• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.49-60
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• 2010

Semiconductor packages are increasingly moving toward miniaturization, lighter and high performance. Futhermore, packages become thinner. Thin packages will generate serious reliability problems such as warpage, crack and other failures. Reliability problems are mainly caused by the CTE mismatch of various package materials. Therefore, proper selection of the package materials and geometrical optimization is very important for controlling the warpage and the stress of the package. In this study, we investigated the characteristics of the warpage and the stress of several packages currently used in mobile devices such as CABGA, fcSCP, SCSP, and MCP. Warpage and stress distribution are analyzed by the finite element simulation. Key material properties which affect the warpage of package are investigated such as the elastic moduli, CTEs of EMC molding and the substrate. Geometrical effects are also investigated including the thickness or size of EMC molding, silicon die and substrate. The simulation results indicate that the most influential factors on warpage are EMC molding thickness, CTE of EMC, elastic modulus of the substrate. Simulation results show that warpage is the largest for SCSP. In order to reduce the warpage, DOE optimization is performed, and the optimization results show that warpage of SCSP becomes $10{\mu}m$.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.438-444
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• 2001

The objective of this study is to provide a simple methodology to find optimum processing conditions to fabricate sub-micron structured DVD-RAM substrates with superb optical and geometrical properties. It was found that the birefringence, which is regarded as one of the most important optical properties for an optical disk, was very sensitive to the mold wall temperature history. Also, the integrity of the replication, represented by the land-groove structure and the radial tilt were influenced by the mold temperature and the compression pressure. A set of optimum conditions were obtained by applying Design of Experiment and the objective functions composed of three different objectives.

• Design & Manufacturing
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• v.12 no.2
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• pp.11-15
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• 2018

In this study, we proposed three analysis methods to calculate the flatness of torque-angle sensors (TAS). We introduced two statistical and one geometrical methods in evaluating the precision of the flat plane in the axis direction for TAS. To verified the results, we fabricated TAS and a reference sample using a injection molding machine, mold, polyester as a raw material. We measured ($x_i$, $y_i$) position using 3D contact automated system and applied three analysis methods developed for TAS and a reference sample to see the feasibility. While each analysis method has its own pros and cons, the analysis using the shortest optimal distance was the most precise technique for the flatness evaluation of TAS components.

• Polymer(Korea)
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• v.32 no.6
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• pp.501-508
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• 2008

Small injection molded articles such as lens and mobile product parts are usually molded in multi-cavity mold. The problem occurring in multi-cavity molding is flow unbalance among the cavities. The flow unbalance affects the dimensions and physical properties of molded articles. First of all, the origin of flow unbalance is geometrical unbalance of the delivery system. However, even the geometry of the delivery system is well balanced, cavity unbalance occurs. This comes from the temperature distributions in the cross-section of runner. Temperature distribution depends upon injection speed because heat generation near runner wall is high at high injection speed. Among the operational conditions, injection speed is the most significant process variable affecting the filling unbalances in multi-cavity injection molding. In this study, experimental study of flow unbalance has been conducted for various injection speeds and materials. Also, the filling unbalances were compared with CAE results. The dimensions and weights of multi-cavity molded parts were examined. The results showed that the filling unbalances vary according to the injection speeds and resins. Subsequently, the unbalanced filling and pressure distribution in the multi-cavity affect the dimensions and physical states of molded parts.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.2
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• pp.38-43
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• 2007

This paper describes ultrasonically assisted grinding used to obtain a glossy surface quickly and precisely. High-quality surfaces are required for plastic injection molding dies used in the production of plastic parts such as dials for cellular phones. Traditionally, in order to finish the dies, manual polishing by a skilled worker has been required after the machining processes, such as electro discharge machining (EDM), which leaves an affected layer, and milling, which leaves tooling marks. However, manual polishing causes detrimental geometrical deviations of the die and consumes several days to finish a die surface. Therefore, a machining process for finishing dies without manual polishing to improve the surface roughness and form accuracy would be extremely valuable. In this study, a 3D positioning machine equipped with an ultrasonic spindle was used to conduct grinding experiments. An electroplated diamond tool was used for these experiments. Generally, diamond tools cannot grind steel because of excessive wear as a result of carbon atoms diffusing into bulk steel and chips. However, ultrasonically assisted grinding can achieve a fine surface (roughness Rz of $0.4{\mu}m$) on die steel without severe tool wear. The final aim of this study is to realize mirror surface grinding for injection molding dies without manual polishing. To do this, it is necessary to fabricate an electroplated diamond tool with high form accuracy and low run-out. This paper describes a tool-making method for high precision grinding and the grinding performance of a self-electroplated tool. The ground surface textures, tool performance and tool life were investigated A ground surface roughness Rz of 0.14 um was achieved Our results show that the spindle speed, feed rate and cross feed affected the surface texture. One tool could finish $5000mm^2$ of die steel surface without any deterioration of the ground surface roughness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.3
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• pp.201-209
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• 2009

The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.

• Journal of the Korean Ceramic Society
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• v.46 no.6
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• pp.700-707
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• 2009

This paper described finite element analysis (FEA) for fabrication processes of PZT perform using ceramic injection molding (CIM). The viscosity and the PVT characteristics of the manufactured PZT feedstock were measured. The filling patterns, pressure and temperature distributions of the preform were analyzed with TIMON 3D packages during CIM process. The geometrical variables such as gate type, location, and base thickness of the preform were considered. Also the fabrication conditions of the preform were optimized during the entire CIM process. Based on the simulated results, the various good perform was easily fabricated with the CIM process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.4
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• pp.637-643
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• 2002

The objective of this study is to provide a simple methodology to find optimum processing conditions to fabricate sub-micron structured DVD-RAM substrates with superb optical and geometrical properties. It was fecund that the birefringence, which is regarded as one of the most important optical properties for an optical disk, was very sensitive to the mold wall temperature history. Also, the integrity of the replication, represented by the land-groove structure and the radial tilt were influenced by the mold temperature and the compression pressure. A set of optimum conditions were obtained by applying Design of Experiment and the objective functions composed of three different objectives.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.100-107
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• 2002

The extruder screw is a part for extruding material in a injection molding machine. The screw's geometrical shape can mathematically be described by a sweep surface which is constructed by sweeping a section curve composed of a few circular arcs, along a helical guide curve. In the paper we developed a dedicated CAD system which basically is parametric in a sense that the system initially takes several design parameters to construct the geometric elements including the final sweep surface of the screw as well as section & guiding curves, along with feasibility check of the input parameter values, without further user interaction. The system has been developed as a built-in module onto a commercial CAD system, which can further incorporate additional NC-out functions with ease.

• International Journal of CAD/CAM
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• v.3 no.1_2
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• pp.19-29
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• 2003

Disassembly is a fundamental process needed for component reuse and material recycling in all assembled products. Integral attachments, also known as 'snap' fits, are favored fastening means in design for assembly (DFA) methodologies, but not necessarily a favored choice for design for disassembly. In this paper, design methods of a new class of integral attachments are proposed, where the snapped joints can be disengaged by the application of localized heat sources. The design problem of reversible integral attachments is posed as the design of compliant mechanisms actuated with localized thermal expansion of materials. Topology optimization technique is utilized to obtain conceptual layout of snap-fit mechanisms that realizes a desired deformation of snapped features for joint release. Two design approaches are attempted and design results of each approach are presented, where the geometrical configuration extracted from optimal topologies are simplified to enhance the manufacturability for the conventional injection molding technologies. To maximize the magnitude of deformation, a design scheme has been proposed to include boundary conditions as design variables. Final designs are verified using commercial software for finite element analysis.