• Title/Summary/Keyword: target materials

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Dual-Target Gene Silencing by Using Long, Synthetic siRNA Duplexes without Triggering Antiviral Responses

  • Chang, Chan Il;Kang, Hye Suk;Ban, Changill;Kim, Soyoun;Lee, Dong-ki
    • Molecules and Cells
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    • v.27 no.6
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    • pp.689-695
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    • 2009
  • Chemically synthesized small interfering RNAs (siRNAs) can specifically knock-down expression of target genes via RNA interference (RNAi) pathway. To date, the length of synthetic siRNA duplex has been strictly maintained less than 30 bp, because an early study suggested that double-stranded RNAs (dsRNAs) longer than 30 bp could not trigger specific gene silencing due to the induction of non-specific antiviral interferon responses. Contrary to the current belief, here we show that synthetic dsRNA as long as 38 bp can result in specific target gene silencing without non-specific antiviral responses. Using this longer duplex structure, we have generated dsRNAs, which can simultaneously knock-down expression of two target genes (termed as dual-target siRNAs or dsiRNAs). Our results thus demonstrate the structural flexibility of gene silencing siRNAs, and provide a starting point to construct multifunctional RNA structures. The dsiRNAs could be utilized to develop a novel therapeutic gene silencing strategy against diseases with multiple gene alternations such as viral infection and cancer.

Effects of Pretreatment for Controlling Internal Water Transport Direction on Moisture Content Profile and Drying Defects in Large-Cross-Section Red Pine Round Timber during Kiln Drying

  • Bat-Uchral BATJARGAL;Taekyeong LEE;Myungsik CHO;Chang-Jin LEE;Hwanmyeong YEO
    • Journal of the Korean Wood Science and Technology
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    • v.51 no.6
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    • pp.493-508
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    • 2023
  • Round timber materials of 600 mm length, cut from large-cross-section round timber of red pine (Pinus densiflora S. et Z.) of 450 mm width and 4.2 m length, were prepared as the target of kiln drying in this study. After treating the target materials through end sealing (ES), end sealing - kerfing (ES-K), lateral sealing - end sealing - boring (LS-ES-B), or lateral sealing - partial end sealing (LS-PES), the effects of the treatment on the incidence of drying defects were determined. The target materials with exposed lateral surface and sealed cross surface were steamed at the initial temperature of 65℃ above the official pest control temperature of 56℃, followed by kiln drying toward the final temperature of 75℃. The target materials with sealed lateral surfaces, on the other hand, were dried at the initial temperature of 90℃ at almost the maximum temperature of conventional kiln drying, as there is no risk of early check formation caused by surface moisture evaporation. The final temperature was set at approximately 100℃. The drying time, taken for the target materials with initial moisture content of 70%-80% to reach the target moisture content of 19%, varied across treatment conditions. The measured drying time was 1,146 hours (approximately 48 days) for the timber with sealed cross surface and 745 hours (approximately 31 days) for the timber with sealed lateral surface, until the moisture content reached the target level. The formation of surface checks could not be prevented in the control and ES groups, but a definite preventive effect was obtained for the LS-ES-B and LS-PES groups.

Characterization of Cu-Ni alloy thin films deposited by magnetron co-sputtering as a function of target configurations (마그네트론 코-스퍼터링에 의한 구리-니켈 합금박막 증착시 타겟의 구성방법에 따른 물성 분석)

  • SEO, Soo-Hyung;LEE, Jae-Yup;PARK, Chang-Kyun;PARK, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.1485-1487
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    • 2000
  • A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.

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Fabrication of ZnS-SiO2 Composite and its Mechanical Properties (방전플라즈마 소결법을 이용한 ZnS-SiO2 복합재료의 제조와 기계적 특성)

  • Shin, Dae-Hoon;Kim, Gil-Su;Lee, Young-Jung;Cho, Hoon;Kim, Young-Do
    • Journal of Powder Materials
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    • v.15 no.1
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    • pp.1-5
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    • 2008
  • ZnS-$SiO_2$ composite is normally used for sputtering target. In recent years, high sputtering power for higher deposition rate often causes crack formation of the target. Therefore the target material is required that the sintered target material should have high crack resistance, excellent strength and a homogeneous microstructure with high sintered density. In this study, raw ZnS and ZnS-$SiO_2$ powders prepared by a 3-D mixer or high energy ball-milling were successfully densified by spark plasma sintering, the effective densification method of hard-to-sinter materials in a short time. After sintering, the fracture toughness was measured by the indentation fracture (IF) method. Due to the effect of crack deflection by the residual stress occurred by the second phase of fine $SiO_2$, the hardness and fracture toughness reached to 3.031 GPa and $1.014MPa{\cdot}m^{1/2}$, respectively.

