• Journal of the Korean Society of Propulsion Engineers
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• v.20 no.4
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• pp.87-93
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• 2016

In a Direct Connect(DC) mode altitude engine test, a labyrinth seal is set up between an air intake duct and an engine. The labyrinth seal plays a key role in mechanically isolating them, which contributes to the accurate measurement of thrust and the other component forces. However, when high vertical temperature gradient is generated in the supplied air in the duct, the isolation breaks down. In this paper, a labyrinth seal control device is designed and installed in an effort to eliminate the issue. Test result shows the device successfully gets rid of the contact problem even when high vertical temperature gradient is produced.

• Smart Structures and Systems
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• v.23 no.3
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• pp.227-242
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• 2019

Seismic isolation systems employ structural control that protect both buildings and vibration-sensitive contents from destructive effects of earthquakes. Structural control is divided into three main groups: passive, active, and semi-active. Among them, semi-active isolation systems, which can reduce floor displacements and accelerations concurrently, has gained importance in recent years since they don't require large power or pose stability problems like active ones. However, their seismic performance may vary depending on the variations that may be observed in the mechanical properties of semi-active devices and/or seismic isolators. Uncertainties relating to isolators can arise from variations in geometry, boundary conditions, material behavior, or temperature, or aging whereas those relating to semi-active control devices can be due to thermal changes, inefficiencies in calibrations, manufacturing errors, etc. For a more realistic evaluation of the seismic behavior of semi-active isolated buildings, such uncertainties must be taken into account. Here, the probabilistic behavior of semi-active isolated buildings under historical pulse-like near-fault earthquakes is evaluated in terms of their performance in preserving structural integrity and protecting vibration-sensitive contents considering aforementioned uncertainties via Monte-Carlo simulations of 3-story and 9-story semi-active isolated benchmark buildings. The results are presented in the form of fragility curves and probability of failure profiles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.05a
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• pp.227-229
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• 1995

Using thermal oxide SiO$_2$ as a dielectrical isolation layer, SOI Hall sensors without pn junction isolation have been fabricated on Si/SiO$_2$/Si structures. The SOI structure was formed by SDB (Si- wafer direct bonding) technology. The Hall voltage and the sensitivity of Si Hall devices implemented on the SDB SOI structure show good linearity with respect to the appled magnetic flux density and supplied current. The product sensitivity of the SDB SOI Hall device is average 600V/V.T. In the trmperature range of 25 to 300$^{\circ}C$, the shifts of TCO(Temperature Coefficient of the Offset Voltage) and TCS(Temperature Coefficient of the Product Sensitivity) are less than ${\pm}$ 6.7x10$\^$-3/ C and ${\pm}$8.2x10$\^$04/$^{\circ}C$, respectively. These results indicate that the SDB SOI structure has potential for the development of Hall sensors with a high-sensitivity and high-temperature operation.

• Proceedings of the Korea Concrete Institute Conference
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• 1999.04a
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• pp.187-190
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• 1999

This study is intended to present the properites of planting concrete using the light-weight aggregate and crushed aggregate. According to the result of experiment, the concrete using orchid stone shows a better performance in voids volume, unit weight, absorbtion, thermal conductivity and pH, which are helpful for planting and heat isolation. Therefore, if planting concrete used with orchid stone are utilized to be the planting base on the building's roof, it will be effective to reduced the cost of construction and heating due to the redution of building's self weight and heat isolation effection.

• Journal of computational fluids engineering
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• v.20 no.3
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• pp.87-93
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• 2015

In this study, a numerical analysis was performed to simulate the thermal-hydraulic response of the secondary side of a steam generator(SG) model equipped with an orifice-type SG outlet flow restrictor to a main steam line break(MSLB) at a pressurized water reactor(PWR) plant. The SG analysis model includes the SG upper steam space and the part of the main steam pipe between the SG outlet and the broken pipe end. By comparing the numerical calculation results for the present SG model to those obtained for a simple SG model having no flow restrictor, the effects of the flow restrictor on the thermal-hydraulic response of SG to the MSLB were investigated.

• Molecular & Cellular Toxicology
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• v.2 no.3
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• pp.170-175
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• 2006

The extensive isolation of genes responsive to stressful conditions from a soft coral Scleronephthya gracillimum was described. Soft coral colonies were exposed to thermal and chemical stressors to induce the expression of stress related genes. Differentially expressed genes by natural or anthropogenic stressors were identified by construction of standard and stress exposed-paired subtractive cDNA library. Thirty-two and thirty-seven kinds of candidate genes were identified from thermal or benzo[a]pyrene stress exposed group, respectively, which are associated with cell cycle, cell signaling, transcription, translation, protein metabolism, and other cellular functions. The expected function of each gene was described. The isolated and identified differentially expressed genes have a great potential to identify environmental stressors in global environmental changes and could act as molecular biomarkers for biological responses against environmental changes. Finally, it may open a new paradigm on soft coral health assessment.

