• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2010년도 춘계학술발표대회
• /
• pp.18.2-18.2
• /
• 2010

For the past a few years, we have intensively researched the printable inorganic conductors and ZnO-based amorphous oxide semiconductors (AOSs) for thin-film transistors. For printable conductor materials, we have focused on the aqueous Ag and Cu ink which possess a variety of advantages, comparing with the conventional metal inks based on organic solvent system. The aqueous Ag ink was designed to achieve the long-term dispersion stability using a specific polymer which can act as a dispersant and capping agent, and the aqueous Cu ink was carefully formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. For printable ZnO-based AOSs, we have researched the noble way to resolve the critical problem, a high processing-temperature above $400^{\circ}C$, and recently discovered that Ga doping in ZnO-based AOSs promotes the formation of oxide lattice structures with oxygen vacancies at low annealing-temperatures, which is essential for acceptable thin-film transistor performance. The mobility dependence on annealing temperature and AOS composition was analyzed, and the chemical role of Ga are clarified, as are requirements for solution-processed, low-temperature annealed AOSs.

• Biotechnology and Bioprocess Engineering:BBE
• /
• 제8권6호
• /
• pp.338-348
• /
• 2003

In the past decade, considerable progress has been made in developing the appropriate biotechnology for microalgal mass cultivation aimed at establishing a new agro-industry. This review points out the main biological constraints affecting algal biotechnology outdoors and the requirements for making this biotechnology economically viable. One of them is the availability of a wide variety of algal species and improved strains that favorably respond to varying environmental conditions existing outdoors. It is thus just a matter of time and effort before a new methodology like genetic engineering can and will be applied in this field as well. The study of stress physiology and adaptation of microalgae has also an important application in further development of the biotechnology for mass culturing of microalgae. In outdoor cultures, cells are exposed to severe changes in light and temperature much faster than the time scale re-quired for the cells to acclimate. A better understanding of those parameters and the ability to rapidly monitor those conditions will provide the growers with a better knowledge on how to optimize growth and productivity. Induction of accumulation of high value products is associated with stress conditions. Understanding the physiological response may help in providing a better production system for the desired product and, at a later stage, give an insight of the potential for genetic modification of desired strains. The potential use of microalgae as part of a biological system for bioremediation/detoxification and wastewater treatment is also associated with growing the cells under stress conditions. Important developments in monitoring and feedback control of the culture behavior through application of on-line chlorophyll fluorescence technique are in progress. Understanding the process associated with those unique environmental conditions may help in choosing the right culture conditions as well as selecting strains in order to improve the efficiency of the biological process.

• 한국추진공학회:학술대회논문집
• /
• 한국추진공학회 2017년도 제48회 춘계학술대회논문집
• /
• pp.290-293
• /
• 2017

스크램젯 엔진용 초음속 연소기 연구를 위한 직결형, 연속식 연소 시험 설비를 개발하였다. 비행체 속도 마하 5, 연소기 입구 유속 마하 2를 가정하고, 시험 대상 연소기의 유로 단면은 높이 32 mm, 폭 70 mm로 가정하여 설비 요구 조건을 결정하였다. 이에 따라 설비는 유동 전압력 548 kPaA, 전온도 1,320 K, 유량 0.776 kg/s로 설계하였다. 설비는 터보형 압축기, 전기 가열기 및 연소식 가열기와 그 하류에 유동 가속을 위해 장착한 마하 2의 2차원 노즐로 구성하였다. 노즐 상류에서 산소를 추가 공급하여 연소식 공기 가열에 의한 산소 감소를 보상하도록 하였다. 배기는 별도의 감압은 하지 않았다. 저압, 저유량에서의 시운전을 수행하였으며, 설계점 운전은 향후 계획 중에 있다.

• 한국수산과학회지
• /
• 제25권5호
• /
• pp.371-382
• /
• 1992

자주새우, Crangon affinis 서식지의 동계$(7^{\circ}C$, 춘. 추계$(15^{\circ}C$ 및 하계$(25^{\circ}C$의 평균 수온대에서 일정기간 (0, 5, 11, 17, 25days) 절식시킨 후 체물질의 화학적조성, 산소소비 및 질소배설률을 측정하여 환경변화에 대한 생리적 적응의 일면을 조사하였다. 1. 자주새우의 체물질조성은 단백질 $68.6\%$, 지질 $7.0\%$, 탄수화물$4.1\%$, 키틴$6.3\%$, 그리고 회분은 $14.6\%$였다. 2. 기아상태 에 서도 고온일수록 탈피 빈도는 높았으며 동일 절식기간 동안 고온일수록 체중 및 체물질의 감소는 더욱 컸다. 3. 산소소비율은 기아가 계속됨에 따라 고온일수록 현저히 감소하는 경향을 보였으나 기아 25일 경과 후의 각 수온구별 산소소비율은 유사하였다. 4. 수온별 각 실험구간의 $Q_{10}$치는 실험온도구간에 큰 차이를 보이지 않았으나 기아가 계속됨에 따라 상당히 감소하였다. 5. 총배설질소량은 고온일수록 증가하였으며 배설질소의 주성분은 암모니아였다 그리고 총배설질소량은 어느 실험수온구에서나 기아가 계속됨에 따라 현저하게 증가하였다. 6. 기아 25일 경과후 수온 7, 15 및 $25^{\circ}C$에서 이화된 단백질은 각각 체단백질의 1.8, 2.5 및 $3.3\%$였다. 7. 기아초기의 O:N 원자비는 22-25이고, 기아상태가 지속됨 에 따라 8이하로 낮아져 기아동안의 에너지원으로 단백질을 이용함을 보였다.

