• 제목/요약/키워드: thermal insulator

검색결과 296건 처리시간 0.076초

Kevlar/EPDM 고무계 내열재의 열반응 연구 (Study of Thermal Decomposition of Kevlar/EPDM)

  • 김연철;정상기;강윤구;이승구
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2010년도 제35회 추계학술대회논문집
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    • pp.257-260
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    • 2010
  • 고체 추진기관 연소관 내열재의 숯 및 삭마 두께를 예측하기 위한 방법을 제시하였다. 내열재 두께를 계산하기 위해서는 열 및 구조 경계조건을 정확히 알아야 한다. 제안된 방법은 연소관에서 복사, 대류 및 $Al_2O_3$ 조건에서 내열 고무의 열분해 현상을 규명하는데 매우 유용하다. 간단하고 빠르게 고무계 내열재를 초기에 설계하기 위하여 단순화된 수식 과 실험이 사용되었다. 연소관 후방 돔 부위의 숯 및 삭마 두께를 예측하는데 이용이 가능하며 실제 연소 시험을 통하여 적용 가능성을 확인하였다.

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탄성내열재 배합 환경에 따른 내열 성능 변화에 관한 연구 (A Study on the Thermal Protection Performance of Elastomeric Insulators in Different Mixing Environments)

  • 김남조;서상규;강윤구;고청아
    • 한국추진공학회지
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    • 제23권1호
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    • pp.108-115
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    • 2019
  • 고온 고압의 연소가스로부터 구조물을 보호하는 탄성내열재는 재료 조성 및 열환경 조건에 따라 열반응에 차이를 보인다. 본 논문에서는 탄성내열재의 배합 환경 변화에 따른 열반응 특성을 비교하였다. 탄성내열재의 내열 성능 시험은 내열고무성능평가장치(TPREM)를 이용하였으며, 연소실 압력 1,000 psig에서 연소가스속도를 각각 20 m/s과 100 m/s로 시험하였다. 연소실 압력-시간 선도, 재료 내부 온도-시간 선도, 탄성내열재 시편의 잔류 두께 및 열파괴두께를 획득하였다. 배합 환경에 따른 탄성내열재의 내열 성능은 유사하였다.

시뮬레이션에 의한 저장 벼의 곡온 예측 (Simulation of Temperature Changes of Rough Rice Stored in Round Steel Bin (I) - Development of a Simulation Model -)

  • 금동혁;김재열;김훈
    • Journal of Biosystems Engineering
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    • 제31권4호
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    • pp.355-362
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    • 2006
  • A one-dimensional heat conduction problem in cylindrical coordinate system was solved using Crank-Nicolson finite difference method to predicting the temperature distribution in rice storage bin with wall insulator. The model can simulate the grain temperatures in insulated round bins using the input data of initial grain temperature. ambient air temperature, wind velocity, solar radiation on a horizontal surface, and thermal properties of grain, bin wall, wall insulator, insulator cover, and air. Temperatures were collected at the bin center, 0.65m in radial direction from the center, and near the bin wall in 2.7m diameter bin filled with rough rice to depth of 3.0m were used to validate the simulation model. Grain temperatures predicted by the model were in very good agreement with the measured temperatures. The residual mean square error between measured and predicted grain temperatures at the bin center was $1.38^{\circ}C$.

로켓 노즐 내열부품용 탄소-페놀 복합재 적층링의 열기계적 거동에 대한 3차원 유한요소 해석 (3-D finite Element Analysis for Thermo-Mechanical Behavior of Laminated Carbon-Phenolic Composite Ring for Rocket Nozzle Insulator)

  • 이선표
    • 한국추진공학회지
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    • 제10권4호
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    • pp.47-53
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    • 2006
  • 본 논문에서는 탄소-페놀 복합재로 제조된 로켓 노즐 내열부품의 고온에서의 거동을 3차원 축대칭 유한요소 모델을 사용하여 해석하였다. 실제 작동 조건을 사용하여 카울 영역의 적층링을 해석한 결과 층각도, 축방향 치수, 경계조건은 적층링 내부의 응력 분포에 큰 영향을 주는 것으로 확인되었다. 특히 링과 링 사이의 접합부분에서 모서리 탈락 현상의 전조 현상인 층간분리가 발생한다. 분리현상 이후에는 층각도 방향 전단응력과 축방향 압축응력에 의해 탈락 현상이 발생하는 것으로 판단된다.

박막트랜지스터 게이트 절연막 응용을 위한 불화막 특성연구 (The Study of Fluoride Film Properties for TFT gate insulator application)

  • 김도영;최석원;이준신
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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    • pp.737-739
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    • 1998
  • Gate insulators using various fluoride films were investigated for thin film transistor applications. Conventional oxide containing materials exhibited high interface states, high $D_{it}$ gives an increased threshold voltage and poor stability of TFT. To improve TFT performances, we must reduce interface trap charge density between Si and gate insulator. In this paper, we investigated gate insulators such as such as $CaF_2$, $SrF_2$, $MgF_2$ and $BaF_2$. These materials exhibited an improvement in lattice mismatch, difference in thermal expansion coefficient, and electrical stability MIM and MIS devices were employed for an electrical characterization and structural property examination. Among the various fluoride materials, $CaF_2$ film showed an excellent lattice mismatch of 0.737%, breakdown electric field higher than 1.7MV/cm and leakage current density of $10^{-6}A/cm^2$. This paper probes a possibility of new gate insulator material for TFT application.