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.40-46
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• 2018

In this paper, we focus on optimization of a boron ($^{11}B$)-implanted n type Si epi substrate for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $125^{\circ}C$. The $^{11}B$-implantation on the N type-Si epi substrate formed isolation from the rest of the N-type Si by the depletion region of a PN junction. The TCR increased as the temperature of rapid thermal anneal (RTA) was increased at the temperature range from $900^{\circ}C$ to $1000^{\circ}C$ for the $p^+$ contact with implantation at dose of $1E16/cm^2$, but sheet resistance of this film was decreased. After the optimization of anneal process condition, the TCR of $1126.7{\pm}30.3$ (ppm/K) was obtained for the $p^-$ resistor-COB package chips contained $p^+$ contact with the implantation of $5E14/cm^2$. This shows the potential of the $^{11}B$-implanted n type Si epi substrate as a resistor for pressure sensor in thermal stable environment applications..

• Journal of Sensor Science and Technology
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• v.5 no.6
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• pp.51-59
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• 1996

A flow sensor has been fabricated by preparing thin film Pt-heater and Bi-Sb thermocouples array on 150 nm-$Si_{3}N_{4}$/300 nm-$SiO_{2}$/150 nm-$Si_{3}N_{4}$ dielectric diaphragm which has low thermal conductivity and balanced stress with silicon substrate for the purpose of improving the thermal isolation between heater and silicon substrate. Pt-heater showed nonlinear I-V characteristics due to the thermal isolation effect of the diaphragm. Its temperature coefficient of resistance was about $0.00378\;/^{\circ}C$ and Seebeck coefficient of Bi-Sb thermocouple was about $97\;{\mu}V/K$. The sensor showed that thermoelectric voltage decreased as thermal conductivity of gas increased, and flow sensitivity increased as heater voltage increased or as the distance between heater and thermocouple decreased. When heater voltage was about 2.5 V, $N_{2}$-flow sensitivity and thermal response time of the sensor were about $1.27\;mV{\cdot}(sccm)^{-1/2}$ and 0.13 sec., respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.99.1-99.1
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• 2016

The materials for an electronic packaging provide diverse important functions including electrical contact to transfer signals from devices, isolation to protect from the environment and a path for heat conduction away from the devices. The packaging materials composed of metals, ceramics, polymers or combinations are crucial to the device operating properly and reliably. The demand of effective charge and heat transfer continuous to be challenge for the high-speed and high-power devices. Nanomaterials including graphene, carbon nanotube and boron nitride, have been designed for the purpose of exploiting the high thermal, electrical and mechanical properties by combining in the matrix of metal or polymer. In addition, considering the inherent electrical and surface properties of graphene, it is expected that graphene would be a good candidate for the surface layer of a template in the electroforming process. In this talk, I will present recent our on-going works in nanomaterials for microelectronic packaging: 1) porous graphene/Cu for heat dissipations, 2) carbon-metal composites for interconnects and 3) nanomaterials-epoxy composites as a thermal interface materials for electronic packaging.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.24-30
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• 2002

본 글에서는 정밀 전자 소자등을 극저온으로 냉동시키는 데 필요불가결한 극저온 단열 기술에 대하여 간단히 알아보았다. 역사가 가장 오래되고 기본적인 진공 단열 기술로 시작하여, 공간에 고형의 물질을 삽입하는 다층 단열 기술과 분말 단열 기술에 대하여 토의하였다. 실제 응용시에는 요구되는 열적 성능과 경제적 제한 조건을 고려하여 가장 적합한 단열 방법을 선정하도록 하여야한다 또한 극저온 단열 용기의 실제 열해석 예로서 적외선 센서의 극저온 용기에 대한 정상 및 과도 열전달 해석에 대하여 간단히 기술하였다. 정상상태의 경우는 많은 경우 해석적인 해를 구할 수 있지만, 시간에 따라 온도가 변하는 과도 상태의 경우는 수치해석적인 방법이 요구된다. 열해석에서 일반적으로 쓰이는 유한차분법이 극저온 단열 용기의 열해석에도 유용하게 쓰일 수 있음을 보였다.