• Korean Journal of Materials Research
• /
• v.22 no.8
• /
• pp.390-396
• /
• 2012

Ag pastes added to Bi-oxide frits have been applied to the electrode material of Si solar cells. It has been reported that frits induce contacts between the Ag electrodes and the Si wafer after firing. During firing, the control of interfaces among Ag, the glass layer, and Si is one of the key factors for improving cell performance. Specifically, the thermo-physical properties of frits considerably influence Ag-Si contact. Therefore, the thermal properties of frits should be carefully controlled to enhance the efficiency of cells. In this study, the interface structures among Ag electrodes, glass layers, and recrystallites on an $n^+$ emitter were carefully analyzed with the thermal properties of lead-free frits. First, a cross-section of the area between the Ag electrodes and the Si wafer was studied in order to understand the interface structures in light of the thermal properties of the frits. The depth and area of the pits formed in the Si wafer were quantitatively calculated with the thermal properties of frits. The area of the glass layers between the Ag electrodes and Si, and the distribution of recrystallites on the $n^+$ emitter, were measured from a macroscopic point of view with the characteristics of the frits. Our studies suggest that the thermophysical properties should be controlled for the optimal performance of Si solar cells; our studies also show why cell performance deteriorated due to the high viscosity of frits in Ag pastes.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.7
• /
• pp.687-692
• /
• 2009

The friction welding of Zr-based bulk metallic glass (BMG) rods and tubes to similar BMGs, and to crystalline metals were performed. An infrared thermal imager (FLIR-Thermal Cam SC-2000) was used to measure the temperature distribution at joining interface of the specimens during friction welding. All BMGs adopted in this study showed a successful friction joining to similar BMG. The shape of the protrusion formed at the weld interface were examined. In order to characterize the friction weld interface, the micrographic observation and the X-ray diffraction analysis on the weld cross-section were carried out. The obtained results were discussed based on the temperature distribution measured at the weld interface A successful joining of the BMGs to crystalline metals could be obtained for certain pairs of the material combination through the precise control of the friction condition. The residual strength after dissimilar friction welding of BMG was evaluated by the four-point bending test and compared with the cases of friction welding to similar materials.

• Journal of the Korean Ceramic Society
• /
• v.43 no.4 s.287
• /
• pp.247-252
• /
• 2006

Joining Yittria Stabilized Zirconia (YSZ) to NiCr metal was fabricated using YSZ/NiCr Functionally Graded Materials (FGM) Interlayer by hot pressing process. Microscopic observations demonstrate that the composition and microstructure of YSZ/NiCr FGM distribute gradually in stepwise way, eliminating the macroscopic ceramic/metal interface such as that in traditional ceramic/metal joint. The thermal characteristics of this YSZ/FGM/NiCr joint were studied by thermal shock testing and therml barrier testing. Thermal shock test was conducted by gas burner rig. Acoustic Emission (AE) monitoring was performed to analyze the microfracture behavior during the thermal shock test. It could be confirmed that FGM was the excellent performance of thermal shock/barrier resistance at above $1000^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.8
• /
• pp.893-897
• /
• 2004

In this paper, we studied the mechanical and thermal properties on slice XLPE sheet from 22 kV and 154 kV power cables. Interface structures are XLPE/semiconductor and XLPE/water/semiconductor. We evaluated mechanical property, thermal analysis, moisture analysis. Based on mechanical and thermal properties of the 22 kV XLPE sheet, elongation, mechanical strength, and melting point were evaluated to be 485.48 %, 1.74 kgf/$\textrm{mm}^2$ and $102.48^{\circ}C$, respectively. It was also evaluated from the mechanical and thermal properties of 154 kV XLPE sheet that elongation, mechanical strength, and melting point are 507.81 %, 1.8 kgf/$\textrm{mm}^2$, $106.9^{\circ}C$, respectively. A region shows a rapid increase in tension strength, and B region only shows increase in elongation under 1.0 kgf/$\textrm{mm}^2$, C region shows increase in both elongation and tension strength. Difference of melting point came from the chain of XLPE polymer and the difference of crystallization. Moisture density of semiconductor showed 800 ∼ 1200 ppm before extrude, 14000 ∼24000 ppm after extrude. These values were higher than the moisture density of XLPE (300∼560) ppm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.3
• /
• pp.152-158
• /
• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.785-790
• /
• 2002

Distributions of residual stress in diffusion bonding of dissimilar materials intermetallics TiAl to steel 40Cr were simulated by FEM calculation. Results showed that destructive residual stresses presented in the minute area adjacent to bond-line of the base material with smaller coefficient of thermal expansion. Reducing bonding temperature and diminishing bonding time are in favor of the mollification of interface tresses.

