• 한국세라믹학회지
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• 제54권4호
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• pp.314-322
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• 2017

This study investigates changes in the mechanical behavior, such as changes in indentation load-displacement curve, wear resistance and contact fatigue resistance of thermal barrier coatings (TBCs) by thermal cycling test and thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/superalloy are prepared; the highest temperature applied during thermal durability test is $1350^{\circ}C$. The results indicate that the porous TBCs have relatively longer lifetime during thermal cycling and thermal shock tests, while denser TBCs have relatively higher wear and contact fatigue resistance. The mechanical behavior is influenced by sintering of the TBCs by exposure to high temperature during tests.

• 한국전기전자재료학회논문지
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• 제20권5호
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• pp.443-449
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• 2007

The structural and thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ electrode during cycling process was studied. The sample was prepared by simple combustion method. Although there were irreversible changes on the initial cycle, O3 stacking for $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ structure was retained during the first and subsequent cycling process. Impedance of the test cell was decreased after the first charge-discharge process, which would be of benefit to intercalation and deintercalation of lithium ion on subsequent cycling. As expected, cycling test for 75 times increased impedance of the cell a little, instead, thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ was improved. Moreover, based on DSC analysis, the initial exothermic peak was shifted to high temperature range and the amount of heat was also decreased after cycling test, which displayed that thermal stability was not deteriorated during cycling.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.27-32
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• 2002

In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• 한국재료학회지
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• 제19권5호
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• The Journal of Advanced Prosthodontics
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• 제11권5호
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• pp.297-304
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• 2019

PURPOSE. This in vitro study investigated the repair bond strength of the zirconia ceramic after different aging conditions. MATERIALS AND METHODS. In order to imitate the failure modes of veneered zirconia restorations, veneer ceramic, zirconia, and veneer ceramic-zirconia specimens were prepared and were divided into 4 subgroups as: control ($37^{\circ}C$ distilled water for 24 hours ) and 3000, 6000, 12000 thermal cycling groups (n=15). Then, specimens were bonded to composite resin using a porcelain repair kit according to the manufacturer recommendation. The repair bond strength (RBS) test was performed using a universal testing machine (0.5 mm/min). Failure types were analyzed under a stereomicroscope. Two-way ANOVA and Bonferroni test were used for statistical analysis. RESULTS. The RBS values of zirconia specimens were statistically significant and higher than veneer ceramic and veneer ceramic-zirconia specimens in control, 3000 and 6000 thermal cycling groups (P<.05). When 12000 thermal cycles were applied, the highest value was found in zirconia specimens but there was no statistically significant difference between veneer ceramic and veneer ceramic-zirconia specimens (P>.05). Veneer ceramic specimens exhibited cohesive failure types, zirconia specimens exhibited adhesive failure types, and veneer ceramic-zirconia specimens exhibited predominately mixed failure types. CONCLUSION. Thermal cycling can adversely affect RBS of composite resin binded to level of fractured zirconia ceramics.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.415-419
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• 2004

Thermal barrier systems are susceptible to instability of the thermally grown oxide(TGO) at the interface between the bond coat(BC) and the thermal barrier coating(TBC). The instabilities have been linked to thermal cycling and initial geometrical imperfections, as well as to misfit strains due to oxide growth and expansion misfit. In this work, deformation of TGO near a surface groove due to thermal cycling has been observed at high temperatures, $1100^{circ}C$, $1150^{circ}C$, $1200^{circ}C$. The effect of peak temperature and the thickness of substrate are presented.

• 한국안전학회지
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• 제20권2호
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• pp.1-5
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• 2005

An experimental study was conducted to develop an understanding of failure of ceramic coating when subjected to a thermal cycling. Number of cycles to failure were decreased as the coating thickness and the oxide of bond coat were increased. Using the finite element method, an analysis of stress distribution in ceramic coatings was performed. Radial compressive stress was increased in the top/bond coat interface with increasing coating thickness and oxide of bond coat.

