• Journal of Welding and Joining
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• v.34 no.6
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• pp.42-46
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• 2016

Hydrogen assisted cracking (HAC) is one of the most complicated problem in welding. Huge amount of studies have been done for decades. Based on them, various standards have been established to avoid HAC. But it is still a chronic problem in industrial field. It is well known that the main causes of the hydrogen crack are residual stress, crack susceptible micro structures and a certain critical level of hydrogen concentration. Even though the exact generating mechanism is unclear till today, it has been reported that the hydrogen level in the weld metal should be managed less than a certain amount to prevent it. Matsuda studied that the residual hydrogen level in the weld metal can be varied even if the initial hydrogen content is same. It is also insisted in this report that the residual hydrogen concentration is in stronger correlation with hydrogen crack than the initial hydrogen content. But, in practical point of view, the residual hydrogen is still hard to consider because measuring hydrogen level is time and cost consuming process. In this regard, numerical analysis is the only solution for considering the residual hydrogen content. Meanwhile, Takahashi showed the possibility of predicting the residual hydrogen by a rigorous FE analysis. But, few commercial software suitable for solving the weld metal hydrogen has been reported yet. In this study, two dimensional thermal - hydrogen coupled analysis was developed by using the commercial FE software MARC. Since the governing equation of the hydrogen diffusion is similar to the heat transfer, it is shown that the heat transfer FE analysis in association with hydrogen diffusion property can be used for hydrogen diffusion analysis. A series of simulation was performed to verify the accuracy of the model. For BOP (Bead-On-Plate) and the multi-pass butt welding simulations, remaining hydrogen contents in the weld metal is well matched with measurements which are referred from Kim and Masamitsu.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.12
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• pp.979-984
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• 2016

Recently, ball screws have been used in machine tools, robot parts, and medical instruments. The demand for ball screws of high precision and reduced size is increasing because of the growth of high value-added industries. Three types of ball screws are typically used: deflector type, end-cap type, and tube type. They are also classified from C0 to C9 according to the precision level. A deflector type ball screw can reduce the variation of rotational torque and the size of the nut of the ball screw is minimized. To ensure the reliable design of ball screws, it is important to perform a structural analysis. The purpose of this study is to perform a stability evaluation through analysis of a deflector type miniature ball screw for weapon systems. The analysis is performed through Finite Elements Method (FEM) simulation to predict characteristics such as deformation, stress, and thermal effects. The interference between the shaft and the deflector for smooth rotation are also studied. Based on the results of the analysis, the development of the deflector type miniature ball screw for weapon systems is performed.

• Tunnel and Underground Space
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• v.30 no.4
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• pp.306-319
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• 2020

Characterizations of Excavation Damage Zone (EDZ), which is hydro-mechanical degrading the host rock, are the important issues on the geological repository for the spent nuclear fuel. In the DECOVALEX 2019 project, Task G aimed to model the fractured rock numerically, describe the hydro-mechanical behavior of EDZ, and predict the change of the hydraulic factor during the lifetime of the geological repository. Task G prepared two-dimensional fractured rock model to compare the characteristics of each simulation tools in Work Package 1, validated the extended three-dimensional model using the TAS04 in-situ interference tests from Äspö Hard Rock Laboratory in Work Package 2, and applied the thermal and glacial loads to monitor the long-term hydro-mechanical response on the fractured rock in Work Package 3. Each modelling team adopted both Finite Element Method (FEM) and Discrete Element Method (DEM) to simulate the hydro-mechanical behavior of the fracture rock, and added the various approaches to describe the EDZ and fracture geometry which are appropriate to each simulation method. Therefore, this research can introduce a variety of numerical approaches and considerations to model the geological repository for the spent nuclear fuel in the crystalline fractured rock.

• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.19-23
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• 2023

The Second-generation high-temperature superconducting (HTS) Rare-Earth Barium Copper Oxide (REBCO) wire is a composite laminate having a multi-layer structure (8 or more layers). HTS wires will undergo multiple loads including the bending-tension loads during winding, high current density, and high magnetic fields. In particular, the wires are subjected to bending stress and magnetic field stress because HTS wires are wound around a circular bobbin when making a high-field magnetic. Each of the different laminated wires inevitably exhibits damage and fracture behavior of wire due to stress deformation, mismatches in thermal, physical, electrical, and magnetic properties. Therefore, when manufacturing high-field magnets and other applications, it is necessary to calculate the stress-strain experienced by high-temperature superconducting wire to present stable operating conditions in the product's use environment. In this study, the finite element model (FEM) was used to simulate the strain-stress characteristics of the HTS wire under high current density and magnetic field, and bending loads. In addition, the result of obtaining the neutral axis of the wire and the simulation result was compared with the theoretical calculation value and reviewed. As a result of the simulation using COMSOL Multiphysics, when a current of 100 A was applied to the wire, the current value showed the difference of 10^-9. The stress received by the wire was 501.9 MPa, which showed a theoretically calculated value of 500 MPa and difference of 0.38% between simulation and theoretical method. In addition, the displacement resulted is 30.0012 ㎛, which is very similar to the theoretically calculated value of 30 ㎛. Later, the amount of bending stress by the circular mandrel was received for each layer and the difference with the theoretically obtained the neutral axis result was compared and reviewed. This result will be used as basic data for manufacturing high-field magnets because it can be expanded and analyzed even in the case of wire with magnetic flux pinning.

• Explosives and Blasting
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• v.41 no.3
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• pp.62-72
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• 2023

The aging of plant structures due to industrialization in the 1970s has increased the demand for blast demolition. While blasting can reduce exposure to environmental pollution by shortening the demolition period, improper blasting design and construction plans pose significant safety risks. Thus, it is vital to consider optimal blasting demolition conditions and other factors through collapse behavior simulation. This study utilizes a 3-D combined finite-discrete element method (FDEM) code-based 3-D DFPA to simulate the collapse of a chimney structure in a thermal power plant in Seocheon, South Korea. The collapse behavior from the numerical simulation is compared to the actual structure collapse, and the numerical simulation result presents good agreement with the actual building demolition. Additionally, various numerical simulations have been conducted on the chimney models to analyze the impact of the duct size in the pre-weakening area. The no-duct, duct, and double-area duct models were compared in terms of crack pattern and history of Z-axis displacement. The findings show that the elapse-time for demolition decreases as the area of the duct increases, causing collapse to occur quickly by increasing the load-bearing area.

• Korean Journal of Materials Research
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• v.18 no.10
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• pp.547-551
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• 2008

Crack-free joining of $Si_3N_4\;and\;Al_2O_3$ using 15 layers has been achieved by a unique approach introducing Sialon polytypoids as a functionally graded materials (FGMs) bonding layer. In the past, hot press sintering of multilayered FGMs with 20 layers of thickness $500{\mu}m$ each has been fabricated successfully. In this study, the number of layers for FGM was reduced to 15 layers from 20 layers for optimization. For fabrication, model was hot pressed at 38 MPa while heating up to $1700^{\circ}$, and it was cooled at $2^{\circ}$/min to minimize residual stress during sintering. Initially, FGM with 15 layers had cracks near 90 wt.% 12H / 10 wt.% $Al_2O_3$ and 90 wt.% 12H/10 wt.% $Si_3N_4$ layers. To solve this problem, FEM (finite element method) program based on the maximum tensile stress theory was applied to design optimized FGM layers of crack free joint. The sample is 3-dimensional cylindrical shape where this has been transformed to 2-dimensional axisymmetric mode. Based on the simulation, crack-free FGM sample was obtained by designing axial, hoop and radial stresses less than tensile strength values across all the layers of FGM. Therefore, we were able to predict and prevent the damage by calculating its thermal stress using its elastic modulus and coefficient of thermal expansion. Such analyses are especially useful for FGM samples where the residual stresses are very difficult to measure experimentally.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.