• Nuclear Engineering and Technology
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• v.41 no.3
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• pp.287-294
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• 2009

Due to thermal hydraulics phenomena, such as thermal stratification, various events occur to the parts of a nuclear power plant during their lifetimes: e.g. cracked and dislocated pipes and thermally fatigued, bent, and damaged supports. Due to the operational characteristics of the parts of the steam generator feedwater inlet horizontal pipe, thermal stratification takes place particularly frequently. However, the thermal stress due to thermal stratification at the steam generator feedwater inlet horizontal pipe was not reflected in the design stage of old plants(Kori Unit No.1, 2, 3 and 4, Yeonggwang Unit No. 1 and 2, and Uljin Unit No. 1 and 2; referred to as old-style power plants hereinafter). Accordingly, a verification experiment was performed for thermal stratification in the horizontal inlet nozzle steam generator of old-style plants. If thermal stratification occurred in the horizontal pipe of an old-style power plant, numerical analysis of the temperature distribution of the pipes and fluids was conducted. The temperature distributions were compared at the curved part of the pipe and the horizontal pipe before and after the installation of the improved thermal sleeves designed to alleviate thermal stress due to thermal stratification. The thermal stress reduction measure was proven effective at the steam generator inlet horizontal pipe and the curved part of the pipe.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

• Journal of the Korean Society of Clothing and Textiles
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• v.23 no.8
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• pp.1110-1118
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• 1999

This study was to examine the effects of garment types on thermal insulation using a thermal manikin. cotton polyester wool silk and rayon were selected as outer wears like a blouse a skirt slacks and one-piece for this study Acetate was chosen as a lining. Brief and upper innerwear with long sleeves(cotton) were also chosen as the innerwear. The results were as follows: 1. The thermal insulation of the garment of single layer was in proportion to the covering area of garment in all types of clothing. 2. On adding the innerwear or the lining or both the thermal insulation of the each garment of single layer were showed a different trends by garment types. The thermal manikin insulations of one-piece dress adding the innerwear was higher than those of blouse-skirt suits. The thermal insulation of one-piece dress adding the innerwear and lining was lower than those of blouse-skirt suits. 3. The increasing rates of thermal insulation of multi-layered garments had different value by garment types but garment made of rayon and silk were showed very high increasing rates of thermal insulation. 4. The increasing rates of the thermal insulation of one-piece dress added the lining the innerwear or both except polyester showed the highest value and then blouse-slacks suits' turn came ound Blouse-skirt suits had the lowest the increasing rates of thermal insualition value.

• Korean Journal of Materials Research
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• v.30 no.8
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• pp.435-440
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• 2020

The relationship between the precipitation of secondary phase and the thermal properties of Al-4.5%Cu alloy (in wt.%) after various heat treatments has been studied. Solid solution treatment of alloy was performed at 808 K for 6 hours, followed by warm water quenching; then, the samples were aged in air at 473 K for different times. The thermal diffusivity of the Al-4.5%Cu alloy changed with the heat treatment conditions of the alloy at temperatures below 523 K. The as-quenched specimen had the lowest thermal diffusivity, and as the artificial aging time increased, the thermal diffusivity of the specimen increased in the temperature range between 298 and 523 K. For the specimen aged for five hours, the thermal conductivity was 12% higher than that of the as-quenched specimens at 298 K. It is confirmed that the thermal diffusivity and thermal conductivity of the Al-4.5%Cu alloy significantly depend on their thermal history at temperatures below 523 K. The precipitation and dissolution of the Al₂Cu phase were confirmed via DSC for the alloys, and the formation of coefficient of thermal expansion peaks in TMA was caused by precipitation. The precipitation of supersaturated solid solution of Al-4.5%Cu alloys had an additional linear expansion of ≈ 0.05 % at 643 K during thermal expansion measurement.

• Journal of the Korean Society of Industry Convergence
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• v.22 no.6
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• pp.767-773
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• 2019

The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

• Proceedings of the Korean Society for Emotion and Sensibility Conference
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• 2009.11a
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• pp.273-276
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• 2009

Photovoltaic-thermal(PVT) collectors are a combination of photovoltaic modules with solar thermal collectors, forming one device that receives solar radiation and produces electricity and heat simultaneously. Of various PV modules, dye-sensitized solar cell(DSC) is a relatively new type of solar cell technology that can transmit light while they can generate electricity. With this aspect, DSC can be applied into solar thermal collectors. The object of this study is to evaluate the thermal performance of PVT collector with DSC. The thermal performance of the DSC PVT combind collector was measured in outdoor conditions with the solar radiation of over $700W/m^2$. In this study, the PVT collector with the 30% light transmittance of DSC achieved its thermal efficiency of about 36%.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.15 no.6
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• pp.524-532
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• 2003

In this paper, a personal air-conditioning system considering the human thermal adaptability is analyzed. Although the conventional personal air-conditioner was proofed to be satisfactory in providing for the thermal comfort, it is being questioned on the term of its energy efficiency. Therefore, it is important and urgent to develop new types of personal air-conditioning system with sustainable control strategy that can ensure energy saving and thermal comfort simultaneously. In this study, we first examined the problems of the conventional personal air-conditioning system with field interview and laboratory experiment in terms of usage, management and thermal comfort, and proposed the energy-saving personal air-conditioning system considering the human thermal adaptation. Then a laboratory experiment was performed to analyze the characteristics of the human thermal comfort under severe indoor thermal conditions, which were controlled using a new personal air-conditioning unit designed according to the proposal. The results help to illustrate the alleviation effect of the new personal air-conditioning system, and indicate that the thermal alleviation time is useful to maintain the thermal comfort with efficient usage of energy.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.449-451
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• 2007

We made 980 thermal conductivity measurements on igneous, metamorphic, sedimentary, and volcanic rock samples from Korea. The average thermal conductivity of igneous, metamorphic, sedimentary, and volcanic rocks are 3.41 W/m-K, 3.98 W/m-K, 4.10 W/m-K, and 3.21 W/m-K, respectively. Thermal conductivity values of a rock type generally have a wide range because thermal conductivity depends on various factors such as dominant mineral phase, micro-structure, anisotoropy and so on. Thermal properties (thermal conductivity, thermal diffusivity and specific heat) are important variables which are used to design a geothermal heat pump(GHP) system. Therefore, our thermal property data can contribute on a efficient design of a GHP system.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.12 no.2
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• pp.25-33
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• 2016

The thermal stratification phenomenon in the nuclear power plant can cause abnormal deformation of the piping, contact with the support, damage to the support system. Repetition of the thermal stratification phenomenon or variation of the thermal boundary layer can cause thermal fatigue. Thermal stratification phenomenon in nuclear power plants is still an ongoing issue and active research has been carried out. In this paper, the current situation in Korean nuclear power plants is described, followed by the status of research and the future problems on the thermal stratification phenomenon in Korea.

• Journal of Information Display
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• v.13 no.1
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.