• Transactions of Materials Processing
• /
• v.8 no.3
• /
• pp.289-289
• /
• 1999

This paper describes the investment casting of TiAl alloys. The effects of mold material and mold preheating temperature for the investment casting of TiAl on metal-mold interfacial reaction were investigated by means of optical micrography, hardness profiles and an electron probe microanalyzer. The mold materials examined were colloidal silica bonded ZrO₂, ZrSiO₄, A1₂O₃and CaO stabilized ZrO₂. When compared with conventional titanium a1loy, the high aluminum concentration of TiAl alloys helps to lower their reactivity in the molten state. The A1₂O₃mold is a promising mold material for the investment casting of TiAl in terms of the thermal stability, formability and cost. Special attention need to be paid to thermal stability and mold preheating when developing the investment calling of TiAl alloys.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.11a
• /
• pp.425-428
• /
• 1999

In this paper, the electrical properties of Pt/YMnO$_3$/Si(100) structures with difference rapid thermal annealing (RTA) treatment were investigated. YMnO$_3$films were obtained without buffer layers, introducing oxygen. A typical value of the dielectric constant was about 20 derived from 1MHz capacitance-voltage (C-V) measurement and the resistivity of the film at the field of 150kV/cm was about 1.34$\times$10$^{12}$ $\Omega$ . cm. The minimum interface state density around midgap was estimated to be about 5$\times$10$^{11}$ cm$^2$. eV.

• Journal of the Korean Ceramic Society
• /
• v.31 no.3
• /
• pp.321-329
• /
• 1994

Functionally gradient materials(FGM), which have the continuous or stepwise variation in a composition and microstructure, are being noticed as the material that solves problems caused by heterogeneous interface of coating or joining. And these materials also expect new functions occured by gradient composition itself. Therefore, to examine possibility of thermal barrier materials, TZP/Mo·FGM and TZP/Ni·FGM were fabricated by sintering method. As to the sintered specimens, sintering shrinkage, relative density and Vicker's hardness in each composition were examined. The phenomena due to the difference of sintering shrinkage velocity during sintering process and the thermal stress induced through differences of thermal expansion coefficient in FGM were discussed. And the structure changes at interface and microsturcture of FGM were investigated. As a results, the difference of shrinkage between ceramic and metal was about 14% in TZP/Mo and 7% in TZP/Ni. The relative density and hardness were considerably influenced by metal content changes. Owing to unbalance of sintering shrinkage velocity between ceramic and metal, various sintering defects were occured. To control these sintering defects and thermal stress, gradient composition of FGM should be narrow. The microstructure changes of FGM depended on the ceramic or metal volume percents and were analogous to the theoretical design.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.7 no.6
• /
• pp.117-125
• /
• 1998

The paper attempts to estimate the incubation time of a cavity in the interface between a power law creep particle and an elastic matrix subjected to a uniaxial stress. Since the power law creep particle is time dependent, the stresses in the interface relax. The volume free energy associated with Helmholtz free energy includes strain energies caused by applied stress and dislocations piled up in interface(DPI). The energy due to DPI is found by modifying the result of Dundurs and Mura[4]. The volume free energies caused by both applied stress and DPI are a function of the cavity size(r) and elapsed time(t) and arise from stress relaxation in the interface. Critical radius $r^*$ and incubation time $t^*$ to maximise Helmholtz free energy is found in present analysis. Also, kinetics of cavity formation are investigated using the results obtained by Riede [7]. The incubation time is defined in the analysis as the time required to satisfy both the thermodynamic and kinetic conditions. Through the analysis it is found that 1) strain energy caused by the applied stress does not contribute significantly to the thermodynamic and kinetic conditions of a cavity formation, 2) in order to satisfy both thermodynamic and kinetic conditions, critical radius $r^*$ decreases or holds constant with increase of the time until the kinetic condition(eq. 2.3) is satisfied. there for the cavity may not grow right after it is formed, as postulated by Harris [15], and Ishida and Mclean [16], 3) the effects of strain rate exponent (m), material constant $\sigma$0, volume fraction of the particle to matrix(f)and particle size on the incubation time are estimated using material constants of the copper as matrix.