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고온용 정전기척의 유전층 개발에 관한 연구 (A Study on Development of Dielectric Layers for High-Temperature Electrostatic Chucks)

  • 방재철
    • 마이크로전자및패키징학회지
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    • 제8권3호
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    • pp.31-36
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    • 2001
  • 고온용 정전기척(high-temperature electrostatic chuck, HTESC)에 적합한 특성의 유전재료를 개발하였다. 유전층의 전기비저항과 유전상수 값은 HTESC가 적합하게 작동하기에 필요한 요구조건을 만족하였으며, 하부절연층재료와 열팽창계수가 유사하여 구조적인 안정성이 확보되었다. 유전층과 절연 층간의 접합층 재료로는 입자오염 문제의 최소화를 위해 붕규산염 유리재료를 선택하였고, 전극재료로는 은을 사용하였다. 상부유전 층과 하부절연층 사이에서 붕규산염 유리는 안정되게 접합되었으며, 우려 되었던 은전극의 유전층이나 유리층과의 확산 및 반응이 관찰되지 않았다. 제조된 HTESC의 척킹(chucking)특성은 상용 HTESC에 비하여 우수하게 나타났다.

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Pentacene Thin Film Transistors with Various Polymer Gate Insulators

  • Kim, Jae-Kyoung;Kim, Jung-Min;Yoon, Tae-Sik;Lee, Hyun-Ho;Jeon, D.;Kim, Yong-Sang
    • Journal of Electrical Engineering and Technology
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    • 제4권1호
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    • pp.118-122
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    • 2009
  • Organic thin film transistors with a pentacene active layer and various polymer gate insulators were fabricated and their performances were investigated. Characteristics of pentacene thin film transistors on different polymer substrates were investigated using an atomic force microscope (AFM) and x-ray diffraction (XRD). The pentacene thin films were deposited by thermal evaporation on the gate insulators of various polymers. Hexamethyldisilazane (HMDS), polyvinyl acetate (PVA) and polymethyl methacrylate (PMMA) were fabricated as the gate insulator where a pentacene layer was deposited at 40, 55, 70, 85, 100 oC. Pentacene thin films on PMMA showed the largest grain size and least trap concentration. In addition, pentacene TFTs of top-contact geometry are compared with PMMA and $SiO_2$ as gate insulators, respectively. We also fabricated pentacene TFT with Poly (3, 4-ethylenedioxythiophene)-Polysturene Sulfonate (PEDOT:PSS) electrode by inkjet printing method. The physical and electrical characteristics of each gate insulator were tested and analyzed by AFM and I-V measurement. It was found that the performance of TFT was mainly determined by morphology of pentacene rather than the physical or chemical structure of the polymer gate insulator

SOI 웨이퍼의 열적거동 해석 (Thermal Behaviors Analysis for SOI Wafers)

  • 김옥삼
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2000년도 춘계학술대회 논문집(Proceeding of the KOSME 2000 Spring Annual Meeting)
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    • pp.105-109
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    • 2000
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

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창호 및 단열재 변수에 따른 공동주택 에너지효율등급 평가 사례 (A Study on the Evaluation of Apartment Building Energy Efficiency Rating Considering the Performance of Thermal Insulators and Window glasses)

  • 김한수;윤해동;변운섭
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2009년도 하계학술발표대회 논문집
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    • pp.706-711
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    • 2009
  • Energy shortage and environmental pollution caused by fossil fuels are very serious problem. Especially buildings have consumed more and more energy, and buildings are spend up to 25% of total energy consumption. So we should prepare alternatives to save energy in buildings. In apartment houses, The efficiency of thermal insulators and window glasses is very important to curtail heating energy. In this study, the energy rating of Apartment building is evaluated by applying various thermal insulators and window glasses.

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알루미나계 자기애자의 장기 피로특성에 관한 연구 (Study on Long-term Deterioration Properties of Porcelain Insulators with Aluminous System)

  • 한세원;조한구;이동일;최인혁
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.562-563
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    • 2005
  • In case of aged porcelain, the failure in basic performance tests happened in cool-heat tests. Based on this characteristic, we studied the method predicting failure phenomena through more severe accelerated cool-heat ageing and accelerating thermal mechanical performance tests. Test results indicated that the thermal stress by temperature gradient was more severe parameter than thermal stress by quenching cycles within a category of standard or accelerating methods. And there is no the deterioration of statistic strength, but the deterioration of strength according to accelerating tests is serious.

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