• International Journal of Highway Engineering
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• v.11 no.3
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• pp.1-11
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• 2009

This study focuses on evaluating the applicability of an acryl based polymer concrete to the thin bridge deck pavements. The acryl concrete developed in this study is composed of Methyl Methacrylate(MMA) resin, benzol peroxide and fillers. To study the effects of the types and amounts of the components on the physical characteristics of the acryl concrete, viscosity, compressive strength and bending tests were conducted. The optimum mixture design was then determined based on the testing results. Several different types of laboratory tests, such as water and chlorine ion penetration tests, shrinkage and thermal coefficients tests, and tensile bonding strength tests were performed for the optimum acryl concrete and conventional cement concrete. The testing results show that water and chroline ion resistance, bonding strength between acryl and cement concrete and crack resistance of the acryl concrete is better than those of the conventional cement concrete. There are shortcomings that the conventional acryl concrete has a higher shrinkage and thermal coefficients. However, it was confirmed that to use newly developed rubberized MMA resin in this study reduces the crack resistance with substantially increased ductility.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.212-217
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• 2022

Large thermal stress due to the difference between silicon carbide and graphite's coefficients of thermal expansion could be formed during crystal growing process of silicon carbide (SiC) at high temperature. The large thermal stress could separate the SiC seed crystals from graphite components, which bring about the drop of the seed crystal during crystal growth. However, the bonding properties of SiC seed crystal module has hardly reported so far. In this study, SiC and graphite were bonded using 3 types of bonding agents and a three-point bending tests using a mixed-mode flexure test were conducted for the bonded samples to evaluate the bonding characteristics between SiC and graphite. Raman spectroscopy, X-ray Photoelectron Spectroscopy, and X-ray Computed Tomography were used to analyze the bonding characteristics and the microstructures of the SiC-graphite interfaces bonded with the bonding agents. As results, an excellent bonding agent was chosen to fabricate SiC seed crystal module with 50 mm in diameter. An SiC single crystal with 50 mm in diameter was successfully grown without falling out during top seeded solution growth of SiC at high temperature.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.44 no.4
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• pp.433-441
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• 2024

This study aims to prevent freezing of existing domestic buildings by developing an energy storage mortar with increased energy efficiency that can reduce the increase in carbon emissions and maintenance costs due to external energy use due to heat wires in civil engineering and buildings with embedded heat wires. I suggest. Research has focused on incorporating phase change materials (PCMs) into common cement composites to provide latent heat performance. However, concrete mixed with phase change materials shows problems such as leakage of phase change materials, decreased strength, and insufficient thermal performance. To overcome this problem, we encapsulate phase change materials using microcapsules and mix them into cement composites to minimize strength loss and leakage, and use multi-walled carbon nanotubes and silica fume to minimize the strength reduction of concrete. A heat storage cement composite was developed. When high-efficiency heat storage cement was used as a replacement for ordinary cement composite in an environment where heat wires were buried, the effect was shown to reduce energy by about 42 %, and compared to a cement composite containing only PCM, the compressive strength and bending strength were 18 % and 23 %, respectively. was improved and its effectiveness was proven.

• Journal of the Korean Ceramic Society
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• v.38 no.12
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• pp.1123-1131
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• 2001

The sintering behaviors of the renewed $Al_2$O$_3$ceramics were investigated as functions of the addition amount and particle size of recycling $Al_2$O$_3$powder, such as crushed powder of structural $Al_2$O$_3$ceramics and waste $Al_2$O$_3$adsorbent, were investigated. Pure $Al_2$O$_3$sample was fabricated by sintered at 1,$650^{\circ}C$ for 5h and it was crushed into powder (-40${\mu}{\textrm}{m}$and +40${\mu}{\textrm}{m}$ in particle size) by thermal shock treatment and crushing. Then, 10~50wt% of crushed $Al_2$O$_3$powder and waste $Al_2$O$_3$adsorbent were mixed with pure $Al_2$O$_3$powder and were subjected to re-sintering to renewed $Al_2$O$_3$sample. The density and the 3-point bending strength increased with increasing the sintering temperature without regard to the addition amount and particle size of recycling $Al_2$O$_3$powder, and that of the samples at the same sintering temperature decreased with increasing the addition amount and particle size of recycling $Al_2$O$_3$powder. Samples over 200 Mpa of 3-point bending strength were obtained by mixing ~30wt% of crushed $Al_2$O$_3$powder(-40${\mu}{\textrm}{m}$), ~20wt% of crushed $Al_2$O$_3$powder (+40${\mu}{\textrm}{m}$) and 10wt% of waste $Al_2$O$_3$adsorbent. 5~20wt% of waste glass powder containing renewed $Al_2$O$_3$samples for densification were fabricated by sintered at 1200~1$650^{\circ}C$ for 5h. The temperature of maximum density and 3-point bending strength decreased with increasing the addition amount of waste glass powder, however, these samples at above 140$0^{\circ}C$ showed lower density and bending strength than renewed $Al_2$O$_3$samples. The addition of waste glass powder did not improved the densification of renewed $Al_2$O$_3$sample.