Deposition of copper oxide by reactive magnetron sputtering

  • Lee, Jun-Ho;Lee, Chi-Yeong;Lee, Jae-Gap
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.49.2-49.2
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    • 2010
  • Copper oxide films have been deposited on silicon substrates by direct current magnetron sputtering of Cu in O2 / Ar gas mixtures. The target oxidation occurring as a result of either adsorption or ion-plating of reactive gases to the target has a direct effect on the discharge current and the resulting composition of the deposited films. The kinetic model which relates the target oxidation to the discharge current was proposed, showing the one-to-one relationship between discharge current characteristics and film stoichiometry of the deposited films.

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Development and Performance of Cementitious Materials for Fire Resistance of Tunnel (터널 내화용 시멘트계 재료의 개발 및 성능 평가)

  • Won, Jong Pil;Choi, Seok Won;Park, Chan Gi;Park, Hae Kyun
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.26 no.4C
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    • pp.265-273
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    • 2006
  • This study aims at evaluation of the fire resistance performance of cementitious materials for fire protection of tunnel. For this purpose, the research procedure was divided into three parts. First, base mix proportion with different material type were determined by fire test. Second, the fire test of cementitious materials for fire resistance were performed on base mix proportions to evaluated their performance. Third, the performance of cementitious materials for fire resistance compare to the target value and existing commercial products. If the performance of developed cemetitious materials for fire resistance were satisfied the target value, this studies were stopped. But, this research return to first process if the performance of cementitious materials for fire resistance are not satisfied the target value. As a result of this study, the spalling did not happen for develop and existing commercial product. Also, developed cementitious materials for fire resistance are shown with excellent compressive strength, flexural strength, and bond strength, because it used a height density aggregate. And developed cementitious materials has sufficient resistance for fire.

Reliability Analysis on GFRP Bridge Decks for Target Reliability (목표 신뢰성에 대한 GFRP 교량 바닥판의 구조 신뢰성 해석)

  • Kim, Sang-Jin;Kim, Jin-Kyu
    • Journal of the Korean Society of Industry Convergence
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    • v.10 no.1
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    • pp.47-54
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    • 2007
  • Bridge decks are one of the main structural components that are most suitable for utilizing the advantages of FRP materials due to the high strength weight ratio of FRP materials. Design codes for the design of FRP bridge decks should be established to apply FRP materials for bridge decks effectively. At present, design codes are relatively well established for the use of FRP materials as reinforcements in concrete structures. However, design codes have not yet been provided for the structures made of FRP as a main construction material. In this study, for the purpose of preparing design code provisions, reliability analyses were performed to evaluate target level of safety and serviceability on GFRP decks. Based on the results, several guidelines for the development of design codes are suggested.

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Manufacturing and Macroscopic Properties of Cold Sprayed Cu-Ga Coating Material for Sputtering Target

  • Jin, Young-Min;Jeon, Min-Gwang;Park, Dong-Yong;Kim, Hyung-Jun;Oh, Ik-Hyun;Lee, Kee-Ahn
    • Journal of Powder Materials
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    • v.20 no.4
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    • pp.245-252
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    • 2013
  • This study attempted to manufacture a Cu-Ga coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and properties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. The results showed that coating layers with a thickness of 520 mm could be manufactured via the cold spray process under optimal conditions. With the Cu-Ga coating layer, the ${\alpha}$-Cu and $Cu_3Ga$ were found to exist inside the layer regardless of annealing heat treatment. The microstructure that was minute and inhomogeneous prior to thermal treatment changed to homogeneous and dense with a more clear division of phases. A sputtering test was actually conducted using the sputtering target Cu-Ga coating layer (~2 mm thickness) that was additionally manufactured via the cold-spray coating process. Consequently, this test result confirmed that the cold sprayed Cu-Ga coating layer may be applied as a sputtering target material.