134-134
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    • 2016
  • The effect of different thermal treatments on the sub-50 nm copper nanoparticles is examined in the aspects of chemical, electrical and surface morphology. The copper nanoparticles are chemically synthesized and fabricated for paste-type solution. Simple bar coating method is practiced as a deposition process to form copper thin film on a typical slide glass. Deposited copper thin films are annealed by two different routes: general tube furnace with 99.99 % Ar atmosphere and selective laser sintering process. The thermal behavior of the different thermal-treated copper thin films is compared by SEM, XRD, FT-IR and XPS analysis. In this study, the laser sintering process ensures low annealing temperature, fast working speed and ambient-accessible route. Moreover, the laser-sintered copper thin film shows good electrical property and enhanced chemical stability than conventional thermal annealing process. Consequently, the proposed laser sintering process can be compatible with plastic substrate for flexible applications.

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A Study on the Influence of the Inclined Angle and Depth of the Substrate on Thermal and Residual Stress Characteristics in the Vicinity of the Repaired Region by a Directed Energy Deposition Process (기저부 경사각과 깊이가 에너지 제어형 용착 공정으로 보수된 영역의 열 및 잔류응력 특성에 미치는 영향 고찰)

  • Kim, Dan-A;Lee, Kwang-Kyu;Ahn, Dong-Gyu
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.6
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    • pp.50-59
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    • 2022
  • The design of the substrate significantly affects the thermal history and the residual stress formation in the vicinity of a repaired region by a directed energy deposition (DED) process. The occurrence of defects in the repaired region depends on the thermal history and residual stress formation. The objective of this study was to investigate the influence of the inclined angle and depth of the substrate on the thermal and residual stress characteristics in the vicinity of a repaired region by a DED process through two-dimensional finite element analyses (FEAs). The temperature and residual stress distributions in the vicinity of the repaired region were predicted according to the combination of the inclined angle and depth of the substrate. The effects of the inclined angle and depth on the depth of the heat affected zone and the maximum value of the residual stress were examined. A proper combination of the inclined angle and depth of the substrate was estimated to decrease the residual stress in the vicinity of the repaired region.

A Study on Thermal Analysis of Motorcycle Brake Disk (모터싸이클 브레이크 디스크의 열 해석에 관한 연구)

  • Ryu, Mi-Ra;Kim, Young-Hee;Byon, Sang-Min;Park, Heung-Sik
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.8 no.4
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    • pp.34-40
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    • 2009
  • The effect of frictional factors on thermal stress and deformation volume of motorcycle brake disk was studied by using a disk-on-pad type friction tester. It has an effect on the frictional factor such as applied load, sliding speed, sliding distance and number of ventilated disk hole. However, it is difficult to know the mutual relation of these factors. In this study, thermal stress and deformation volume by using design of experiment with 4 elements were investigated for thermal analysis with regression analysis. Thermal stress and thermal deformation are obtained by the application of temperature from mechanical test. From this study, the result showed that the motorcycle brake disk with ventilated hole 3 had the most excellent thermal stress and deformation volume. The regression equation had a trust rate of 95% for the prediction of thermal stress and deformation volume of motorcycle brake disk was composed.

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The Correlation of Thermal Analysis Model using Results of LEO Satellite Optical Payload's Thermal Vacuum Test (저궤도위성 광학탑재체의 열진공시험 결과를 이용한 열해석 모델 보정)

  • Kim, Min-Jae;Huh, Hwan-Il;Kim, Sang-Ho;Chang, Su-Young;Lee, Deog-Gyu;Lee, Seung-Hoon;Choi, Hae-Jin
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2010.11a
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    • pp.620-621
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    • 2010
  • Thermal models are made to verify the process that operate in space orbit. In this study, thermal analysis model correlation was performed to satisfy the criteria of correlation. Ground thermal vacuum test results are used for the correlation thermal model in the process of thermal model verification.

