• 한국CDE학회논문집
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• 제9권4호
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권2호
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• pp.76-82
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• 2005

In this paper, a method for analyzing the thermal recovery characteristics of the nozzle of gas circuit breaker was described. In order to obtain thermal recovery characteristics, the transient simulation of SF6 arc plasma within the nozzle was carried out. In particular, the nozzle ablation was taken into account by simultaneously solving the PTFE concentration equation with the governing equations such as continuity, momentum and energy equation. After that, post arc current calculation was performed with the rate of rise of recovery voltage changed. From the calculated post arc current, it was possible to suggest the thermal recovery characteristics of the nozzle of gas circuit breaker.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제54권11호
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• pp.527-532
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• 2005

During the last ten years the new interruption techniques, which use the arc energy itself to increase the pressure inside a chamber by the PTFE nozzle ablation, have displaced the puffer circuit breakers due to reduced driving forces and better maintainability. In this paper, we have investigated the thermal flow characteristics inside a thermal puffer type gas circuit breaker by solving the Wavier-Stokes equations coupled with Maxwell's equations for considering all instabilities effects such as turbulence and Lorentz forces by transient arc plasmas. These relative inexpensive computer simulations might help the engineer research and design the new interrupter in order to downscale and uprating the GIS integral.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2006년도 전력전자학술대회 논문집
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• pp.254-256
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• 2006

A Novel way to support typical Thermal Shut Down(TSD) circuit is proposed. In power ICs, on-time or on-duration is the key factor to anticipate an abrupt increase of internal temperature. Such an abrupt raise of the temperature can cause TSD circuit cannot protect on proper time due to the temperature detection delay come from the physical distance or the imperfect coupling between heat sources and detector. The proposed circuit checks the duty ratio touched their maximum or not in every cycle. Once duty ratio touches the maximum duty, new circuit generates the warning signal to the TSD circuit and lowers pre-determined temperature for shut down to compensate the detection delay. The novel circuit will be analyzed to the transistor level and checked the validity by simulation.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.1063-1066
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• 2002

An equivalent circuit for the superconductor flux flow transistor(SFFT) was combined with high temperature cooling device, based on the analogy between thermal and electrical variables using the high-temperature superconductor(HTS), is proposed. The device is composed of parallel weak links with a nearby magnetic control line. A model has been developed that is based on solving the equation of motion of Abrikosov vortices subject to Lorentz viscous and pinning forces as well as magnetic surface barriers. The use of thermal models the global performance of thermal cooling circuit and signal system to be checked by using electrical circuit analysis programs such as SPICE.

• 전기학회논문지
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• 제57권1호
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• pp.46-51
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• 2008

Extra-high voltage(EHV) disconnecting switch(DS) consists of the electrical contacts and mechanical parts which actuate the contacts. When the short-circuit condition occurs, a large amount of current flows through the electrical contact in disconnecting switches and this causes considerable temperature rise due to Joule heating. If the temperature rise is higher than the melting point of contact material, the DS contact becomes melting and cannot be usable anymore. For this reason, the analysis for capability of carrying short-circuit current in DS contacts must be performed at a design stage. Here, we proposed a numerical technique for evaluating the capability of carrying short-circuit current at electrical contacts in EHV DS. In this numerical approach, the mechanical and thermal analyses were simulated to check the capability of carrying short-circuit current. First, the applied pressure at contact parts was analyzed considering the mechanical properties, and then contact resistance was calculated by an empirical equation. Finally, thermal analysis was performed with resistance variation at electrical contacts. To verify these numerical results, the distributions of temperature in DS were experimentally measured and compared with each other. The results from experiments were agreed well with those from the proposed numerical simulations.

• 대한기계학회논문집
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• 제12권3호
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• pp.528-533
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• 1988

본 연구에서는 피스톤의 온도분포 및 열변형을 유한요소법에 의해 분석할 경 우 입력 데이타로 주어질 경계조건은 Li가 사용한 열저항 회로법을 근거로 하여 여기 에 경험치를 부여하는 방법으로 초기 설정치를 구하고, 또 전해질 탱크 상사법에 의한 실험적인 방법으로 결과를 구하여서 두 결과를 비교 검토하고자 한다.

• Journal of Welding and Joining
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• 제13권2호
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Journal of Electrical Engineering and Technology
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• 제11권4호
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• pp.969-973
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• 2016

Interruption tests were conducted using the same circuit breaker for an initial pressure of SF₆ 0.5 MPa (gauge pressure) and CO₂ mixture 1.0 MPa, 0.8 MPa, and 0.6 MPa. The pressure-rises in the compression and thermal expansion chambers were measured for verifying the computational results using a simplified synthetic test facility. Further, the possibility of the CO₂ mixture substituting SF₆ gas was confirmed. Moreover, in view of the thermal recovery capability, it has also been confirmed that the pressure of the CO₂ mixture can be reduced almost to the same value as that of the SF₆ gas by optimizing the design parameters of the interrupter.

• 한국산업융합학회 논문집
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• 제20권2호
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• pp.187-194
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• 2017

This study examined the validity and reliability of the thermal safety design, in order to maintain the heat generated from integrated circuit (IC) chips in the converter, condenser, resistor, and transistor (which are considered as heat sources for thermoelectric devices with a printed circuit board) below target levels during the process of developing a control board and a main power board. The study analyzed the heat generation and dissipation characteristics of the entire printed circuit board (PCB) model to examine its thermal safety.