• Journal of Energy Engineering
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• v.15 no.2 s.46
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• pp.107-117
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• 2006

The status of water splitting thermochemical cycle for hydrogen production was reviewed in this article. Mass production of hydrogen could be possible using the thermochemical process which is similar to the concept of conventional chemical reaction system if the high temperature heat source is available. The mediators (chemicals and reagents) should be used to split chemically stable water, and should be recycled in a closed cycle in order to be environmentally acceptable. Though there is no process to reach commercial stage, IS cycle, two-step cycles based on metallic oxide such as ZnO/Zn, $Fe_3O_4/FeO$ and the associated cycles are attracted due to their possibilities of application. Development of materials for high temperature and/or corrosive conditions during thermochemical process is still important topic in some thermochemical processes.

• Journal of Photoscience
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• v.9 no.2
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• pp.240-242
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• 2002

In Drosophila melanogaster, it is known that the circadian clock consists of an autoregulatory feedback loop, which includes so-called clock genes, such as per, tim, dClk and cyc and produces periodical expression of per. It is recently suggested, however, that the circadian oscillation without the rhythmical expression of per is involved in the regulation of circadian locomotor rhythms. In the present study, we examined the existence and the property of the possible per-less oscillation using arrhythmic clock mutant flies carrying per$^{01}$, tim$^{01}$, dClk$^{Jrk}$ or cyc$^{01}$. When temperature cycles consisting of 25$^{\circ}$Ｃ and 30$^{\circ}$Ｃ with varying periods (T = 8~32 hr) were given, they showed rhythms synchronizing with the given cycle under constant darkness (DD). per$^{01}$ and tim$^{01}$ flies always showed a peak around 7 hr after the onset of thermophase irrespective of Ts of temperature cycles, while dClk$^{Jrk}$ and cyc$^{01}$ flies did not. In addition, several days were necessary to establish a clear temperature entrainment in per$^{01}$ and tim$^{01}$ flies, when they were transferred from a constant temperature to a temperature cycle under DD. These results suggest that per$^{01}$ and tim$^{01}$ flies have a temperature-entrainable weak oscillatory mechanism. The fact that dClk$^{Jrk}$ and cyc$^{01}$ flies did not show any sign of the endogenous oscillation suggests that the per-less oscillatory mechanism may require CLK and CYC.

• Journal of Advanced Marine Engineering and Technology
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• v.12 no.1
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• pp.37-45
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• 1988

A calculating method of transient temperature distribution due to spot welding of thin plates is studied in this paper. Considering the contact stress between upper and lower plate and temperature-dependence of specific resistance and elastic limit of base metal, the model of calorific density of heat source was decided. Using 2-dimensional polar coordinates system, the governing equation of heat transfer was developed. The thermal cycles of various points were recorded using C-A thermocouples during spot welding procedure for mild steel plates of 1mm thickness, and those results were compared with the results of calculations presented in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.

• Korean Journal of Optics and Photonics
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• v.32 no.6
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• pp.266-275
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• 2021

In this paper, a method for evaluating optical-system performance and an athermal structure through thermal analysis of the Korsch telescope was studied. In the case of an optical system having a complex asymmetrical structure, there is a limit to implementing the satellite structure by applying the coefficient of thermal expansion (CTE) in the optical-design software, so it is difficult to evaluate the performance of the optical system against temperature changes. To solve this problem, using mechanical design software all length changes were implemented in all structures that affect the optical system according to temperature, and the value of the change in distance between optical components due to temperature change was organized. Also, the values of changes in shape and thickness of the optical components against temperature changes are organized in the optical-design software. All changes derived from both software packages were applied in the optical software to evaluate the performance of the optical system. As a result, it was found that the MTF for a spatial resolution of 71.4 cycles/mm was maintained at more than 25% in the range from 9 ℃ to 33 ℃. In addition, the performance of the optical system applying the improved structure was evaluated, by finding the structure that had the most influence on the optical system's performance change, and deriving an athermal structure to reduce the effect. As a result, it was found that the MTF for a resolution of 71.4 cycles/mm was maintained at over 67% in the range from 9 ℃ to 33 ℃.

