• Journal of Energy Engineering
• /
• v.24 no.2
• /
• pp.84-90
• /
• 2015

Hydrogen has some remarkably high values of the key properties for transport processes, such as kinematic viscosity, thermal conductivity and diffusion coefficient. Hydrogen, as an energy medium, has some distinct benefits for its high efficiency and convenience in storage, transportation and conversion. Hydrogen has much wider limits of flammability in air than methane, propane or gasoline and the minimum ignition energy is about an order of magnitude lower than for other combustibles. Statistical thermodynamics provides the relationships that we need in order to bridge this gap between the macro and the micro. Our most important application will involve the calculation of the thermodynamic properties of the ideal gas.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.53 no.6
• /
• pp.293-299
• /
• 2004

In this paper, thermal and mechanical properties of electric epoxy with water aging were discussed. We made elastic epoxy specimen adding a ratio of 0〔phr〕20〔phr〕, 35〔phr〕 and 53〔phr〕 with modifier to existing epoxy. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hours. As a result, diffusion factor of elastic epoxy showed 20-21${\times}$10$^{-4}$ $\textrm{mm}^2$/s and general epoxy showed 9.5${\times}$10$^{-4}$ $\textrm{mm}^2$/s. Elastic property increased linearly according to addiction and decreased according to water absorption. Tensile strength was reduced according to addition. It was affected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time. In water-absorption state, it was experimented a change of heat flow by temperature of elastic epoxy and change of thermal expansion coefficient. DSC (Differential Scanning Calorimetry) and TMA (Thermomechanical Analysis) equipments were used to measure Tg. A temperature ringe of DSC was from -0($^{\circ}C$) to 200($^{\circ}C$). One of TMA was from -0($^{\circ}C$) to 350($^{\circ}C$). In addition, we investigated structural analysis of water absorbed specimen using SEM (Scanning Electron Microscope).

• Korean Journal of Materials Research
• /
• v.1 no.4
• /
• pp.221-228
• /
• 1991

In this study we have investigated the sealing characteristics of glasses suitable for producing the magnetic gap of the ferrite head cores which have been widely used for VTR and computer magnetic heads. $PbO-B_2O_3$ g1asses were evaluated by measuring microhardness, thermal expansion coefficient and sliding wear resistance. Concentration distribution of elements at the interface was observed by WDS. wettability was measured by high temperature microscopy. The results were as follows ; 1. In sealing glasses of $PbO-B_2O_3$ system, thermal expansion coefficient and wear volume were increased with increasing PbO content, and were decreased with increasing $B_2O_3$ content. 2. The contact angle of $PbO-B_2O_3$ Systems was mainly influenced by PbO content. 3. The sealing temperature showed a tendency to decrease proportionally with the increase of the coefficient of thermal expansion. 4. The diffusion at the interface between Mn-Zn single crystal ferrite and sealing glasses of $PbO-B_2O_3$ system was dominated by small amount of diffusion of ferrite content into glass part, which was very little affected by sealing heat treatment time.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2000.04a
• /
• pp.131-134
• /
• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• Transactions of the KSME C: Technology and Education
• /
• v.1 no.2
• /
• pp.179-186
• /
• 2013

Far-infrared radiation therapies are becoming more popular for blood circulation disorders, cardiovascular disease, skin diseases, inhibit cancer cell, etc replacing conventional operations. In this research, thermal characteristics of heating part in panel radiators, which is effective on the blood circulation disorders were experimentally analyzed. The heating line supplies heat energy to insulation coatings with heat flux of $150mW/m^2$ in normal status and as a result the coatings reached 20% of the heating line temperature. In other words, the insulation itself could increase surface temperature of heating plates by 20% and raise thermal time constant promote blood circulation effect. We also found that space arrangement of the heating lines was an important factor in designing heating parts and both coefficient of heat conduction and density of the heating plate should be also considered for superimpose of thermal diffusion.