• Composites Research
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• v.18 no.2
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• pp.20-29
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• 2005

To evaluate the flexural deformation and strength of composite motor case above the glass transition temperature$(T_g),\;170^{\circ}C$, of resin material, a finite element analysis(FEA) model in which material non-linearity and progressive failure mode were considered was proposed. The laminated flexural specimens which have the same lay-up and thickness as the composite motor case were tested by 4-point bending test to verify the validity of FEA model. Also. mechanical properties in high temperature were evaluated to obtain the input values for FEA. Because the material properties related to resin material were highly deteriorated in the temperature range beyond $T_g$, the flexural stiffness and strength of laminated flexural specimen in $200^{\circ}C$ were degraded by also $70\%\;and\;80\%$ in comparison with normal temperature results. Above $T_g$, the failure mode was changed from progressive failure mode initiated by matrix cracking at $90^{\circ}$ ply in bottom side and terminated by delamination at the center line of specimen to fiber compressive breakage mode at top side. From stress analysis, the progressive failure mechanism was well verified and the predicted bending stiffness and strength showed a good agreement with the test results.

• The korean journal of orthodontics
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• v.40 no.1
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• pp.40-49
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• 2010

Objective: The aim of this research was to evaluate the mechanical properties (MP) and degree of the phase transformation (PT) of martensitic (M-NiTi), austenitic (A-NiTi) and thermodynamic nickel-titanium wire (T-NiTi). Methods: The samples consisted of $0.016\;{\times}\;0.022$ inch M-NiTi (Nitinol Classic, NC), A-NiTi (Optimalloy, OPTI) and T-NiTi (Neo-Sentalloy, NEO). Differential scanning calorimetry (DSC), three-point bending test, X-ray diffraction (XRD), and microstructure examination were used. Statistical evaluation was undertaken using ANOVA test. Results: In DSC analysis, OPTI and NEO showed two peaks in the heating curves and one peak in the cooling curves. However, NC revealed one single broad and weak peak in the heating and cooling curves. Austenite finishing ($A_f$) temperatures were $19.7^{\circ}C$ for OPTI, $24.6^{\circ}C$ for NEO and $52.4^{\circ}C$ for NC. In the three-point bending test, residual deflection was observed for NC, OPTI and NEO. The load ranges of NC and OPTI were broader and higher than NEO. XRD and microstructure analyses showed that OPTI and NEO had a mixture of martensite and austenite at temperatures below Martensite finishing ($M_f$). NEO and OPTI showed improved MP and PT behavior than NC. Conclusions: The mechanical and thermal behaviors of NiTi wire cannot be completely explained by the expected degree of PT because of complicated martensite variants and independent PT induced by heat and stress.

• Journal of Korean Ophthalmic Optics Society
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• v.20 no.1
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• pp.1-7
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• 2015

Purpose: For optimizing properties of final glasses frame, the aim of this study is to examine the correlation of processing conditions and properties of cellulose acetate (CA) sheets through the investigation of properties of CA sheets prepared under processing steps. Methods: The properties of CA sheets were investigated in terms of different glasses frame processing conditions, bending process, barrel process, and ultrasonic cleaning process. CA sheets prepared through the sequential processing were examined by various analysis: gloss, mechanical properties, thermal properties. Results: After barrel process, hardness and tensile strength of CA sheet were increased. However, bending strength and impact strength were decreased. It is suggested the CA sheet had became rather stiff state (brittle). Also, in degradation temperature region of plasticizer, about 3% of reduction in plasticizer weight was confirmed upon TGA analysis. Conclusions: Glasses frame process, especially in the barrel process have a profound influence on the properties of CA sheet owing to reduction of total amount of plasticizer.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.115-115
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• 1999

