• Journal of Information Display
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• v.13 no.1
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.287-288
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• 2005

In this study, we have investigated electro-optical characteristics of thermal and UV stressed TN cells on the rubbed polyimide surface. Mono-domain alignments of thermal stressed TN cells over temperature of liquid crystal isotropic phase were almost same that of no thermal stressed TN cells. Also, threshold voltage and response time of thermal stressed TN cells were same that of no thermal stressed TN cells. Finally, the residual DC voltage of the thermal stressed TN cell on the polyimide surface show decrease of characteristics as increasing thermal stress time. Therefore, thermal stability of TN cell was decreased by high thermal stress for the long times.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.11
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• pp.1033-1036
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• 2006

We have investigated electro-optical characteristics in three kinds of twisted nematic (TN) cells on the polyimide surface. The threshold voltage and the response time of thermal stressed TN cells were same that of no thermal stressed TN cells. There were little change of value in these TN cells. On the other hand, transmittance of no thermal stressed TN cells were better than that of thermal stressed TN cells. Transmittances of TN cells on the polyimide surface decreased by increasing thermal stress time. Moreover, the residual DC of the thermal stressed TN cells increased as increasing thermal stress temperature and time. Therefore, thermal stability of TN cells were decreased gradually by giving high thermal stress for a long time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.8
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• pp.749-754
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• 2008

A large number of studies on the various characteristics of epoxy-layered silicate nanocomposites, such as electric and mechanical, morphology have been conducted and contributed to improve their characteristics. However, studies on the effects of its thermal conductivities in the thermal properties are not enough, even though there are some excellent evaluations for its insulation performances. Thermal properties will cause thermal degradation and significantly affect the reliability of these epoxy-layered silicate nanocomposites. In the results of the analysis of epoxy-layered silicate nanocomposites $T_g$ for various types of organoclays (10A, 15A, 20A, 30B, and 93A), it showed an excellent thermal property of 10A. Also, it represented low values in storage modulus and mechanical Tan (Delta) at a high temperature section 140$^{\circ}C$ and excellent thermal properties due to its movement to the high temperature section in the case of the property of 10A in the measurement of DMA elastics and mechanical losses. In the results of the measurement of thermal conductivities, power ultrasonic applications represented a significant increase in thermal conductivities in the case of the applications of power ultrasonic and planetary centrifugal mixers. Based on these results, it is necessary to perform related studies because it can be applied as useful materials for future power facilities applications in mold and impregnate insulation.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.1
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• pp.69-75
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• 2004

This paper presents the thermal characteristics analysis of a high-speed motor-separated spindle system consisted of angular contact ball bearings and built-in motor with oil-jet lubrication. The spindle system is composed of the main spindle and sub-spindle which are mechanically connected by a flexible coupling. The spindles are supported by two front and rear bearings, and the built-in motor is located between the front and rear bearings of the sub-spindle. The thermal analysis model of spindle system is constructed by the finite element method, and the thermal characteristics in the design stage are estimated based on temperature distribution and heat flow under the various testing conditions related to material of bearing ball, spindle speed and coolant temperature.

• Proceedings of the Korea Society for Industrial Systems Conference
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• 1997.11a
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• pp.451-462
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• 1997

A 2-dimensional numerical analysis is presented for thermal-electron heat conduction effects upon the electron transport and the drain current-voltage characteristics of submicron GaAs MESFETs, based on the use of a nonstationary hydrodynamic transport model. It is shown that for submicron GaAs MESFETs, electron heat conduction effects are significant on their internal electronic properties and also drain current-voltage characteristics. Due to electron heat conduction effects, the electron energy is greatly one-djmensionalized over the entire device region. Also, the drain current decreases continuously with increasing thermal conductivity in the saturation region of large drain voltages above 1 V. However, the opposite trend is observed in the linear region of small drain voltages below 1 V. Accordingly, for a large thermal conductivity, negative differential resistance drain current characteristics are observed with a pronounced peak of current at the drain voltage of 1 V. On the contrary, for zero thermal conductivity, a Gunn oscillation characteristic is observed at drain voltages above 2 V under a zero gate bias condition.

• Applied Science and Convergence Technology
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• v.24 no.5
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• pp.125-131
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• 2015

We investigated the thermal characteristics of rotating anode X-ray tube to develop it for digital radiography by using computer simulation. The target which is the area of the anode struck by electrons is the most important component to get a long life of X-ray tube. So we analyze the thermal characteristics of the target and rotor assembly according to their emissivity by using ANSYS transient thermal simulation and then compare with the measured data of the target temperature operating in aging process of X-ray tube. Especially, keeping the lead coated layer as the role of metal lubricant on ball bearing enables to prevent the noise in rotating anode. The simulation result showed that its temperature was under the melting point of the lead in X-ray tube for digital radiography with 1.2 mm large focal spot 0.6 mm small focal spot and 150 kV tube voltage. We also investigated the relationship between the diameter of the anode shaft and the temperature of the anode and rotor assembly. It has been confirmed that the smaller anode shaft could be good for the rotor thermal characteristics.

• Journal of IKEEE
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• v.18 no.4
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• pp.532-535
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• 2014

This paper analyzed thermal characteristics of super junction MOSFET using process and design parameters. Trench process is very important to super junction MOSFET process. We analyzed the difference of temperature, thermal resistance, total power consumption according to trench etch angle. As a result we obtained minimum value of temperature difference and thermal resistance at $89.3^{\circ}$ of trench etch angle. The electrical characteristics distribution of super junction MOSFET is not showed tendency according to trench etch angle. We need iterative experiments and simulation for optimal value of electrical characteristics. The super junction power MOSFET that has superior thermal characteristics will use automobile and industry.

• Proceedings of the Korea Concrete Institute Conference
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• 2002.05a
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• pp.23-28
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• 2002

This paper reports the performance results of hydration heat control of mass concrete walls with pipe cooling system. The thickness of walls ranged from 0.9 to 2.2m. In order to investigate the effect of pipe cooling on the thermal and thermal crack characteristics, the pipe cooling was conducted for 42 walls, and the investigation of thermal cracks was conducted for 14 walls. Based on the investigation, the pipe cooling method decreased the peak temperature of about 13-2$0^{\circ}C$ and the thermal crack width of about 30% for mass concrete walls.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.10
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• pp.809-815
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• 2014

The co-bonded dissimilar composite under a wide range of temperature change shows thermal distortion due to the differences in thermal expansion characteristics of the composite materials. Analysis of the thermal expansion characteristics of each composite is required for the design of co-bonded dissimilar composite structure with considering the shape distortion during the manufacturing process. In this work, digital image correlation (DIC) technique is introduced for measuring the thermal distortion characteristics of co-bonded dissimilar composite specimen, carbon/epoxy and silica/phenolic. The thermal distortion of co-bonded dissimilar composite specimen is numerically estimated and compared with the experiments. The estimated results is successfully validated using the measured results.