• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.1006-1010
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• 2017

This paper describes the design and test of the thermal control and fire safety system for thermal control and the fire/explosion prevention of inside the compartment during the preparation and operation of the space launch vehicle at the launch pad. The system considered here is for the test launch vehicle which is being developed as part of the development of the Korean Space launch vehicle-II. This system applies the high pressure system based on the heritage of Naro launch vehicle. The selection of thermal control and fire safety system from high pressure and low pressure system is done in consideration of the characteristics of the launch pad gas supply system and the characteristics of launch vehicle, and the system configuration is also changed accordingly. As a result, it has been confirmed that the developed system satisfies the initial design conditions through the test. Moreover the system will be applied to the development of the Korean launch vehicle in the future.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of Biosystems Engineering
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• v.37 no.1
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• pp.19-27
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• 2012

Purpose: Utilizing air thermal energy during over-heated time in the greenhouse is a necessary component to save greenhouse heating costs for nighttime. However, there is no practical way to implement the related principles. Methods: In this study, a heating and cooling system which utilizes the surplus air thermal energy in a greenhouse was developed. Available air thermal energy and heating load for this experimental glasshouse were estimated based on temperature conditions of the plant growth and weather data. Results: Estimated values were 400 MJ/day for maximum surplus air thermal energy and 340 MJ/day for maximum heating energy which were target values of the design as well. The system consists of a heat pump, fan-coil units and heat storage tanks which are divided into low and high temperature tanks. Moreover, a new control logic was developed for surplus air thermal energy utilization. Conclusions: This paper explains the details of conceptual design process of the system. Results of test operations showed that the developed system performed the recovery and supply of the thermal energy according to design purposes.

• 한국전산유체공학회:학술대회논문집
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• 2007.04a
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• pp.153-158
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• 2007

Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.3
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• pp.237-242
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• 2012

Spaceborne pulse tube-type cryogenic compressors are widely used for space applications. To guarantee cooling performance of the compressor, mission life time and micor-vibration stability, suitable thermal control of compressor is required. Micro-vibration of the compressor is the one of the sources to degrade the pointing performance of observation satellite. In the present work, on-orbit thermal design of compressor in order not to degrade the performance of micro-vibration isolation system keeping the thermal control performance has been proposed and investigated through thermo-mechanical analysis.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.52 no.4
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• pp.147-153
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• 2003

This paper describes the finite element analysis(FEA) for the design of electromagnet for Control Element Drive Mechanism(CEDM) in System-integrated Modular Advanced Reactor(SMART) and compared with the lifting power characteristics of prototype electromagnet. A thermal analysis was performed for the electromagnet. A model for the thermal analysis of the electromagnet was developed and theoretical bases for the model were established. It is important that the temperature of the electromagnet windings be maintained within the allowable limit of the insulation. since the electromagnet of CEDM is always supplied with current during the reactor operation. So the thermal analysis of the winding insulation which is composed of polyimide and air were performed by finite element method. As a result, it is shown that the characteristics of prototype electromagnet have a good agreement with the results of FEA. The thermal properties obtained here will be used as input for the optimization analysis of the electromagnet.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2606-2611
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• 2003

Comprehensive study on the control system design for a RTP process has been conducted. The purpose of the control system is to maintain maximum temperature uniformity across the silicon wafer achieving precise tracking for various reference trajectories. The study has been carried out in two stages: thermal balance modeling on the basis of a semi-empirical radiation model, and optimal iterative learning controller design on the basis of a linear state space model. First, we found through steady state radiation modeling that the fourth power of wafer temperatures, lamp powers, and the fourth power of chamber wall temperature are related by an emissivity-independent linear equation. Next, for control of the MIMO system, a state space modeland LQG-based two-stage batch control technique was derived and employed to reduce the heavy computational demand in the original two-stage batch control technique. By accommodating the first result, a linear state space model for the controller design was identified between the lamp powers and the fourth power of wafer temperatures as inputs and outputs, respectively. The control system was applied to an experimental RTP equipment. As a consequence, great uniformity improvement could be attained over the entire time horizon compared to the original multi-loop PID control. In addition, controller implementation was standardized and facilitated by completely eliminating the tedious and lengthy control tuning trial.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.8
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• pp.798-804
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• 2009

A high-resolution electro-optical camera system, EOS-C, is under development in Satrec Initiative. This system is the mission payload of a 400-kg Earth observation satellite. We designed this system to give improved opto-mechanical and thermal performance compared with a similar camera system to be flown on the DubaiSat-1 system. The thermal control subsystem (TCS) of the EOS-C system uses heaters to meet the opto-mechanical requirements during in-orbit operation and it uses different thermal coating materials and multi-layer insulation (MLI) blankets to minimize the heater power consumption. We performed its thermal analysis for the mission orbit using a thermal analysis model and the result shows that its TCS satisfies the design requirements.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.11
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• pp.1008-1015
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• 2015

Thermal vacuum test should be performed prior to launch to verify satellites' functionality in extremely cold/hot temperatures and vacuum conditions. A thermal vacuum chamber used to perform the thermal vacuum tests of a satellite system and its components. A cryogenic blower is a core component of the gaseous nitrogen (GN2) closed loop thermal control system for thermal vacuum chambers. A final goal of this research is development of cryogenic blower. Design requirements of a blower are 150 CFM flow rate, 0.5 bara pressure difference, hot and cold temperatures. This paper describes the performance analysis of impeller by 1D, CFD commercial software, the design of the thermal protection interface between the driving part and the fluid part. The performance of the cryogenic blower is confirmed by test at the standard air condition and is verified by on the thermal vacuum chamber at the real operating condition.