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Thermal Plasma Process for Producing Ultra-fine Powders (초미립 분말의 제조를 위한 열플라즈마 공정)

  • Oh, Seung-Min;Park, Dong-Wha
    • Applied Chemistry for Engineering
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    • v.16 no.3
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    • pp.305-311
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    • 2005
  • The thermal plasma process has excellent characteristics such as high temperature, high chemical activity and rapid quench, and has been applied to various fields. In this review, we briefly describe the characteristics for the process and the system components for producing ultra-fine powders including metal, ceramic, and composites. The key technology for the process will be discussed. We aimed to demonstrate the feasibility of the process for producing high quality ultra-fine powders using thermal plasma.

Effects of the in-process calibration from IR detector for thermal diffusivity measurement by laser flash method (레이저 섬광법에 의한 열확산계수 측정시 적외검출소자에서 실시간 온도보정이 미치는 영향)

  • 이원식;배신철
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.10 no.6
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    • pp.795-802
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    • 1998
  • For measuring the thermal diffusivity by laser flash method, raw data have to be calibrated using temperature data. We have developed in-process calibration method and polynomial calibration in which thermal diffusivity can be calibrated during measuring, This method is different from existing temperature pre-process calibration method and exponential calibration having various source of error. Using this new calibration method, measurement accuracy was improved about 1∼2% compare to the value by the existing method. We also studied more accurate fitting curve as in Figure 4 was shown the result of measuring output characteristics of IR radiometer with temperature. As illustrated in data, in-process calibration method and polynomial calibration equation is proper than pre-process calibration method and exponential calibration.

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Experiment and Numerical Study on Thermal Characteristics of UV-NIL Process Considering the Cure Kinetics of Photo-polymer (레진의 경화 반응을 고려한 UV-NIL공정의 열특성에 관한 실험 및 수치해석 연구)

  • Kim, Woo-Song;Park, Gyeong-Seo;Nam, Jin-Hyun;Yim, Hong-Jae;Jang, Si-Yeol;Lee, Kee-Sung;Jeong, Jay;Lim, Si-Hyeong;Shin, Dong-Hoon
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1847-1850
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    • 2008
  • The process conditions during ultraviolet nanoimprint lithography (UV-NIL) process such as temperature, stamping pressure, UV irradiation, etc. are effective factors for successful imprinting of complex and fine patterns. In this study, the effects of aluminum mold on the thermal characteristics of UV-NIL process were investigated through imprinting experiments and numerical simulations. The temperature of polymer resin on mold was measured to study thermal characteristics during UV curing. From the experimental and numerical results, the importance of curing reaction control for UV-NIL process was discussed for deformation characteristics.

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Tool life Evaluation of Hot Forging about Plastic Deformation and Wear (소성변형 및 마멸을 고려한 열간 단조 금형의 수명 평가)

  • 이현철;김동환;김병민
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.05a
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    • pp.163-168
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    • 2002
  • Hot forging is widely used in the manufacturing of industry machine component. The mechanical, thermal load and thermal softening which are happened by the high temperature in hot forging process. Tool life decreases considerably due to the softening of the surface layer of a tool caused by a high thermal load and long contact time between the tool and billet. Also, tool life is to a large extent limited by wear, heat crack and plastic deformation in hot forging process. These are one of the main factors affecting die accuracy and tool life. That is because hot forging process has many factors influencing tool life, and there was not accurate in-process data. In this research, life prediction of hot forging tool by wear and plastic deformation analysis considering tempering parameter has been carried out for automobile component. The new developed technique in this study for predicting tool life can give more feasible means to improve the tool life in hot forging process.

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Analysis of the Induction Heating for Moving Inductor Coil

  • Yun J.O.;Yang Young-Soo
    • Journal of Mechanical Science and Technology
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    • v.20 no.8
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    • pp.1217-1223
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    • 2006
  • Induction heating is a process that is accompanied with magnetic and thermal situation. This paper presents a simulation of a magneto-thermal coupled problem of an induction heating process for moving inductor coil. In the magnetic and thermal analyses, temperature-dependent magnetic and thermal material properties were considered. As the inductor coil moves in the process, solution domains corresponding to inductor changes into those of the air, and the solution domains of air change into those of the inductor. For these reasons, modeling of induction heating process is very difficult with general purpose commercial programs. In this paper, induction heating process for moving coil was simulated with the concept of traveling the position of the heating planes. Finite element program was developed and finite element results were compared with the experimental results.