• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.257-260
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• 2010

The purpose of this paper is to introduce a method to predict the case thermal insulation charred and erosion thickness as a function of the exposure time to combustion gases and in solid rocket motors. The sizing of the insulator requires a good estimation of the thermal and mechanical loads at the wall. The method is particularly suitable for internal insulation areas subjected to high radiative, convective heat fluxes and $Al_2O_3$ slag pool. The mathematical approach and lab-scale experiment were intentionally simplified in order to obtain some simple and rapid relationships particularly useful for trade-off studies and thermal insulation preliminary design. The method was utilized to compute the charred and erosion thicknesses of the insulation on the aft chamber domes. A comparison between theoretical and experimental insulator char thicknesses of the motor insulation is reported, indicating the applicability of the predictive method employed.

• Journal of the Korean Society of Propulsion Engineers
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• v.23 no.1
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• pp.108-115
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• 2019

The thermal response of elastomeric insulators used as protection against high-temperature and high-pressure combustion gases varies depending on their composition and thermal environment conditions. In this paper, the thermal response characteristics of elastomeric insulators in different mixing environments were compared. Tests to determine thermal protection performance were carried out using a thermal protection rubber evaluation motor(TPREM), combustion gas velocities of 20 m/s and 100 m/s were tested at a chamber pressure of 1,000 psig. The pressure time curve of the chamber, the temperature time curve of the internal materials, the residual thickness and the thermal destruction depth of the test specimens were obtained. The results showed that the thermal protection performance of elastomeric insulators in different mixing environments was similar.

• Journal of Biosystems Engineering
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• v.31 no.4 s.117
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• pp.355-362
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• 2006

A one-dimensional heat conduction problem in cylindrical coordinate system was solved using Crank-Nicolson finite difference method to predicting the temperature distribution in rice storage bin with wall insulator. The model can simulate the grain temperatures in insulated round bins using the input data of initial grain temperature. ambient air temperature, wind velocity, solar radiation on a horizontal surface, and thermal properties of grain, bin wall, wall insulator, insulator cover, and air. Temperatures were collected at the bin center, 0.65m in radial direction from the center, and near the bin wall in 2.7m diameter bin filled with rough rice to depth of 3.0m were used to validate the simulation model. Grain temperatures predicted by the model were in very good agreement with the measured temperatures. The residual mean square error between measured and predicted grain temperatures at the bin center was $1.38^{\circ}C$.

• Journal of the Korean Society of Propulsion Engineers
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• v.10 no.4
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• pp.47-53
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• 2006

In this paper, the thermal insulator structure of a real rocket which is fabricated in a way that laminated composite rings are connected in series is analyzed using 3-dimensional axisymmetric finite element models. Simulation of cowl zone using a real operating conditions provides that the stress distribution in the laminated composite ring is largely influenced by ply-angles, axial dimensions, and boundary conditions. Notably the plylift that is the precursor to the wedge-out occurs in the ring-to-ring bonding region. It is hypothesized that after the plylift the wedge is dropped out due to the shear stresses in the ply-angle direction and axial compressive stresses.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.737-739
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• 1998

Gate insulators using various fluoride films were investigated for thin film transistor applications. Conventional oxide containing materials exhibited high interface states, high $D_{it}$ gives an increased threshold voltage and poor stability of TFT. To improve TFT performances, we must reduce interface trap charge density between Si and gate insulator. In this paper, we investigated gate insulators such as such as $CaF_2$, $SrF_2$, $MgF_2$ and $BaF_2$. These materials exhibited an improvement in lattice mismatch, difference in thermal expansion coefficient, and electrical stability MIM and MIS devices were employed for an electrical characterization and structural property examination. Among the various fluoride materials, $CaF_2$ film showed an excellent lattice mismatch of 0.737%, breakdown electric field higher than 1.7MV/cm and leakage current density of $10^{-6}A/cm^2$. This paper probes a possibility of new gate insulator material for TFT application.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.31-36
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• 2001

Dielectric material which is suitably designed for the application of the high-temperature electrostatic chucks(HTESCS) has been developed. Electrical resistivities and dielectric constants of the dielectric layer satisfy the demands for the proper operation of HTESC, and coefficient of thermal expansion(CTE) of the dielectric material matches well that of the bottom insulator so that it secures stable structure. In order to minimize particle contaminations, borosilicate glass(BSG) is selected as a bonding layer between dielectric layer and bottom insulator, and silver is used as a electrode. BSG is solidly bonded between upper dielectric and bottom insulator, and no diffusions or reactions are observed among silver electrode, dielectric, and glass layers. The chucking characteristics of the fabricated HTESC are found to be superior to those of the commercialized one.

• Journal of Electrical Engineering and Technology
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• v.4 no.1
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• pp.118-122
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• 2009

Organic thin film transistors with a pentacene active layer and various polymer gate insulators were fabricated and their performances were investigated. Characteristics of pentacene thin film transistors on different polymer substrates were investigated using an atomic force microscope (AFM) and x-ray diffraction (XRD). The pentacene thin films were deposited by thermal evaporation on the gate insulators of various polymers. Hexamethyldisilazane (HMDS), polyvinyl acetate (PVA) and polymethyl methacrylate (PMMA) were fabricated as the gate insulator where a pentacene layer was deposited at 40, 55, 70, 85, 100 oC. Pentacene thin films on PMMA showed the largest grain size and least trap concentration. In addition, pentacene TFTs of top-contact geometry are compared with PMMA and $SiO_2$ as gate insulators, respectively. We also fabricated pentacene TFT with Poly (3, 4-ethylenedioxythiophene)-Polysturene Sulfonate (PEDOT:PSS) electrode by inkjet printing method. The physical and electrical characteristics of each gate insulator were tested and analyzed by AFM and I-V measurement. It was found that the performance of TFT was mainly determined by morphology of pentacene rather than the physical or chemical structure of the polymer gate insulator

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2000.05a
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• pp.105-109
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• 2000

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.706-711
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• 2009

Energy shortage and environmental pollution caused by fossil fuels are very serious problem. Especially buildings have consumed more and more energy, and buildings are spend up to 25% of total energy consumption. So we should prepare alternatives to save energy in buildings. In apartment houses, The efficiency of thermal insulators and window glasses is very important to curtail heating energy. In this study, the energy rating of Apartment building is evaluated by applying various thermal insulators and window glasses.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.562-563
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• 2005

In case of aged porcelain, the failure in basic performance tests happened in cool-heat tests. Based on this characteristic, we studied the method predicting failure phenomena through more severe accelerated cool-heat ageing and accelerating thermal mechanical performance tests. Test results indicated that the thermal stress by temperature gradient was more severe parameter than thermal stress by quenching cycles within a category of standard or accelerating methods. And there is no the deterioration of statistic strength, but the deterioration of strength according to accelerating tests is serious.