• Title/Summary/Keyword: thermal emitter

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IGBT의 열 특성에 관한 연구 (Study on Thermal Characteristics of IGBT)

  • 강이구;안병섭;남태진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.70-70
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    • 2009
  • In this paper, we proposed 2500V Non punch-through(NPT) Insulated gate bipolar transistor(IGBT) for high voltage industry application. we carried out optimal simulation for high efficiency of 2500V NPT IGBT according to size of device. In results, we obtaind design parameter with 375um n-drift thickness, 15um gate length, and 8um emitter windows. After we simulate with optimal parameter, we obtained 2840V breakdown voltage and 3.4V Vce,sat. These design and process parameter will be used designing of more 2000V NPT IGBT devices.

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실리콘에서 깊은 접합의 형성을 위한 알루미늄의 확산 모델 (Diffusion Model of Aluminium for the Formation of a Deep Junction in Silicon)

  • 정원채
    • 한국전기전자재료학회논문지
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    • 제33권4호
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    • pp.263-270
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    • 2020
  • In this study, the physical mechanism and diffusion effects in aluminium implanted silicon was investigated. For fabricating power semiconductor devices, an aluminum implantation can be used as an emitter and a long drift region in a power diode, transistor, and thyristor. Thermal treatment with O2 gas exhibited to a remarkably deeper profile than inert gas with N2 in the depth of junction structure. The redistribution of aluminum implanted through via thermal annealing exhibited oxidation-enhanced diffusion in comparison with inert gas atmosphere. To investigate doping distribution for implantation and diffusion experiments, spreading resistance and secondary ion mass spectrometer tools were used for the measurements. For the deep-junction structure of these experiments, aluminum implantation and diffusion exhibited a junction depth around 20 ㎛ for the fabrication of power silicon devices.

Recent Advances in Passive Radiative Cooling: Material Design Approaches

  • Heegyeom Jeon;Youngjae Yoo
    • Elastomers and Composites
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    • 제59권1호
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    • pp.22-33
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    • 2024
  • Passive radiative cooling is a promising technology for cooling objects without energy input. Passive radiative cooling works by radiating heat from the surface, which then passes through the atmosphere and into space. Achieving efficient passive radiative cooling is mainly accomplished by using materials with high emissivity in the atmospheric window (8-13 ㎛). Research has shown that polymers tend to exhibit high emissivity in this spectral range. In addition to elastomers, other materials with potential for passive radiative cooling include metal oxides, carbon-based materials, and polymers. The structure of a passive radiative cooling device can affect its cooling performance. For example, a device with a large surface area will have a greater amount of surface area exposed to the sky, which increases the amount of thermal radiation emitted. Passive radiative cooling has a wide range of potential applications, including building cooling, electronics cooling, healthcare, and transportation. Current research has focused on improving the efficiency of passive radiative cooling materials and devices. With further development, passive radiative cooling can significantly affect a wide range of sectors.

An Investigation on Gridline Edges in Screen-Printed Crystalline Silicon Solar Cells

  • Kim, Seongtak;Park, Sungeun;Kim, Young Do;Kim, Hyunho;Bae, Soohyun;Park, Hyomin;Lee, Hae-Seok;Kim, Donghwan
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.490.2-490.2
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    • 2014
  • Since the general solar cells accept sun light at the front side, excluding the electrode area, electrons move from the emitter to the front electrode and start to collect at the grid edge. Thus the edge of gridline can be important for electrical properties of screen-printed silicon solar cells. In this study, the improvement of electrical properties in screen-printed crystalline silicon solar cells by contact treatment of grid edge was investigated. The samples with $60{\Omega}/{\square}$ and $70{\Omega}/{\square}$ emitter were prepared. After front side of samples was deposited by SiNx commercial Ag paste and Al paste were printed at front side and rear side respectively. Each sample was co-fired between $670^{\circ}C$ and $780^{\circ}C$ in the rapid thermal processing (RTP). After the firing process, the cells were dipped in 2.5% hydrofluoric acid (HF) at room temperature for various times under 60 seconds and then rinsed in deionized water. (This is called "contact treatment") After dipping in HF for a certain period, the samples from each firing condition were compared by measurement. Cell performances were measured by Suns-Voc, solar simulator, the transfer length method and a field emission scanning electron microscope. According to HF treatment, once the thin glass layer at the grid edge was etched, the current transport was changed from tunneling via Ag colloids in the glass layer to direct transport via Ag colloids between the Ag bulk and the emitter. Thus, the transfer length as well as the specific contact resistance decreased. For more details a model of the current path was proposed to explain the effect of HF treatment at the edge of the Ag grid. It is expected that HF treatment may help to improve the contact of high sheet-resistance emitter as well as the contact of a high specific contact resistance.