• Smart Structures and Systems
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• v.6 no.2
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• pp.91-100
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• 2010

An experimental study was carried out to investigate the shape control of plates via embedded shape memory alloy (SMA) wires. An extensive body of literature proposes the use of SMA wires to actively modify the shape or stiffness of a structure; in most cases, however, the study focuses on modeling and little experimental data is available. In this work, a simple proof of concept specimen was built by attaching four prestrained SMA wires to one side of a carbon fiber laminate plate strip. The specimen was clamped at one end and tested in an environmental chamber, measuring the tip displacement and the SMA temperature. At heating, actuation of the SMA wires bends the plate; at cooling deformation is partially recovered. The specimen was actuated a few times between two fixed temperatures $T_c$ and $T_h$, whereas in the last actuation a temperature $T_f$ > $T_h$ was reached. Contrary to most model predictions, in the first actuation the transformation temperatures are significantly higher than in the following cycles, which are stable. Moreover, if the temperature $T_h$ is exceeded, two separate actuations occur during heating: the first follows the path of the stable cycles; the second, starting at $T_h$, is similar to the first cycle. An interpretation of the phenomenon is given using some differential scanning calorimeter (DSC) measurements. The observed behavior emphasizes the need to build a more comprehensive constitutive model able to include these effects.

• Transactions of the Korean hydrogen and new energy society
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• v.29 no.2
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• pp.148-154
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• 2018

This paper presents a comparative analysis of thermodynamic performance of ammonia-water Rankine cycles with and without regeneration and Kalina cycle for recovery of low-temperature heat source. Special attention is paid to the effect of system parameters such as ammonia mass fraction and turbine inlet pressure on the characteristics of the system. Results show that maximum net power can be obtained in the regenerative Rankine cycle for high turbine inlet pressures. However, Kalina cycle shows better net power and thermal efficiency for low turbine inlet pressures, and the optimum ammonia mass fractions of Kalina cycle are lower than Rankine cycles.

• Journal of the Korean Society of Clothing and Textiles
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• v.34 no.12
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• pp.2062-2072
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• 2010

This research evaluates the change of the water absorbency and drying speed of a quick-drying knit fabric by repeated laundering and laundering conditions and investigates the influence of laundering conditions on the functional properties of the knit fabric. Four factors of laundering conditions were studied: detergent, water hardness, water temperature, and frequency of rotation. Knit fabrics were washed for 25 laundering cycles in a drum-type washing machine with nine different laundering conditions derived from an orthogonal array. The properties of knit fabrics were measured with a drop absorption test, a strip test, and a drying time test. Relaxation shrinkage pointed to a change in the structural characteristics of the knit fabric. Wetting time was faster and wickability was greater in the knit fabrics that underwent 5 laundering cycles; in addition, there were no obvious changes in wetting time and wickability. The detergent was the most important factor in wetting time (40.4%) and wickability (60% or above). Water hardness, water temperature and RPM had less of an effect on wetting time and wickability. There were no significant differences between the levels of laundering conditions (except for detergent) on wetting time and wickability. Drying times with neutral and alkali were slower by repeated laundering; however, there was no obvious change in drying time. Hardness, water temperature and RPM had less of an impact on drying time.

• Journal of The Geomorphological Association of Korea
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• v.25 no.4
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• pp.89-101
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• 2018

In Mt. Halla, an arctic-alpine plant Diapensia lapponica var. obovata largely clings to rock surfaces. We observed the rock-surface temperatures of a rocky ridge on the summit area of the mountain from late April 2009 to early May 2010 in order to examine the diurnal and annual temperature variations and the thermal amplitude. We also investigated temperature regimes such as the frequency of freeze-thaw cycles and the temperature change, which might endanger the habitat through frost weathering. For comparison of slope aspects, temperature monitoring was carried out on the north and south faces of the same rocky ridge. The south face experiences the high daily maximum rock-surface temperatures and the high thermal amplitudes during the unfreezing season of May to November 2009. The temperature regimes are considered to exert physiological stress to the arctic-alpine plant. In addition, the south face shows the high frequency of freeze-thaw cycles during the seasonal freezing period of December 2009 to April 2010. This indicates that the south face is susceptible the exfoliation and granular disintegration of rock surfaces, which results in habitat destruction. As a consequence, the south face is believed to be less favorable for the establishment and growth of the arctic-alpine plant than the north face on the summit area of Mt. Halla.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.