• Journal of Ocean Engineering and Technology
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• v.16 no.5
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• pp.80-87
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• 2002

In this study, CT specimens were prepared from spring steel(SUP9) which was used in suspension of automobile for room temperature and low temperature service. We got the following characteristics from fatigue crack growth test carried out in the environment of room temperature and low temperature at $25^{\circ}C$, ­3$0^{\circ}C$, ­5$0^{\circ}C$, ­7$0^{\circ}C$ and ­10$0^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I) and stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It is assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.10
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• pp.425-430
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• 2003

A CMOS Voltage-Controlled Oscillator(VCO) for application at temperature stable system is designed. The VCO consists of bandgap voltage reference circuit, comparator, and voltage-to-current converter and the VCO has a temperature stable characteristics. The difference between simulated and calculated values is less than about 5% in output characteristics when the input voltage range is from 1V to 3.25V. The CMOS VCO has error less than about $\pm$0.85% in the temperature range from $-25^{\circ}C$ to $75^{\circ}C$.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.264-268
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• 2001

In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature, low temperature and high temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room, and high temperature at $25^{\circ}C,\; 50^{\circ}C, \;100^{\circ}C,\; 150^{\circ}C,\; and\; 180^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range $\DeltaK_{th}$ in the early stage of fatigue crack growth (Region I ) and stress intensity factor range $\Delta$K in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.83-90
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• 2004

In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature and low temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room temperature and low temperature at $25^{\circ}C$, $-30^{\circ}C$, $-50^{\circ}C$, $-70^{\circ}C$,$-100^{\circ}C$, and $-150^{\circ}C$, in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I)was increased but stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to decrease temperature. It is assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerably higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• Journal of information and communication convergence engineering
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• v.7 no.2
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• pp.215-218
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• 2009

In this paper, temperature stable current and voltage references using simple CMOS bias circuit are proposed. To obtain temperature stable characteristics of bias circuit a bandgap reference concept is used in a conventional circuit. The parasitic bipolar transistors or MOS transistors having different threshold voltage are required in a bandgap reference. Thereby the chip area increase or the extra CMOS process is required compared to a standard CMOS process. The proposed reference circuit can be integrated on a single chip by a standard CMOS process without the extra CMOS process. From the simulation results, the reference current variation is less than ${\pm}$0.44% over a temperature range from - $20^{\circ}C$ to $80^{\circ}C$. And the voltage variation is from - 0.02% to 0.1%.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.799-804
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• 2012

To converter time information to digital information Time-to-Digital Converter(TDC) is designed by using analog delay elements. To obtain the temperature stable characteristics the circuit is designed and the operation of the designed circuit is confirmed by HSPICE. The characteristics variation of the designed delay element with temperature is from -0.18% to 0.126% compared to room temperature characteristics when the temperature is varied from $-20^{\circ}C$ tp $70^{\circ}C$. Time difference is from -0.18% to 0.12% compared to room temperature characteristic when the temperature is varied from $-20^{\circ}C$ tp $70^{\circ}C$. The time difference is simulated when the digital output is 15. However the time difference is from -1.09% to 1.28% in the TDC using temperature non-stable analog delay elements.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.325-329
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• 1998

In this paper, the (Sr$_{1-x}$ Ca$_{x}$)TiO$_3$(SCT) thin films were deposited at various substrate temperature using RF magnetron sputtering method on optimized Pt-coated electrodes (Pt/TiN/SiO$_2$/Si). An influence of substrate temperature and annealing temperature on the structural and dielectric properties are investigated. The substrate temperature changed from 100[$^{\circ}C$] to 500[$^{\circ}C$] and crystalline SCT thin films were deposited abode 400[$^{\circ}C$]. All thin films had (111) preferred orientation, the (100) oriented films were obtained at the substrate temperature above 400[$^{\circ}C$]. The dielectric constant changes almost linearly in the temperature region of -80~+90[$^{\circ}C$], the temperature characteristics of the dielectric loss exhibited a stable value within 0.1, then not affected by substitutional contents. The capacitance characteristics appears a stable value within $\pm$5[%].

• Journal of the Korean Society of Safety
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• v.18 no.3
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• pp.1-7
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• 2003

In this study, CT specimens were prepared from spring steel(SPS5) processed shot peening. The fatigue crack growth tests were carried out in the environment of the room temperature md low temperature at $25^{\circ}C$, $-30^{\circ}C$, $-50^{\circ}C$, $-70^{\circ}C$ $-100^{\circ}C$ and $-150^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I) and stress intensity factor range $\Delta$K in the stable of fatigue crack growth (Region II) were decreased in proportion to descend temperature. It was shown that the fatigue resistance characteristics and fracture strength at low temperature are considerable higher than those of mom temperature in the early stage and stable of fatigue crack growth region.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.671-672
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• 2011

Time to digital converter is designed. To obtain the digital signal from time information the analog delay element is used. Because the analog delay element shows more stable characteristics compared to the digital delay element in view point of process variation. The designed circuit has temperature stale characteristics when the range of operating temperature is from $-20^{\circ}C$ to $70^{\circ}C$. The circuit is simulated and confirmed by HSPICE.

• Journal of Advanced Marine Engineering and Technology
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• v.25 no.6
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• pp.1228-1236
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• 2001

In this study, CT specimens were prepared from ASTH A5l6 steel which was used for pressure vessel plates for moderate and lower temperature service. And we got the fellowing characteristics from fatigue crack growth test carried out in the environment of room and low temperature at $25^{\circ}C$ , $-30^{\circ}C$, $-60^{\circ}C$, $-80^{\circ}C$, $-100^{\circ}C$ and $-120^{\circ}C$ and in the range of stress ratio of 0.1, 0.3 by means of opening mode displacement. At the constant stress ratio, the Threshold stress intensity factor range ΔAKth in the early stage of fatigue crack growth (Region I) and stress intensity factor range $\DeltaK$ in the stable of fatigue crack growth (Region II) was increased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region. The straight line slope relation of logarithm da/dN-$\Delta$K in Region II that is, the fatigue clack growth exponent m increased with descending temperature at the constant stress ratio. It assumed that the fatigue crack growth rate da/dN is rapid in proportion to descend temperature in Region II and the cryogenic-brittleness greatly affect a material with decreasing temperature.