• 제목/요약/키워드: temperature range

검색결과 10,341건 처리시간 0.033초

쇼트피이닝 가공된 스프링강의 저.고온 피로균열진전 평가 (An Investigation on the Shot Peening on the Low.High Temperature Fatigue Crack Propagation)

  • 박경동;정찬기
    • 한국마린엔지니어링학회:학술대회논문집
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    • 한국마린엔지니어링학회 2001년도 추계학술대회 논문집(Proceeding of the KOSME 2001 Autumn Annual Meeting)
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    • pp.65-70
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    • 2001
  • In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature, low temperature and high temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room, low temperature and high temperature at $25^{\circ}C$, -3$0^{\circ}C$, -5$0^{\circ}C$, -7$0^{\circ}C$, -10$0^{\circ}C$ and 5$0^{\circ}C$, 10$0^{\circ}C$ , 15$0^{\circ}C$, 18$0^{\circ}C$ and in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range $\DeltaK_{th}$ in the early stage of fatigue crack growth (Region I ) and stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

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미세조직 및 첨가성분 (CoO와 $Al_2O_3$)이 Mn-Zn Ferrite의 자기적 성질에 미치는 영향 (The Effects of Microstructures and Some Additives (CoO and $Al_2O_3$) on the Magnetic Properties of Mn-Zn Ferrite)

  • 변수일;장승현
    • 한국세라믹학회지
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    • 제16권3호
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    • pp.142-154
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    • 1979
  • The effects of microstructures and some additives $(CoO and Al_2O_3$) on the magnetic properties such as initial permeability, $\mu$-T curve, coercive force, and magnetic induction of MnZn ferrites have been studied. The powder was prepared by Hot Petroleum Drying Method. The basic composition of MnZn ferrites was 25.5mole % MnO, 22.0 mole% ZnO, 52.5 mole% $Fe_2O_3$. CoO in a concentration range from 0.05 to 0.5 mole% and $Al_2O_3$ from 2.5 to 7.5 mole% were added. Sintered density increased up to 97.5% of theoretical density. Permeability increased as average grain size increased, and that coercive force decreased as average grian size increased. Magnetic induction increased as sintered density increased. The variation of initial permeability with temperature in a temperature range from 0$^{\circ}$ to $60^{\circ}C$ was lowered (a flatter $\mu-T$ curve) as sintering temperature decreased. The compensation temperature To ofmagnetocrystalline anisotropy constant K1 and initial permeability varied with the species and amount of additives. When 0.05 mole% CoO was added to the basic composition, initial permeability at $15^{\circ}C$ increased from 5200 to 5900. The variation ofinitial permeability with temperature in a temperature range from 0^{\circ}to $60^{\circ}C$ was smaller (a flatter $\mu$-T curve) than that of the basic composition of Mn Zn ferrites. When 2.5 mole% $Al_2O_3$ was added, initial permeability at $15^{\circ}C$ decreased from 5200 to 3000. But the variation of initial permeability with temperature in a temperature range from 0$^{\circ}$to $60^{\circ}C$ was smaller (a flat ter $\mu-T$ curve) than when 0.05 mole% CoO was added. Experimental results showed that the conditions necessary for the occurrence of a very high permeability and a flat $\mu$-T curve were controversial even in a temperature range from $0^{\circ}$to $60^{\circ}C$.

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테프론의 가열에 의한 C-V 열화 특성에 관한 연구 (A Study on Properties of C-V Degradation due to Heating in Teflon)

  • 이성일
    • 한국전기전자재료학회논문지
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    • 제27권11호
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    • pp.730-735
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    • 2014
  • In this study, the temperature characteristics of electrostatic capacity and dielectric loss for the sample of Teflon film which is degradated at the $120^{\circ}C{\sim}200^{\circ}C$ temperature range in the oven for 10 hours has been measured in through the applied frequency range of 0.1 kHz~4,800 kHz at temperature of $50^{\circ}C$, $90^{\circ}C$, $130^{\circ}C$, $170^{\circ}C$. Also, in the same conditions, the frequency characteristics of electrostatic capacity and dielectric loss for the sample of Teflon film has been measured in through the applied temperature range of $30^{\circ}C{\sim}70^{\circ}C$ on setting frequency of 0.1 kHz, 1 kHz, 10 kHz, 100 kHz. The results of this study are as follows. When the frequency range of 0.1 kHz~4,800 kHz applied to the sample of Teflon film, the electrostatic capacity has been measured at the temperature of $50^{\circ}C$, $90^{\circ}C$, $130^{\circ}C$, $170^{\circ}C$. Through this measurement, it found that the electrostatic capacity decreased with increasing temperature. Regarding this result, may be it is because the electromagnetic coupling is degraded by thermal degradation. When the sample of Teflon film heated at $280^{\circ}C$ for 10 hours in oven, the dielectric loss has changed from unstable status to stabilizing status with increasing the degradation temperature in the $120^{\circ}C$, $160^{\circ}C$, $200^{\circ}C$ range. In this measurement, the two spectrums of dielectric loss appeared. It considers that this spectrum of dielectric loss appeared in 300 Hz is caused by the molecular motion of the C-F or OH group. Through this study, It found that the electrostatic capacity decreased with increasing frequency and temperature, and there is no change in dielectric loss, although the frequency increases.

