• Korean Chemical Engineering Research
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• 제46권2호
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• pp.389-396
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• 2008

벤조시클로부텐(benzocyclobutene; BCB)과 플라즈마 화학기상증착(PECVD)된 산화규소막이 코팅된 웨이퍼들 사이의 계면에서, 고온 열순환 공정에 의한 잔류응력 및 본딩 결합력의 효과를 4점 굽힙시험법과 웨이퍼 곡률 측정법에 의해 평가하였다. 이를 위해 웨이퍼들은 사전에 확립된 표준 본딩공정에 의거하여 본딩하였으며 이들 웨이퍼에 대한 열순환 공정은 상온으로부터 최대 순환온도 사이에서 수행하였다. 최대 온도 350 및 $400^{\circ}C$에서 수행한 열순환 공정에서, 본딩 결합력은 첫번째 순환공정 동안 크게 증가하는 데, 이는 순환공정 시 발생하는 산화규소막의 축합 반응에 의한 잔류응력 감소 때문인 것으로 분석되었다. 이러한 산화규소막의 잔류응력이 감소함에 따라 BCB와 산화규소막으로 구성된 다층막의 잔류응력에 의해 변형되는 에너지는 상승하였고 따라서 BCB와 산화규소막 사이 다층막의 의 본딩 결합력은 증가하였다.

• Restorative Dentistry and Endodontics
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• 제46권4호
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• pp.54.1-54.10
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• 2021

Objectives: The purpose of this study was to quantify phase transformation after hydrofluoric acid (HF) etching at various concentrations on the surface of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP), and to evaluate changes in bonding strength before and after thermal cycling. Materials and Methods: A group whose Y-TZP surface was treated with tribochemical silica abrasion (TS) was used as the control. Y-TZP specimens from each experimental group were etched with 5%, 10%, 20%, and 40% HF solutions at room temperature for 10 minutes. First, to quantify the phase transformation, Y-TZP specimens (n = 5) treated with TS, 5%, 10%, 20% and 40% HF solutions were subjected to X-ray diffraction. Second, to evaluate the change in bond strength before and after thermal cycling, zirconia primer and MDP-containing resin cement were sequentially applied to the Y-TZP specimen. After 5,000 thermal cycles for half of the Y-TZP specimens, shear bond strength was measured for all experimental groups (n = 10). Results: The monoclinic phase content in the 40% HF-treated group was higher than that of the 5%, 10%, and 20% HF-treated groups, but lower than that of TS-treated group (p < 0.05). The 40% HF-treated group showed significantly higher bonding strength than the TS, 5%, and 10% HF-treated groups, even after thermal cycling (p < 0.05). Conclusions: Through this experiment, the group treated with SiO₂ containing air-borne abrasion on the Y-TZP surface showed higher phase transformation and higher reduction in bonding strength after thermal cycling compared to the group treated with high concentration HF.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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• pp.25-30
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• 2011

In this paper, we analyzed the electrical characteristics with Micro-cracks in Photovoltaic module. Micro cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. And The solar cells have to with stand the stress under out door operation in the finished module. Here the mechanical stress is induced by temperature changes and mechanical loads from wind and snow. So, we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because micro-cracks accelerated aging by thermal cycling test, according to IEC61215. Before every test, we checked output and EL image of PV module. As the result of first step, we detected little power loss(0.9%). But after thermal cycling test increased power loss about 3.2%.

• 마이크로전자및패키징학회지
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• 제10권1호
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• pp.45-50
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• 2003

시스템 보드에 플립 칩 BGA가 실장된 3차원 유한요소 해석 모델을 구성하여 열사이클시험 과정에서 발생되는 솔더 접합부의 피로수명을 예측하였다. 피로 모델은 Darveaux의 경험식에 기초하여 비선형 점소성 해석을 수행하였다. 해석은 4종류의 열사이클시험 조건과 패드구조, 솔더 볼의 조성과 크기의 변화에 따라 발생하는 크리프 수명을 평가하였다. 해석결과 $-65∼150^{\circ}C$의 열사이클시험 조건에서 가장 짧은 피로수명을 보였으며, $0∼100^{\circ}C$ 조건과 비교하면 약 3.5 배 정도 증가하였다. 동일한 시험조건에서 패드구조 변화에 따른 피로수명 차이는 SMD구조가 NSMD구조에 비해 약 5.7% 증가하였다 결과적으로 솔더 접합부에서 크리프 변형에너지 밀도가 높으면 피로수명은 짧아지는 것을 알 수 있었다