• Journal of Sensor Science and Technology
• /
• v.29 no.1
• /
• pp.27-32
• /
• 2020

This study proposes a pixel-patterning method for organic light-emitting diodes (OLEDs) based on thermal transfer. An infrared lamp was introduced as a heat source, and glass type donor element, which absorbs infrared and generates heat and then transfers the organic layer to the substrate, was designed to selectively sublimate the organic material. A 200 nm-thick layer of molybdenum (Mo) was used as the lightto-heat conversion (LTHC) layer, and a 300 nm-thick layer of patterned silicon dioxide (SiO₂), featuring a low heat-transfer coefficient, was formed on top of the LTHC layer to selectively block heat transfer. To prevent the thermal oxidation and diffusion of the LTHC material, a 100 nm-thick layer of silicon nitride (SiN_x) was coated on the material. The fabricated donor glass exhibited appropriate temperature-increment property until 249 ℃, which is enough to evaporate the organic materials. The alpha-step thickness profiler and X-ray reflection (XRR) analysis revealed that the thickness of the transferred film decreased with increase in film density. In the patterning test, we achieved a 100 ㎛-long line and dot pattern with a high transfer accuracy and a mean deviation of ± 4.49 ㎛. By using the thermal-transfer process, we also fabricated a red phosphorescent device to confirm that the emissive layer was transferred well without the separation of the host and the dopant owing to a difference in their evaporation temperatures. Consequently, its efficiency suffered a minor decline owing to the oxidation of the material caused by the poor vacuum pressure of the process chamber; however, it exhibited an identical color property.

• Korean Journal of Materials Research
• /
• v.11 no.4
• /
• pp.305-311
• /
• 2001

$PbO-B_2O_3-SiO_2-Al_2O_3$, system was investigated for optical, thermal and electrical properties of transparent dielectric. We also studied the reaction between transparent dielectric and transparent electrode(Indium Tin Oxide, ITO) during firing. For the evaluation of properties, dielectrics were prepared under the conditions fired at 520~58$0^{\circ}C$ with 12$\mu\textrm{m}$ thickness. In the reaction between dielectrics and electrode(ITO), In ions diffused into dielectric layer, while Sn ion diffusion was not observed. The coefficient of thermal expansion, the dielectric constant, the glass transition temperature and the transmittance of the dielectric were greatly dependent on PbO content. The increase of the coefficient of thermal expansion and the dielectric constant were monitored by increasing PbO, while the glass transition temperature and the transmittance were decreased. With the increased $Al_2O_3/B_2O_3$ ratio, the coefficient of thermal expansion and the transmittance were decreased, while the dielectric constant was increased. The glass transition temperature did not change significantly.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.3
• /
• pp.67-74
• /
• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.694-699
• /
• 2002

In autobody assembly, thin-wall, tubular connections have been used for the frame structure. Recent interest in light materials, such as aluminum or magnesium alloys, has been rapidly growing for weight reduction and fuel efficiency. Due to higher thermal expansion coefficient, low stiffness/strength, and low softening temperature of aluminum and magnesium alloys, control of welding-induced distortion in these connections becomes a critical issue. In this study, the material sensitivity to welding distortion was investigated using a T-tubular connection of three types materials; low carbon steel (A500 Gr. A), aluminum alloy (5456-H116) and magnesium alloy (AZ91C-T6). An uncoupled thermal and mechanical finite element analysis scheme using the ABAQUS software program was developed to model and simulate the welding process, welding procedure and material behaviors. The predicted angular distortions were correlated to the cumulative plastic strains. A unique relationship between distortion and plastic strains exists for all three materials studied. The amount of distortion is proportional to the magnitude and distribution of the cumulative plastic strains in the weldment. The magnesium alloy has the highest distortion sensitivity, followed by the other two materials with the steel connection having the least distortion. Results from studies of thin-aluminum plates show that welding distortion can be minimized by reducing the cumulative plastic strains by preventing heat diffusion into the base metal using a strong heat sink placed directly beneath the weld. A rapid cooling method is recommended to reduce welding distortion of magnesium tubular connections.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.31 no.1
• /
• pp.32-36
• /
• 2021

This study was investigated in carbon diffusion behavior of laser-carburized TiZrN coating layer and the changes of mechanical properties. The carbon paste was deposited on TiZrN coatings, and the laser was irradiated to carburize into the coatings. The XRD peak corresponding to the (111) plane shifted to a lower angle after the carburization, showing the lattice expansion by doped carbon. The decreased grain size implied the compression by the grain boundary diffusion of carbon. The XPS spectra for the bonding states of carbon was analyzed that carbon was substitute to nitrogen atoms in TiZrN, as carbide, through the thermal energy of laser. In addition, the combination of sp2 and sp3 hybridized bonds represented the formation of an amorphous carbon. The cross-sectional TEM image and the inverse FFT of the TiZrN coating after carburizing were observed as the wavy shape, confirming the amorphous phase located in grain boundaries. After the carburization, the hardness increased from 34.57 GPa to 38.24 GPa, and the friction coefficient decreased by 83 %. In particular, the ratio of hardness and elastic modulus (H/E) which is used as an index of the elastic recovery, increased from 0.11 to 0.15 and the wear rate improved by 65 %.