• Title/Summary/Keyword: temporary bonding

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Structure Formation in Multilayered Films Prepared by the Layer-by-Layer Deposition using PAA and HM-PEO

  • Seo, Jin-Hwa;Lutkenhaus Jodie L..;Kim, Jun-Oh;Hammond Paula T.;Char Kook-Heon
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.295-295
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    • 2006
  • In present study, poly(acrylic acid) (PAA) and hydrophobically modified poly(ethylene oxide) (HM-PEO) multilayers based on the hydrogen bonding between the component polymer pair have been prepared by the LbL deposition method. Dip assembled HM-PEO/PAA multilayers yield unique film morphologies in comparison with PEO/PAA multilayers due to the micellar formation of HM-PEO owing to the hydrophobic attraction between alkyl chains end-capped with the PEO chains. Individual HM-PEO micelles were connected through the bridging PEO chains to form temporary networks on multilayer surface and induced peculiar surface morphology on HM-PEO/PAA multilayers above the critical number of bilayers.

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The comparison of microleakage on intracoronal restoration after non-vital bleaching

  • Jung, Jae-Eun;Lee, Hee-Joo;Hur, Bock
    • Proceedings of the KACD Conference
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    • 2001.11a
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    • pp.584.2-584
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    • 2001
  • The purpose of the present study were to evaluate microleakage of a fourth generation dentin-bonding agent following a walking bleaching treatment, to determine the effect of temporary postbleaching dressing with calcium hydroxide on microleakage and to investigate the effect of delayed intracoronal restoration on micro leakage. Forty extracted non-carious incisors were selected and conventional root canal treatment was performed. The teeth were randomly divided into 4 groups of 10 specimens each.(omitted)

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Effect of Provisional Restorative and Filling Materials on Bond Strength of Adhesive Resin Cement between Lithium Disilicate Glass-Ceramic and Dentin (Lithium Disilicate Glass-ceramic과 상아질 간의 접착성 레진 시멘트의 결합강도에 대한 임시 수복재와 임시 충전재의 영향)

  • Oh, Sang-Chun;Sim, Hun-Bo
    • Journal of Dental Rehabilitation and Applied Science
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    • v.29 no.4
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    • pp.359-365
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    • 2013
  • The aim of this study was to evaluate the effect of temporary restorative and filling material on bonding strength between lithium disilicate glass-ceramic and dentin. 60 extracted human molars were cross-sectioned at occlusal third and were embedded into self-cure acrylic resin. Then the teeth were randomly divided into four groups of 15 each. Lithium disilicate glass-ceramic is cemented to dentin as follows: after no any application of the provisional materials (Group A), after application of ALIKETM (GC America Inc.)(Group B), after application of Luxatemp$^{(R)}$ Automix plus (DMG, Germany)(Group C), after application of Fermit$^{(R)}$ (Ivoclar Vivadent, Leichtenstein)(Group D). After the specimens were stored in distilled water for 24 hours, the shear bond strength of the specimens were measured using UTM (Zwick 1456 41, Zwick, Germany) at a crosshead speed of 1mm/min. The data were analysed by one-way ANOVA and Tukey HSD tests. There were no statistically significant differences of bond strength among the groups. Fracture type was showed mixed type of adhesive and cohesive fracture in most of specimens. Within the limitation of this study, bond strength of adhesive resin cement between lithium disilicate glass-ceramic and dentin was not affected by provisional restorative and filling materials.

Design for Enhanced Precision in 300 mm Wafer Full-Field TTV Measurement (300 mm 웨이퍼의 전영역 TTV 측정 정밀도 향상을 위한 모듈 설계)

  • An-Mok Jeong;Hak-Jun Lee
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.3
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    • pp.88-93
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    • 2023
  • As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.

Experimental Study on Application of Multi-Stepwise TPSM (다단계 온도프리스트레싱 공법의 현장적용을 위한 실험적 연구)

  • Ahn, Jin-Hee;Kim, Jun-Hwan;Kim, Sang-Hyo;Lee, Sang-Woo
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.12 no.1
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    • pp.91-100
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    • 2008
  • Multi-stepwise Thermal Prestressing Method(TPSM) is a newly proposed prestressing method, which is combined the external prestressing method and the external bonding method. Multi-stepwise thermal prestressing force is induced by cooling process of cover-plate in the multi-stepwise temperature distribution after the cover-plate being bolted to the girder. In this study, the heating capacity test of the developed heating system for applying the multi-stepwise TPSM effectively and multi-stepwise TPSM inducing test of H-beam is performed. Also, a field test of the rhamen type temporary bridge is carried out to evaluate the effect and application of the multi-stepwise TPSM. Truck load was loaded and compared with the structure analysis results.

THE COMPARISON OF MICROLEAKAGE ON INTRACORONAL RESTORATION AFTER NON-VITAL BLEACHING (실활치 표백술 후 치관내 수복물의 미세누출에 관한 비교)

  • Jung, Jae-Eun;Lee, Hee-Joo;Hur, Bock
    • Restorative Dentistry and Endodontics
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    • v.28 no.1
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    • pp.57-63
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    • 2003
  • The purpose of the present study were to evaluate microleakage of a fourth generation dentin-bonding agent following a walking bleaching treatment, to determine the effect of temporary postbleaching dressing with calcium hydroxide on microleakage and to investigate the effect of delayed intracoronal restoration on microleakage. The results of this study were as follows : 1. Bleached groups showed more microleakage than unbleached group 2. Immediately restored group following bleaching procedure showed the highest microleakage score. 3. One-week delayed restorations showed less microleakage but there were no statistically significant difference between group II and III. 4. Provisional dressing with calcium hydroxide had no influence on microleakage. It is necessary to know the time that has elapsed from the bleaching treatment to the restoration procedure to achieve optimal seal, as well as to reduce the risk of microleakage in adhesive restoration.