• 한국결정성장학회:학술대회논문집
• /
• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
• /
• pp.258-292
• /
• 1996

In the last year great interest appears to YBCO thin films preparation on different substrate materials. Preparation of epitaxial film is a very difficult problem. There are many requirements to substrate materials that must be fullfilled. Main problems are lattice mismatch (misfit) and similarity of structure. From paper [1] or follows that difference in interatomic distances and angles of substrate and film is mire important problem than similarity of structure. In this work we present interatomic distances and angle relations between substrate materials belonging to ABCO4 group (where A-Sr or Ca, B-rare earth element, C-Al or Ga) of different orientations and YBCO thin films. There are many materials used as substrates for HTsC thin films. ABCO4 group of compounds is characterized by small dielectric constants (it is necessary for microwave applications of HTsC films), absence of twins and small misfit [2]. There most interesting compounds CaNdAlO4, SrLaAlO4 and SrLaGaO4 were investigated. All these compounds are of pseudo-perovskite structure with space group 14/mmm. This structure is very similar to structure of YBCO. SLG substrate has the lowest misfit (0.3%) and dielectric constant. For preparation of then films of substrates of this group of compound plane of <100> orientation are mainly used. Good quality films of <001> orientations are obtained [3]. In this case not only a-a misfit play role, but c-3b misfit is very important too. Sometimes, for preparation of thin films substrates of <001> and <110> orientations were manufactured [3]. Different misfits for different YBCO faces have been analyzed. It has been found that the mismatching factor for (100) face is very similar to that for (001) face so there is possibility of preparation of thin films on both orientations. SrLaAlO4(SLA) and SrLaGaO4(SLG) crystals of general formula ABCO4 have been grown by the Czochralski method. The quality of SLA and SLG crystals strongly depends on axial gradient of temperature and growth and rotation rates. High quality crystals were obtained at axial gradient of temperature near crystal-melt interface lower than 50℃/cm, growth rate 1-3 mm/h and the rotation rate changing from 10-20pm[4]. Strong anisotropy in morphology of SLA and SLG single crystals grown by the Czochralski method is clearly visible. On the basics of our considerations for ABCO4 type of the tetragonal crystals there can appear {001}, {101}, and {110} faces for ionic type model [5]. Morphology of these crystals depend on ionic-covalent character of bonding and crystal growth parameters. Point defects are observed in crystals and they are reflected in color changes (colorless, yellow, green). Point defects are detected in directions perpendicular to oxide planes and are connected with instability of oxygen position in lattice. To investigate facets formations crystals were doped with Cr3+, Er3+, Pr3+, Ba2+. Chromium greater size ion which is substituted for Al3+ clearly induces faceting. There appear easy {110} faces and SLA crystals crack even then the amount of Cr is below 0.3at.% SLG single crystals are not so sensitive to the content of chromium ions. It was also found that if {110} face appears at the beginning of growth process the crystal changes its color on the plane {110} but it happens only on the shoulder part. The projection of {110} face has a great amount of oxygen positions which can be easy defected. Pure and doped SLA and SLG crystals measured by EPR in the<110> direction show more intensive lines than in other directions which allows to suggest that the amount of oxygen defects on the {110} plane is higher. In order to find the origin of colors and their relation with the crystal stability, a set of SLA and SLG crystals were investigated using optical spectroscopy. The colored samples exhibit an absorption band stretching from the UV absorption edge of the crystal, from about 240 nm to about 550 m. In the case of colorless sample, the absorption spectrum consists of a relatively weak band in the UV region. The spectral position and intensities of absorption bands of SLA are typical for imperfection similar to color centers which may be created in most of oxide crystals by UV and X-radiation. It is pointed out that crystal growth process of polycomponent oxide crystals by Czochralski method depends on the preparation of melt and its stoichiometry, orientation of seed, gradient of temperature at crystal-melt interface, parameters of growth (rotation and pulling rate) and control of red-ox atmosphere during seeding and growth (rotation and pulling rate) and control of red-ox atmosphere during seeding and growth. Growth parameters have an influence on the morphology of crystal-melt interface, type and concentration of defects.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국수자원학회논문집
• /
• 제33권1호
• /
• pp.3-14
• /
• 2000

