• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2001년도 추계학술대회 논문집
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• pp.238-246
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• 2001

Residual stresses and thermal deformation of a structure due to welding are very imfortant factors for a weld design. It has been carried therretical analysis to invesitigate influence of heat flux to residual stresses and thermal deformation producted by curcumferential welding. Temperature,stresses and deformationn are obtain as a function of circumferentisl drgree and distance from welding center line. These result can applicate to predict and remove the deformation or residual stresses built up by welding.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.47-52
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• 2002

There are many factors in machine tool error. These are thermal deformation, geometric error, machine's part assembly error, error caused by tool bending. Among them thermal error is 70% of total error of machine tool . Prediction of thermal error is very difficult. because of nonlinear tendency of machine tool deformation. In this study, we tried thermal error prediction by using multi regression analysis.

• 한국정밀공학회지
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• 제30권7호
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• pp.754-761
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• 2013

Thermal displacement is an important issue in machine tool systems. During the last several decades, thermal error compensation technology has significantly reduced thermal distortion error; this success has been attributed to the development of a precise, robust thermal error model. A major advantage of using the thermal error model is instant compensation for the control variables during the modeling process. However, successful application of thermal error modeling requires correct determination of the temperature sensor placement. In this paper, a procedure for predicting thermal-mode-based thermal error is introduced. Based on this thermal analysis, temperature sensors were positioned for multiple heat-source models. The performance of the sensors based on thermal-mode error analysis, was compared with conventional methods through simulation and experiments, for the case of a slide table in a transient state. Our results show that for predicting thermal error the proposed thermal model is more accurate than the conventional model.

• 한국초전도ㆍ저온공학회논문지
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• 제18권1호
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• pp.59-63
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• 2016

The superconducting NMR magnets have used cryogen such as liquid helium for their cooling. The conduction cooling method using cryocoolers, however, makes the cryogenic cooling system for NMR magnets more compact and user-friendly than the cryogen cooling method. This paper describes the thermal and structural analysis of a cryogenic conduction cooling system for a 400 MHz HTS NMR magnet, focusing on the magnet assembly. The highly thermo-conductive cooling plates between HTS double pancake coils are used to transfer the heat generated in coils, namely Joule heating at lap splice joints, to thermal link blocks and finally the cryocooler. The conduction cooling structure of the HTS magnet assembly preliminarily designed is verified by thermal and structural analysis. The orthotropic thermal properties of the HTS coil, thermal contact resistance and radiation heat load are considered in the thermal analysis. The thermal analysis confirms the uniform temperature distribution for the present thermal design of the NMR magnet within 0.2 K. The mechanical stress and the displacement by the electromagnetic force and the thermal contraction are checked to verify structural stability. The structural analysis indicates that the mechanical stress on each component of the magnet is less than its material yield strength and the displacement is acceptable in comparison with the magnet dimension.

• Journal of Magnetics
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• 제15권3호
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• pp.138-142
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• 2010

This paper reports the development of an analysis method in a synchronous reluctance motor (SynRM) using the finite element method (FEM) coupled with the electromagnetic field of the Preisach model, which represents an additional thermal source due to hysteresis loss and a thermal field. This study focused on thermal analysis relative to hysteresis and copper losses in a SynRM.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.57-58
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• 2006

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys and thermal distributions form experiments.

• 한국화재소방학회논문지
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• 제16권3호
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• pp.56-60
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• 2002

최근 전계-열계해석 소프트웨어의 발전에 힘입어 전계-열계 해석 이론을 바탕으로 컴퓨터 시뮬레이션에 의한 전기화재의 정확한 원인분석과 조사가 체계적으로 연구되고 있으나, 매우 미흡한 실정이다. 따라서 본 논문에서는 국내 L사 제품(600V, VVF)의 전선을 모델로 하여 과부하 및 단락사고시 발생되는 전류 크기에 따른 전선의 열해석을 전계-열계 유한요소법(Flux2D)을 통하여 컴퓨터 시뮬레이션 하고자 한다.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2003년도 The Fifth Asian Computational Fluid Dynamics Conference
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• pp.248-250
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• 2003

Thermal analysis is performed to protect the propulsion system of low-earth-orbit earth observation satellite from unwanted thermal disaster like propellant freezing. To implement thermal design adequately, heater powers for the propulsion system estimated through the thermal analysis are decided. Based on those values anticipated herein, the average power for propulsion system becomes 22.02 watts when the only one redundant catalyst bed heater is turned on. When for the preparation of thruster firing, 25.93 watts of the average power is required. All heaters selected for propulsion components operate to prevent propellant freezing meeting the thermal requirements for the propulsion system with the worst-case average voltage, i.e. 25 volts.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2005년도 춘계 학술대회논문집
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• 전자공학회논문지SC
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• 제43권5호
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• pp.60-67
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• 2006

우주 비행체 전자장비의 신뢰도를 예측하고 최적화하기 위해 탑재장치 내 부품의 온도 예측이 필수적으로 요구된다. 본 논문에서는 전자장비 부품의 온도 예측방법에 관해 기술하고 있다. 본 예측 방법은 PCB 기판의 열전도도를 등방성모델로 설정하여 등가 열전도도를 계산하고 열력 모델을 이용하여 열 저항 행렬을 생성하였으며, 중첩의 원리를 이용하여 각 부품들의 온도를 예측하였다. 또한 본 논문의 온도 예측방법을 이용하여 전장품 소자의 열해석 결과와 상용 프로그램을 이용한 온도 계산 결과를 비교 분석하였다.