BiCMOS 기술을 이용한 전압-주파수 변환 회로 (Voltage-to Frequency Converter using BiCMOS)

  • 최진호
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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    • pp.193-196
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    • 2000
  • In this work, I propose a temperature stable voltage-to-frequency converter in which the output frequency is directly proportional to the input voltage. The output frequency range is from 20㎑ to 60㎑ and the difference between simulated and calculated values is less than about 5% for this range of output frequency. The temperature variation of sample output frequencies is less than ${\pm}$0.5% in the temperature range -25$^{\circ}C$ to 75$^{\circ}C$.

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수위, 온도, 전도도 측정을 위한 다기능 One-Chip 센서의 제조 (Fabrication of a multi-functional one-chip sensor for detecting water depth, temperature, and conductivity)

  • 송낙천;조용수;최시영
    • 센서학회지
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    • 제15권1호
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    • pp.7-12
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    • 2006
  • The multi-functional one-chip sensor has been fabricated to reduce output variation under various water environment. There were a temperature sensor, a piezoresistive type pressure sensor, and a electrode type conductivity sensor in the fabricated one-chip sensor. This sensor was measured water depth in the range of $0{\sim}180cm$, temperature in the range of $0{\sim}50^{\circ}C$, and salinity in the range of 0 $0wt%{\sim}5wt%$, respectively. Since the change of water depth in solution environment depends on various factors such as salinity, latitude, temperature, and atmospheric pressure, the water depth sensor is needed to be compensated. We tried to compensate the salinity and temperature dependence for the pressure in water by using lookup-table method.

應答係數法에 의한 溫水 溫室 暖房 시스템의 Simulation (Simulation of the hot water ONDOL heating system by response factor method)

  • 조상준;민만기;최영돈
    • 대한기계학회논문집
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    • 제11권3호
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    • pp.409-424
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    • 1987
  • 본 연구에서는 유한차분법보다는 정확도가 약간 떨어지지만 공기조화 분야의 계산에 적합하고 계산시간이 적게 소요되는 응답계수법을 사용하여 온수온돌방계의 비 정상 열전달을 해석하였다.

쇼트피이닝 가공된 스프링강의 저온 피로균열진전 평가 (A Study on the Shot Peening on the Low Temperature Fatigue Crack Propagation)

  • 박경동;정찬기;하경준;박상오;손명군;노영석
    • 한국해양공학회:학술대회논문집
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    • 한국해양공학회 2001년도 추계학술대회 논문집
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    • pp.282-286
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    • 2001
  • In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature, low temperature and high temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room, low temperature and high temperature at $25^{\circ}C$,$-30^{\circ}C$,$-50^{\circ}C$,$-70^{\circ}C$ and $-100^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range $\Delta K_{th}$ in the early stage of fatigue crack growth (Region I ) and stress intensity factor range $\Delta K$ in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

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Effect of C/Ti Atom Ratio on the Deformation Behavior of TiCχ Grown by FZ Method at High Temperature

  • Shin, Soon-Gi
    • 한국재료학회지
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    • 제23권7호
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    • pp.373-378
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    • 2013
  • In order to clarify the effect of C/Ti atom ratios(${\chi}$) on the deformation behavior of $TiC_{\chi}$ at high temperature, single crystals having a wide range of ${\chi}$, from 0.56 to 0.96, were deformed by compression test in a temperature range of 1183~2273 K and in a strain rate range of $1.9{\times}10^{-4}{\sim}5.9{\times}10^{-3}s^{-1}$. Before testing, $TiC_{\chi}$ single crystals were grown by the FZ method in a He atmosphere of 0.3MPa. The concentrations of combined carbon were determined by chemical analysis and the lattice parameters by the X-ray powder diffraction technique. It was found that the high temperature deformation behavior observed is the ${\chi}$-less dependent type, including the work softening phenomenon, the critical resolved shear stress, the transition temperature where the deformation mechanism changes, the stress exponent of strain rate and activation energy for deformation. The shape of stress-strain curves of $TiC_{0.96}$, $TiC_{0.85}$ and $TiC_{0.56}$ is seen to be less dependent on ${\chi}$, the work hardening rate after the softening is slightly higher in $TiC_{0.96}$ than in $TiC_{0.85}$ and $TiC_{0.56}$. As ${\chi}$ decreases the work softening becomes less evident and the transition temperature where the work softening disappears, shifts to a lower temperature. The ${\tau}_c$ decreases monotonously with decreasing ${\chi}$ in a range of ${\chi}$ from 0.86 to 0.96. The transition temperature where the deformation mechanism changes shifts to a lower temperature as ${\chi}$ decreases. The activation energy for deformation in the low temperature region also decreased monotonously as ${\chi}$ decreased. The deformation in this temperature region is thought to be governed by the Peierls mechanism.