• 천문학회보
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• 제36권2호
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• pp.156-156
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• 2011

VPH (Volume Phase Hologram) grating is one of the transmission gratings and is known as its remarkable efficiency (>90%). It has two different densities of gelatins causing interference patterns. The VPH grating is favored in many astronomical instruments these days and also IGRINS, which is up coming near infrared high-resolution spectroscope expected to see the first light next year, uses the VPH grating as its cross-disperser. The infrared astronomical instruments operate at cryogenic temperature (~100K) in order to cut down thermal noise and the optical components of IGIRNS will be operated at 130K. The VPH grating is sandwiched in between fused silica or glass and glued together using optical adhesive. IGRINS is expected to go through 50 times of thermal cycling in 10 years including the performance test and this research is to check whether the physical characteristic such as the adhesion or dichromatic gelatin does not break and change from the several cryogenic thermal cycling. The two identical test gratings provided from Kaiser Optical System, Inc. are used in this test. One VPH grating is cooled down to 100K for 2 hours with maximum dT/dt = 5 and warmed up to the room temperature and another grating is kept stored in the room temperature and used as a control sample. In order to check the change, we inspected the grating with eyes and checked its efficiency and transmission at the room temperature every 10 cycling. From the 40 times of cryogenic temperature cool down cycling, the VPH grating showed no signs of change within the error compared to the control sample. We concluded the VPH grating is durable through several cryogenic thermal cycling.

• 대한소아치과학회지
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• 제26권4호
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• pp.677-687
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• 1999

본 연구에서는 구강환경과 유사한 액상의 조건하에서의 온도변화가 광중합형 글래스아이오노머계 수복재의 인장강도에 미치는 영향을 평가하기 위해 대조군으로 2종의 재래형 glass ionomer를 선택하고 실험군으로 2종의 광중합형의 resin-modified glass ionomer와 2종의 polyacid-modified resin composite을 선택한 다음 수중에서의 thermal cycling과 시효처리를 행하였으며, 다음과 같은 결론을 얻었다. 1. 글래스아이오노머 수복재의 인장강도를 측정한 결과, polyacid-modified resin composite, resin-modified glass ionomer 그리고 재래형 glass ionomer 의 순으로 나타났다. 2. 인장강도는 30일간의 시효처리로 증가되는 경향을 보였다. 3. 재래형 glass ionomer 수복재의 인장강도는 thermal cycling 처리로 증가되는 경향을 보였으며, $37^{\circ}C$의 증류수 중에 1시간 침적한 군과 10,000회의 thermal cycling을 비교한 결과 유의한 차이로서 강도의 증가를 나타냈다(P<0.01). 4. thermal cycling 군의 인장강도는 DR군이 45.4MPa로 최대치를, FL군이 13.4MPa로 최소치를 나타냈으며, 각 군간의 통계적 유의성을 검증한 결과 polyacid-modified resin composite의 인장강도가 나머지 군과 유의한 차이를 보였다(p<0.05). 5. 특성강도는 DR군이 48.6MPa로 가장 높은 강도치를 보였으나 Weibull 계수는 CG군이 8.9로 가장 높은 값을 보여 시험재료 중에서 가장 작은 강도의 분산을 나타냈다.

• 한국주조공학회지
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• 제10권5호
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• pp.399-407
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• 1990

The effect of thermal cycling and isothermal exposure on the high temperature microstructural stability of unidirectionally solidified $Al-CuAl_2$ eutectic composite has been studied. A coarsening procedures of lamellar eutectic structures were initiated at growth fault region because of diffusion through low angle boundary at this region. It was considered that thermally induced residual stresses produced by thermal cycling were high enough to increase the dislocation density in Al-rich matrix phase. However, it was also considered that dislocations generated by these high thermal stresses were annihilated at high temperature by stress relaxation. Consequently, the thermal cycling up to 1440 cycles between 20 and $520^{\circ}C$ did not affect the microstructural stability.