• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.502-508
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• 2005

Hypereutectic Al-Si alloys have been regarded attractive for automotive and aerospace application, due to high specific strength, good wear resistance, high thermal stability, low thermal expansion coefficient and good creep resistance. Spray casting of hypereutectic Al-Si alloy has been reported to provide distinct advantages over ingot metallurgy (IM) or rapid solidification/powder metallurgy (RS/PM) process in terms of microstructure refinement. In this study, hypereutectic Al-25Si-2.0Cu-1.0Mg alloy was prepared by OSPREY spray casting process. The change of strain rate sensitivity and Creep transition were analyzed by using the load relaxation test and constant creep test. High temperature deformation behavior of the hypereutectic Al-Si alloy has been investigated by applying the internal variable theory proposed by Chang et al. Especially, the creep resistance of spray casted hypereutectic Al-Si alloy can be enhanced considerably by the accumulation of prestrain.

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.45-53
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• 1998

A method to predict the creep behavior of fiber-reinforced ceramic composites at high temperatures was suggested based on finite element modeling using constituent creep equations of fiber and matrix and showed good agreement with the experimental results. The effects of matrix creep behavior, fiber volume fraction, and residual stresses on the composite creep behavior were also investigated. The results showed that the primary behavior of composites was greatly affected by that of matrix but post-primary behavior was governed by fiber creep characteristics. The increase of fiber volume fraction from 15 vol% to 30 vol% caused the 50% and 40% decrease of steady-state creep rates and total creep strains at $1200^{\circ}C$, 180MPa, respectively. Feasible compressive residual stresses in the matrix caused by different thermal expansion coefficients between the fiber and the matrix could significantly reduce total creep strains of the composite. The creep deformation mechanism in the fiber-reinforced ceramic composites could be explained by the stress transfer and redistribution in the fiber and matrix due to different creep characteristics of its constituents.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1992.10a
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• pp.67-72
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• 1992

The heat of hydration of cement causes the internal temperature rise at early age, particulary in massive concrete structures such as a footing of nuclear reactor building or a dam. As the result of the temperature rise and restraint of foundation, the thermal stress may induce cracks in concrete. Therefore, the prediction of the thermal stress is very important in the design and construction stages in order to control the cracks developed in massive concrete structures. And, in case of young concrete, creep effect by the temperature load is larger than That of old concrete. Thus the effect of creep must be considered for checking the cracks, serviceability, durability and leakage. This study is composed of two items. The first, it is to develop a finite element program which is capable of simulating the temperature history in mass concrete. The second, when the thermal stress of mass concrete structures considering creep is calculated by using the modified elastic modulus due to the inner temperature change. It is shown that the analytical results of this study is in comparably good agreement with JCI's analytical results.

• Computers and Concrete
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• v.16 no.6
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• pp.897-908
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• 2015

This article gives analytical dependences for creep of concrete at heating, taking into account conditions of its drying. These dependences are based on the standard nonlinear theory of creep of concrete at a normal temperature and temperature-time analogy. For the description of creep at various stresses and temperatures the principle of superposition are used. All stages of model's creation are confirmed by the existing experimental data. Calculation examples are given.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.45-50
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• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.54-61
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• 2002

Inconel 690 alloy has widely been used in power plant and high temperature facilities because it has high thermal resistance and toughness. But we have little design data about the creep behaviors of the alloy. Therefore, in this study, an apparatus has been designed and built for conducting creep tests under constant load conditions. A series of creep tests on Inconel 690 alloy have been performed to get the basic design data and life prediction of inconel products and we have gotten the following results. First, the stress exponents decrease as the test temperatures increase. Secondly, the creep activation energy gradually decreases as the stresses become bigger. thirdly, the constant of Larson-Miller Parameters on this alloy is estimated about 10. And last the fractographs at the creep rupture show both the ductile and the brittle fracture according to the creep conditions.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.9
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• pp.78-85
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• 2010

Creep characteristic is an important failure mechanism when evaluating engineering materials that are soft material as polymers or used as mechanical elements at high temperatures. One of the popular thermo-elastic polymers, Polycarbonate(PC) which is used broadly for engineering polymer, as it has excellent mechanical and thermal properties compared to other polymers, was studied for creep characteristic at various level of stresses and temperatures. From the experimental results, the creep limit of PC at room temperature is 85 % of tensile strength. which is higher than PE (75%)at room temperature. Also the creep limits decreased exponentially as the temperatures increased, up to 50 % of the melting point($267^{\circ}C$). Also the first and third stage among the three creep stages was non-existent nor was there any rupture failure which occurred for many metals.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.12
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• pp.1403-1410
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• 2011

Creep characteristic is an important failure mechanism when evaluating engineering materials that are soft material as polymers or used as mechanical elements at high temperatures. One of the popular thermo-elastic polymers, Polymethyl methacrylate(PMMA) which is used broadly for engineering polymer, as it has excellent mechanical and thermal properties compared to other polymers, was studied for creep characteristic at various level of stresses and temperatures. From the experimental results, the creep limit of PMMA at room temperature is 85 % of tensile strength. which is higher than that of PE (75%)at room temperature. Also the creep limits decreased to nil linearly as the temperatures increased, up to $120^{\circ}C$ of the melting point($267^{\circ}C$). Also the first and third stage among the three creep stages were non-existent nor were there any rupture failure which occurred for many metals at high temperatures.

• Journal of the Korean Society of Safety
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• v.24 no.2
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• pp.17-22
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• 2009

Thermal stress and elastic creeping stress analysis was conducted by finite element method to simulate start-up process of a boiler header of 500MW standard fossil power plant. Start-up temperature and operating pressure history were simplified from the real field data and they were used for the thermal stress analysis. Two kinds of thermal stress analysis were considered. In the first case only temperature increase was considered and in the second case both of temperature and operating pressure histories were considered. In the first analysis peak stress was occurred during the temperature increase from the room temperature. Hence cracking or fracture may occur at the temperature far below the operating maximum temperature. In the results of the second analysis von Mises stress appeared to be higher after the second temperature increase. This is due to internal pressure increase not due to the thermal stress. When the stress components of radial(r), hoop($\theta$) and longitudinal(z) stress were investigated, compression hoop stress was occurred at inner surface of the stub tube when the temperature increased from room temperature to elevated temperature. Then it was changed to tension hoop stress and increased because of the operating pressure. It was expected that frequent start-up and shut-down operations could cause thermal fatigue damage and cracking at the stub tube hole in the header. Elastic-creeping analysis was also carried out to investigate the stress relaxation due to creep and stabilized stress after considerable elapsed time. The results could be used for assessing the creep damage and the residual life of the boiler header during the long-tenn service.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.