$Pr_{6}O_{11}$계 ZnO 바리스터의 전기적 성질에 소결온도의 영향 (Effect of Sintering Temperature on Electrical Properties of $Pr_{6}O_{11}$-Based ZnO Varistors)

  • 남춘우;류정선
    • 한국전기전자재료학회논문지
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    • 제14권7호
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    • pp.572-577
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    • 2001
  • The electrical properties of Pr$_{6}$ O$_{11}$ -based ZnO varistors consisting of ZnO-Pr$_{6}$ O$_{11}$ -CoO-Cr$_2$O$_3$-Er$_2$O$_3$ ceramics were investigated with sintering temperature in the range of 1325~f1345$^{\circ}C$. As sintering temperature is raised., the nonlinear exponent was increased up to 1335$^{\circ}C$, reaching a maximum 70.53, whereas raising sintering temperature further caused it to decrease, reaching a minimum 50.18 and the leakage current was in the range of 1.92~4.12 $\mu$A. The best electrical properties was obtained from the varistors sintered at 1335$^{\circ}C$, exhibiting a maximum (70.53) in the nonlinear exponent and a minimum (1.92 $\mu$A) in the leakage current, and a minimum (0.035) in the dissipation factor. On the other hand, the donor concentration was in the range of (0.90~1.14)x10$^{18}$ cm$^{-3}$ , the density of interface states was in the range of (2.69~3.60)x10$^{12}$ cm$^{-2}$ , and the barrier height was in the range of 0.77~1.21 eV with sintering temperature. With raising sintering temperature, the variation of C-V characteristic parameters exhibited a mountain type, reaching maximum at 134$0^{\circ}C$. Conclusively, it was found that the V-I, C-V, and dielectric characteristics of Pr$_{6}$ O$_{11}$ -based ZnO varistors are affected greatly by sintering temperature.

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Theoretical Conception of Synergistic Interactions

  • Kim, Jin-Kyu;Vladislav G. Petin
    • 환경생물
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    • 제20권4호
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    • pp.277-286
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    • 2002
  • An increase in the overall biological effect under the combined action of ionizing radiation with another inactivating agent can be explained in two ways. One is the supposition that synergism may attribute to a reduced cellular capacity of damn-ge repair after the combined action. The other is the hypothesis that synergism may be related to an additional lethal or potentially lethal damage that arises from the interaction of sublesions induced by both agents. These sublesions ave considered to be in-effective when each agent is applied separately. Based on this hypothesis, a simple mathematical model was established. The model can predict the greatest value of the synergistic effect, and the dependence of synergy on the intensity of agents applied, as well. This paper deals with the model validation and the peculiarity of simultaneous action of various factors with radiation on biological systems such as bacteriophage, bacterial spores, yeast and mammalian cells. The common rules of the synergism aye as follows. (1) For any constant rate of exposure, the synergy can be observed only within a certain temperature range. The temperature range which synergistically increases the effects of radiation is shifted to the lower temperature fer thermosensitive objects. Inside this range, there is a specific temperature that maximizes the synergistic effect. (2) A decrease in the exposure rate results in a decrease of this specific temperature to achieve the greatest synergy and vice versa. For a constant temperature at which the irradiation occurs, synergy can be observed within a certain dose rate range. Inside this range an optimal intensity of the physical agent may be indicated, which maximizes the synergy. As the exposure temperature reduces, the optimal intensity decreases and vice versa. (3) The recovery rate after combined action is decelerated due to an increased number of irreversible damages. The probability of recovery is independent of the exposure temperature for yeast cells irradiated with ionizing or UV radiation. Chemical inhibitors of cell recovery act through the formation of irreversible damage but not via damaging the recovery process itself.