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화학적 산화막을 이용한 에미터 패시베이션에 관한 연구 (Emitter passivation using chemical oxidation)

  • 부현필;강민구;김영도;이경동;박효민;탁성주;박성은;김동환
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.76.2-76.2
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    • 2010
  • 질산 용액을 이용한 처리를 통해서 실리콘 웨이퍼 위에 누설 전류가 thermal oxidation 방법과 비슷한 수준의 얇은 실리콘 산화막을 형성할 수 있다. 이러한 처리 방법은 thermal oxidation에 비해서 낮은 온도에서 공정이 가능하다는 장점을 가진다. 이 때 질산 용액으로 68 wt% $HNO_3$을 쓰는데, 이 용액에만 넣었을 때에는 실리콘 산화막이 어느 정도 두께 이상은 성장하지 않는 단점이 있다. 그렇기 때문에 실리콘 웨이퍼를 68 wt% $HNO_3$에 넣기 전에 seed layer 산화막을 형성 시킨다. 본 연구에서는 p-type 웨이퍼를 phosphorus로 도핑해서 에미터를 형성 시킨 후에 seed layer를 형성 시키고 68 wt% $HNO_3$를 이용해서 에미터 위의 실리콘 산화막을 성장 시켰다. 이 때 보다 더 효과적인 seed layer를 형성 시키는 용액을 찾아서 실험하였다. 40 wt% $HNO_3$, $H_2SO_4-H_2O_2$, HCl-$H_2O_2$ 용액에 웨이퍼를 10분 동안 담그는 것을 통해서 seed layer를 형성하고, 이를 $121^{\circ}C$인 68 wt% $HNO_3$에 넣어서 실리콘 산화막을 성장시켰다. 이렇게 형성된 실리콘 산화막의 특성은 엘립소미터, I-V 측정 장치, QSSPC를 통해서 알아보았다.

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Application of Carbon Nanotubes in Displays

  • Feng, T.;Sun, Z.;Zhang, Z.J.;Lin, L.F.;Ding, Hui.;Chen, Y.W.;Pan, L.K.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.1529-1531
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    • 2008
  • Since the discovery over a decade ago, carbon nanotubes (CNTs) have been attracting considerable attentions both from scientists and engineers. Because of the excellent field emission properties, such as high aspect ratio, extremely small diameter, and high emission current, CNTs become a potential candidate as field emitter for field emission display (FED) and lighting (FEL) as backlight for LCD. Due to the exceptional physical properties, such as superior thermal and electrical conductivities, as well as high stiffness and strength, the CNT-based composites can be as light-weight heat-sink or thermal spreader materials used for power electronic devices, such as power LED for general illumination. The CNTs for above applications will be reviewed, and related materials and devices will be demonstrated in this paper.

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Synthesis and Design of Electroactive Polymers for Improving Efficiency and Thermal Stability in Organic Photovoltaics

  • 김범준
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.11.2-11.2
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    • 2011
  • Polymer based organic photovoltaics have attracted a great deal of attention due to the potential cost-effectiveness of light-weight and flexible solar cells. However, most BHJ polymer solar cells are not thermally stable as subsequent exposure to heat drives further development of the morphology towards a state of macrophase separation in the micrometer scale. Here we would like to show three different approaches for developing new electroactive polymers to improve the thermal stability of the BHJ solar cells, which is a critical problem for the commercialization of these solar cells. For one of the examples, we report a new series of functionalized polythiophene (PT-x) copolymers for use in solution processed organic photovoltaics (OPVs). PT-x copolymers were synthesized from two different monomers, where the ratio of the monomers was carefully controlled to achieve a UV photo-crosslinkable layer while leaving the ${\pi}-{\pi}$ stacking feature of conjugated polymers unchanged. The crosslinking stabilizes PT-x/PCBM blend morphology preventing the macro phase separation between two components, which lead to OPVs with remarkably enhanced thermal stability. The drastic improvement in thermal stabilities is further characterized by microscopy as well as grazing incidence X-ray scattering (GIXS). In the second part of talk, we will discuss the use of block copolymers as active materials for WOLEDs in which phosphorescent emitter isolation can be achieved. We have exploited the use of triarylamine (TPA) oxadiazole (OXA) diblock copolymers (TPA-b-OXA), which have been used as host materials due to their high triplet energy and charge-transport properties enabling a balance of holes and electrons. Organization of phosphorescent domains in TPA-b-OXA block copolymers is demonstrated to yield dual emission for white electroluminescence. Our approach minimizes energy transfer between two colored species by site isolation through morphology control, allowing higher loading concentration of red emitters with improved device performance. Furthermore, by varying the molecular weight of TPA-b-OXA and the ratio of blue to red emitters, we have investigated the effect of domain spacing on the electroluminescence spectrum and device performance.