Wafer TTV Measurement and Variable Effect Analysis According to Settling Time (Settling Time에 따른 웨이퍼 TTV 측정 및 변수 영향 분석)

  • Hyeong Won Kim;Anmok Jeong;Taeho Kim;Hak Jun Lee
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.3
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    • pp.8-13
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    • 2023
  • High bandwidth memory a core technology of the future memory semiconductor industry, is attracting attention. Temporary bonding and debonding process technology, which plays an important role in high bandwidth memory process technology, is also being studied. In this process, total thickness variation is a major factor determining wafer performance. In this study, the reliability of the equipment measuring total thickness variation is identified, and the servo motor settling, and wafer total thickness variation measurement accuracy are analyzed. As for the experimental variables, vacuum, acceleration time, and speed are changed to find the most efficient value by comparing the stabilization time. The smaller the vacuum and the larger the radius, the longer the settling time. If the radius is small, high-speed rotation performance is good, and if the radius is large, low-speed rotation performance is good. In the future, we plan to conduct an experiment to measure the entire of the wafer.

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Deposition of aluminum nitride nanopowders and fabrication of superhydrophobic surfaces (질화알루미늄 나노분말의 부착과 이를 활용한 초소수성 표면 제작)

  • Kwangseok Lee;Heon-Ju Choi;Handong Cho
    • Journal of the Korean institute of surface engineering
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    • v.57 no.1
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    • pp.49-56
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    • 2024
  • Superhydrophobic surfaces have been expected to be able to provide considerable performance improvements and introduce innovative functions across diverse industries. However, representative methods for fabricating superhydrophobic surfaces include etching the substrate or attaching nanosized particles, but they have been limited by problems such as applicability to only a few materials or low adhesion between particles and substrates, resulting in a short lifetime of superhydrophobic properties. In this work, we report a novel coating technique that can achieve superhydrophobicity by electrophoretic deposition of aluminum nitride (AlN) nanopowders and their self-bonding to form a surface structure without the use of binder resins through a hydrolysis reaction. Furthermore, by using a water-soluble adhesive as a temporary shield for the electrophoretic deposited AlN powders, hierarchical aluminum hydroxide structures can be strongly adhered to a variety of electrically conductive substrates. This binder-free technique for creating hierarchical structures that exhibit strong adhesion to a variety of substrates significantly expands the practical applicability of superhydrophobic surfaces.

Questions and Solutions on Repair of Lime-Soil Consolidation in Traditional Buildings (전통 건축물 석회다짐층 보수 시공시의 문제점 및 개선 방안)

  • Kim, Jin-Man;Kwak, Eun-Gu;Suh, Man-Cheol;Cho, Heon-Young
    • 한국문화재보존과학회:학술대회논문집
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    • 2002.02a
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    • pp.21-31
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    • 2002
  • Lime-soil consolidations are very important as structural material, bonding material, waterproofing material, and finishing material in korea traditional buildings. In this study, we investigated site application trouble in korea traditional buildings being repaired or restored, and propose following solutions. 1) To diminish quality variation occurred by slaking quick-lime in site, it is desirable to use slaked-lime for lime-soil consolidation. 2) For uniform construction of lime-soil consolidation, we would recommend builders to use mixer to be uniform mixture, premixed type materials and compacting machine in field, 3) and to use rigid suitable temporary construction as scaffold for preventing traditional buildings from additional damage occurred in demolition and construction of a layer of lime-soil consolidation of a roofing. 4) For suitable repair of traditional buildings, it is necessary to specify definitely materials and construction methods suggested by the standard specifications for repair of the cultural property.

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Effects of Ground Faults on the Safety of Persons and Low-voltage Installations in 22.9 kV-Y Distribution Systems (22.9 kV-Y 계통에서 지락고장이 인체 및 저압설비의 안전에 미치는 영향)

  • Kim, Han-Soo;Chung, Jae-Hee;Kang, Kae-Myung
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.22 no.1
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    • pp.141-148
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    • 2008
  • This paper presents experimental results on the safety of persons and protection of low-voltage equipments of the sub-station due to a single-phase ground fault in 22.9 kV-Y distribution system. In order to evaluate the hazard voltages and the stress voltage of the low-voltage(LV) equipment due to faults between high-voltage systems and earth based on the newly prescribed KS C IEC 60364 standard series, the verification tests in a 22.9[kV] neutral multiple grounding system were carried out. From the experimental results, we introduce serious problems causing some discomfort when applying KS C IEC 60364 standard series to the existing domestic distribution system and the effective protective measures against temporary overvoltages due to a ground fault in the common grounding which is combined the 22.9 kV-Y grounding and the customer's installation grounding are proposed. As a consequence, it was found that the equipotential bonding is an important prerequisite for the effectiveness of the protective measures for the safety of persons and LV equipment in the combined 22.9 kV-Y and low-voltage grounding system.