본 연구는 최근 하천유지유량에서 중요한 위상을 차지하고 있는 하천생태계에서 어류 서식처를 보전하고 복원하는데 필요한 적정 유량을 산정하는 것이 주된 목적이다. 어류 서식처를 적절히 유지할 수 있는 연과 월갈수량을 산정한다. 이 갈수량을 이용하여 점변 흐름에서 어류 서식처 제공에 필요한 수심과 유속을 모의하고, 또한 수온과 용존산소를 예측한다. 예측된 각 갈수량별 서식 조건과 각 성장단계별 어류 서식처 요구 조건을 도식적으로 비교하다. 이 과정을 남한강의 달철 본류에 위치한 3개 여울 구간에 적용하였다. 달천의 대표어종으로 피라미를 산정하였다. 달천의 피라미(Zacco paltypus)성장단계별 서식처 유지를 위한 적정유량은 수질보다는 수리 조건에 좌우되며, 그 양은 10년 빈도 연갈수량에서 2.33년 빌도 7일 연속갈수량까지의 범위를 갖는 것으로 나타났다.

• Annals of Clinical Neurophysiology
• /
• 제19권2호
• /
• pp.118-124
• /
• 2017

Electroencephalography (EEG) is frequently used to assist the diagnosis of brain death. However, to date there have been no guidelines in terms of EEG criteria for determining brain death in Korea, despite EEG being mandatory. The purpose of this review is to provide an update on the evidence and controversies with regarding to the utilization of EEG for determining brain death and to serve as a cornerstone for the development of future guidelines. To determine brain death, electrocerebral inactivity (ECI) should be demonstrated on EEG at a sensitivity of $2{\mu}V/mm$ using double-distance electrodes spaced 10 centimeters or more apart from each other for at least 30 minutes, with intense somatosensory or audiovisual stimuli. ECI should be also verified by checking the integrity of the system. Additional monitoring is needed if extracerebral potentials cannot be eliminated. Interpreting EEG at high sensitivities, which is required for the diagnosis of brain death, can pose a diagnostic challenge. Furthermore, EEG is affected by physiologic variables and drugs. However, no consensus exists as to the minimal requirements for blood pressure, oxygen saturation, and body temperature during the EEG recording itself, the minimal time for observation after the brain injury or rewarming from hypothermia, and how to determine brain death when the findings of ECI is equivocal. Therefore, there is a strong need to establish detailed guidelines for performing EEG to determine brain death.

• 한국토양비료학회지
• /
• 제45권2호
• /
• pp.248-252
• /
• 2012

본 연구는 공시 수생식물체 퇴비화 과정 중 산소 소비량과 소비패턴을 조사하기 위하여 식물이 고사된 11월에 수확한 갈대, 부들, 줄을 사용하여 퇴비화를 제조하였다. 수생식물체별 퇴비화 과정중 산소소비량을 조사한 결과 모든 수생식물의 퇴비화조에서 퇴비화 초기에 누적산소소비량이 급격하게 증가하여 약 15일째에 들어서 누적산소소비량의 증가가 둔화되는 경향이었다. 각각의 수생식물별로 누적산소 소비량은 초기에는 비슷한 소비량을 보이나 부들 > 줄 > 갈대 순으로 나타났다. 수생식물체별 퇴비화 과정중 온도변화는 퇴비화가 진행되면서 초기에 급격하게 증가된 후 서서히 감소되어서 약 $30{\sim}40^{\circ}C$ 정도로 안정화 되었다. 각 수생식물체의 퇴비화에서 최고온도까지 도달하는데 걸린 기간은 갈대 (7일) > 부들 (10일) > 줄 (11일) 순으로 나타났고, 퇴비화조 최고온도는 걸린 기간과 반대로 줄 ($72.2^{\circ}C$) > 부들($70.2^{\circ}C$) > 갈대 ($66.5^{\circ}C$) 순으로 나타났다. 최고온도 도달시까지 소비된 산소량은 부들 $12,485mg\;O_2\;kg^{-1}$ > 줄 $12,400mg\;O_2\;kg^{-1}$ > 갈대 $9,340mg\;O_2\;kg^{-1}$ 순으로 나타났는데 이는 각각의 식물체별 비중과 통기성에 따른 것으로 판단된다. 본 연구에서 제조한 수생식물을 이용한 퇴비는 유기물함량이 39.5~44.8%로 부산물비료 공정규격의 퇴비의 규격 50% 이상에 미치지 못하였으나 함유할 수 있는 유해 성분(As, Cd, Cu, Cr, Hg, Ni, Pb 및 Zn) 함량이 규격 이하로 적합하였고, 그 밖의 규격에서 염분(NaCl) 함량 0.01%, 수분함량 29.6~35.6% 및 유기물대 질소의 비 27.93~32.94로 퇴비 규격에 적합하였다.