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.1-4
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• 2009

본 연구에서는 실리콘 웨이퍼에 2중 다이싱 공정의 적용이 리드-온-칩 패키지로 조립되는 반도체 디바이스의 T.C. ($-65^{\circ}C$에서 $150^{\circ}C$까지의 온도변화에 지배되는 신뢰성 실험) 신뢰성에 어떠한 영향을 미치는 지를 보여준다. 기존 싱글 다이싱 공정은 웨이퍼에서 분리된 디바이스의 테두리 부위가 다이싱으로 인해 기계적으로 손상되는 결과를 보였으나, 2중 다이싱 공정은 분리된 디바이스의 테두리 부위가 거의 손상되지 않고 보존되는 것을 확인할 수 있었다. 이는 2중 다이싱의 경우 다이싱 동안 웨이퍼의 전면에 도입된 노치부위가 선택적으로 파손되면서 분리된 디바이스의 테두리 부위를 보호하기 때문으로 해석된다. 온도변화 실험을 통해 2중 다이싱 공정의 도입이 단일 다이싱 공정에 비해 T.C. 신뢰성에서도 대단히 좋은 결과를 보인다는 것을 확인할 수 있었다.

• 대한금속재료학회지
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• 제46권8호
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• pp.538-544
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• 2008

MMCs were manufactured in two different forms. One was two-layered non FGM composite and the other was four-layered FGM composite. The matrix used in this study was AZ31 magnesium alloy and the reinforcement was $Al_{18}B_4O_{33}$. The composite materials contained reinforcement fibers with a volume fraction of 0, 15, 25 and 40%. Squeeze infiltration method was used for the fabrication of each block. The thermal properties of the FGM alloy and composite joints were studied by conducting thermal cycling tests. The numerical calculation (the finite elements method-FEM) results exhibited a good agreement with the experimental results. Thermal stresses induced by thermal cycling test were clearly reduced in the functionally graded materials.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.131-133
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• 2003

The effect of axial strain and thermal cycling on the critical current is investigated for the Bi-2223/Ag PIT tapes. The axial strain was applied to the tapes by the U-shape sample holder. Two kinds of Bi-2223/Ag tapes with different Ag sheath are used to know the effect of sheath alloying for the tensile strain. The influence of thermal cycling between room temperature and 77 K on critical current are examined. Critical current is drastically decreased for Ag/alloy and Ag/alloy/alloy sheathed tapes at tensile strain above 0.22％ and 0.3％, respectively.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1740-1743
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• 2007

In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• 한국수소및신에너지학회논문집
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• 제9권3호
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• pp.111-118
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• 1998

The intrinsic degradation behavior of $(V_{0.53}Ti_{0.47})_{0.925}Fe_{0.075}$ alloy with BCC structure and the two plateau regions (the low and high plateau region) has been investigate during the temperature-induced hydrogen absorption-desorption cycling (thermal cycling). After 400 thermal cycles between room temperature and $600^{\circ}C$ under 10atm $H_2$, the total reversible hydrogen absorption capacity decreased by about 40%. From thermal desorption analysis it was found that the degradation behavior at each plateau region was different. In addition, XRD analysis showed that the crystal structure of the sample in de-hydrided state was changed from BCC to BCT after degradation, and that of the sample in hydrided state it was maintained as FCC although peaks were broadened after degradation. From the result of static isothermal hydrogenation treatment it were found that crystal structure change from BCC to BCT was caused by the thermal energy. TEM analysis showed that the peak broadening was due to the formation of an amorphous phase in FCC matrix.