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Fabrication of Vertically Aligned GaN Nanostructures and Their Field Emission Property

  • 조종회;김제형;조용훈
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.281-281
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    • 2014
  • The field emission properties of GaN are reported in the present study. To be a good field emitter, it requires a low work function, high aspect ratio, and strong mechanical stability. In the case of GaN, it has a quite low work function (4.1eV) and strong chemical/mechanical/thermal stabilities. However, so far, it was difficult to fabricate vertical GaN nanostructures with a high aspect ratio. In this study, we successfully achieved vertically well aligned GaN nanostructures with chemical vapor-phase etching methods [1] (Fig. 1). In this method, we chemically etched the GaN film using hydrogen chloride and ammonia gases at high temperature around $900^{\circ}C$. This process effectively forms vertical nanostructures without patterning procedure. This favorable shape of GaN nanostructures for electron emitting results in excellent field emission properties such as a low turn-on field and long term stability. In addition, we observed a uniform fluorescence image from a phosphor film attached at the anode part. The turn-on field for the GaN nanostructures is found to be about $0.8V/{\mu}m$ at current density of $20{\mu}A$/cm^2. This value is even lower than that of typical carbon nanotubes ($1V/{\mu}m$). Moreover, threshold field is $1.8V/{\mu}m$ at current density of $1mA$/cm^2. The GaN nanostructures achieved a high current density within a small applied field range. We believe that our chemically etched vertical nanostructures are the promising structures for various field emitting devices.

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실리사이드를 이용한 새로운 고내구성 실리콘 전계방출소자의 제작 (Fabrication of New Silicided Si Field Emitter Array with Long Term Stability)

  • 장지근;윤진모;정진철;김민영
    • 한국재료학회지
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    • 제10권2호
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    • pp.124-127
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    • 2000
  • Si FEA로부터 tip의 표면을 Ti 금속으로 silicidation한 새로운 3극형 Ti-silicided Si FEA를 제작하고 이의 전계 방출특성을 조사하였다. 제작된 소자에서 단위 pixel(pixel area : $1000{\mu\textrm{m}}{\times}1000{$\mu\textrm{m}}$, tip array : $200{\mu\textrm{m}}{\times}200{$\mu\textrm{m}}$)을 통해 측정된 전계 방출 특성은 $10^8Torr$의 고진공 상태에서 turn-on 전압이 약 70V로, 아노드 방출전류의 크기와 current degradation이 $V_A=500V,\;V_G=150V$ 바이어스 아래에서 각각 2nA/tip와 0.3%/min로 나타났다. 3극형 Ti-silicided Si FEA의 낮은 turn-on 전압과 높은 전류안정성은 Si tip 표면에 형성된 실리사이드 박막의 열화학적 안정성과 낮은 일함수에 기인하는 것으로 판단된다.

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Co-실리사이드를 이용한 새로운 고내구성 실리콘 전계방출소자의 제작 (Fabrication of New Co-Silicided Si Field Emitter Array with Long Term Stability)

  • 장지근;김민영;정진철
    • 한국재료학회지
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    • 제10권4호
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    • pp.301-304
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    • 2000
  • Si FEA로 부터 tip의 표면을 Co 금속으로 silicidation한 새로운 3극형 Co-silicided Si FEA를 제작하고 이의 전계 방출특성을 조사하였다. $10^{-8}Torr$의 고진공상태에서 제작된 소자의 단위 pixel(pixel 면적 : $250{\mu\textrm{m}}{\times}250{\mu\textrm{m}}$, tip 어레이 : $45{\times}45$)를 통해 측정된 turn-on 전압은 약 35V로, 아노드 전류는 $V_A=500V,\;V_G=55V$ 바이어스 아래에서 약 $1.2{\mu\textrm{A}}(0.6nA/tip)$로 나타났다. 제작된 소자는 초기 과도상태를 제외하면 장시간의 동작을 통해 전계방출 전류의 감소없이 매우 안정된 전기적 특성을 나타내었다. Co-silicided Si FFA 의 낮은 turn-on 전압과 높은 전류안전성은 Si tip 표면에 형성된 실리사이드 박막의 열화학적 안전성과 낮은 일함수에 기인하는 것으로 판단된다.

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