GaN는 직접천이형 wide band gap(3.4eV) 반도체로서 청색/자외선 발광소자 및 고출력 전자장비등에의 응용성 때문에 폭넓게 연구되고 있다. 이러한 넓은 분야의 응용을 위해서는 열 적으로 안정된 Ohmic contact을 반드시 실현되어야 한다. n-type GaN의 경우에는 GaN계면에서의 N vacancy가 n-type carrier로 작용하기 때문에 Ti, Al, 같은 금속을 접합하여 nitride를 형성함에 의해서 낮은 접촉저항을 갖는 Ohmic contact을 하기가 쉽다. 그러나 p-type의 경우에는 일 함수가 크고 n-type와 다르게 nitride가 형성되지 않는 금속이 Ohmic contact을 할 가능성이 많다. 시료는 HF(HF:H2O=1:1)에서 10분간 초음파 세척을 한 후 깨끗한 물에 충분히 헹구었다. 그런 후에 고순도 Ar 가스로 건조시켰다. Pd와 Ni은 열적 증착법(thermal evaporation)을 사용하여 p-GaN에 상온에서 증착하였다. 현 연구에서는 열처리에 의한 Pd의 clustering을 줄이기 위해서 wetting이 좋은 Ni을 Pd 증착 전과 후에 삽입하였으며, monchromatic XPS(x-ray photoelectron spectroscopy) 와 SAM(scanning Auger microscopy)을 사용하여 열처리 전과 40$0^{\circ}C$, 52$0^{\circ}C$ 그리고 695$0^{\circ}C$에서 3분간 열처리 후의 온도에 따른 morphology 변화, 계면반응(interfacial reaction) 및 벤드 휨(band bending)을 비교 연구하였다. Nls core level peak를 사용한 band bending에서 Schottky barrier height는 Pd/Ni bi-layer 접합시 2.1eV를, Ni/Pd bi-layer의 경우에 2.01eV를 얻었으며, 이는 Pd와 Ni의 이상적인 Schottky barrier height 값 2.38eV, 2.35eV와 비교해 볼 때 매우 유사한 값임을 알 수 있다. 시료를 후열처리함에 의해 52$0^{\circ}C$까지는 barrier height는 큰 변화가 없으나, $650^{\circ}C$에서 3분 열처리 후에 0.36eV, 0.28eV 만큼 band가 더 ？을 알 수 있었다. Pd/Ni 및 Ni/Pd 접합시 $650^{\circ}C$까지 후 열 처리 과정에서 계면에서 matallic Ga은 온도에 비례하여 많은 양이 형성되어 표면으로 편석(segregation)되어지나, In-situ SAM을 이용한 depth profile을 통해서 Ni/Pd, Pd/Ni는 증착시 uniform하게 성장함을 알 수 있었으며, 후열처리 함에 의해서 점차적으로 morphology 의 변화가 일어나기 시작함을 볼 수 있었다. 이는 $650^{\circ}C$에서 열처리 한후의 ex-situ AFM을 통해서 재확인 할 수 있었다. 이상의 결과로부터 GaN에 Pd를 접합 시 심한 clustering이 형성되어 Ohoic contact에 문제가 있으나 Pd/Ni 혹은 Ni/Pd bi-layer를 사용함에 의해서 clustering의 크기를 줄일 수 있었다. Clustering의 크기는 Ni/Pd bi-layer의 경우가 작았으며, $650^{\circ}C$ 열처리 후에 barrier height는 Pd/Ni bi-layer의 경우에도 Ni의 영향을 받음을 알 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.17-24
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• 2008

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $150^{\circ}C,\;5{\times}10^4\;A/cm^2$ conditions, respectively, in order to compare the growth kinetics of intermetallic compound(IMC) in Cu pillar bump. The quantitative interfacial adhesion energy with annealing was measured by using four-point bending strength test in order to assess the effect of IMC growth on the mechanical reliability of Cu pillar bump. Only $Cu_6Sn_5$ was observed in the Cu pillar/Sn interface after reflow. However, $Cu_3Sn$ formed and grew at Cu pillar/$Cu_6Sn_5$ interface with increasing annealing and stressing time. The growth kinetics of total($Cu_6Sn_5+Cu_3Sn$) IMC changed when all Sn phases in Cu pillar bump were exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. The quantitative interfacial adhesion energy after 24h at $180^{\circ}C$ was $0.28J/m^2$ while it was $3.37J/m^2$ before annealing. Therefore, the growth of IMC seem to strongly affect the mechanical reliability of Cu pillar bump.