• Title/Summary/Keyword: tape method

Search Result 605, Processing Time 0.031 seconds

Fabrication, AC Loss Measurement and Analysis of Bi-2223 Conductors with Respect to Various Twist Pitch (트위스트 피치를 고려한 Bi-2223 선재 제작과 AC 손실 측정 및 분석)

  • Jang, Mi-Hye;Chu, Yong;Lim, Jun-Hyung;Joo, Jin-Ho;Ko, Tae-Kuk
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.49 no.11
    • /
    • pp.589-595
    • /
    • 2000
  • In this papre, AC losses of Bi-2223 tapes with different twist pitch of superconducting core were fabricated, measured and analyzed. These samples produced by a powder-in-tube method are multi-filamentary tape with Ag matrix. Also, it's produced by non-twist and different twist pitch(8, 10, 13, 30, 50, 70 mn). The critical current measurement was carried out under the environment in Liquid nitrogen and in zero field by 4-probe method. And the AC loss measurement was carried out under the environment of applied time-varying transport current by transport method. From experiment, the critical current is larger non-twist than twisted filament. And, the AC loss by Norris equation is higher non-twisted tape than 13mm twisted tape. Also, it is confirmed that of AC loss of tape having non-twist pitch larger than those having differnet twist pitch.

  • PDF

The Influence of Unloading Taping Method Using Non-elastic Tape on the Pain, Opening Mouth, Functional Level, Quality of Life in Patients With Temporomandibular Joint Disorder (비탄력 테이프를 이용한 무부하 테이핑 기법이 턱관절장애 환자의 통증 수준, 개구범위, 기능적 수준, 삶의 질에 미치는 영향)

  • Hwang, Jea-hoon;Kim, Suhn-yeop
    • Physical Therapy Korea
    • /
    • v.23 no.3
    • /
    • pp.29-39
    • /
    • 2016
  • Background: In the treatment of temporomandibular joint (TMJ) disorder, the goals of traditional physical therapy are not only to reduce the inflammatory process leading to pain, but also to decrease joint overload and muscle hyperactivity. To achieve those goals, physical therapists generally use a photo-therapy, joint mobilization, and massage. Objects: To examine the impact of an unloading technique using non-elastic taping on the pain, opening mouth, functional level, and quality of life in patients with TMJ disorder. Method: Twenty patients with TMJ disorder were included in this study and randomly divided into the experimental ($n_1$=10), and control ($n_2$=10) groups. Traditional physical therapy including massage and stretching for 30 min was performed in both groups. Non-elastic taping was performed in the experimental group after traditional physical therapy, and they were recommended to keep the tape attached for 12 hours. Outcomes for pain, functional level, and quality of life were measured using a survey. The opening mouth was measured using a general ruler. Result: Significant differences were observed in the pain level, opening mouth, functional level, and quality of life after the intervention and on follow-up in both groups. However, we found that while the levels of all parameters were maintained throughout the follow-up period in the experimental group, the functional status level was not maintained throughout the follow-up period in the control group. Conclusion: Our unloading technique using non-elastic tape results comparable to those achieved by traditional physical therapy in the treatment of TMJ. However, the unloading taping method using non-elastic tape is more effective than traditional physical therapy in maintaining the impact of intervention.

Structural Analysis and Failure Prediction of Tape-Wrapped Structures (테이프래핑 구조물의 구조 해석 및 파단 예측)

  • Goo, Nam-Seo;Park, Hoon-Cheol;Yoon, Kwang-Joon;Lee, Yeol-Hwa
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.32 no.3
    • /
    • pp.17-21
    • /
    • 2004
  • Tape-wrapped structures have been generally used in nozzle parts of guided missiles. A continuous band of woven composite material is wrapped around a mandrel that is designed to produce real products. After going through a vacuum bagging process, this woven composite material is cured in a high-pressure autoclave or hydroclave. However, tape-wrapped structures are difficult to analyze because of its large thickness and inclined lay-up. The present study investigates the method of analysis and failure prediction of tape-wrapped structures. The four-point bending test and its finite element analysis were performed to study how to model tape-wrapped structures and investigate their failure characteristics.

Flying Characteristics of Running Tape above Rotating Head (II) -Experimental Analysis- (회전헤드에 대한 주행테이프의 부상특성 (II) -실험해석-)

  • 민옥기;김수경
    • Transactions of the Korean Society of Mechanical Engineers
    • /
    • v.15 no.1
    • /
    • pp.107-119
    • /
    • 1991
  • This dissertation analyzes the running mechanism of flexible and thin tape above rotating head through the experiment. The scope of study is confined to measure the vertical deformation of running tape under hydrodynamic pressure invoking phenomena of elasto-hydrodynamic lubrication between the protruded bump on a rotating cylinder ad the running tape. Experimental system is devised to measure the vertical deflection of the running tape by opto-electronical displacement gauge, which enables to detect microscopic surface deflection of high frequency. Thorough the tests of small specimens of groove and bump, the accuracy and reliability of this experimental method is confirmed and achieved an accuracy within 5%(2.mu.m) error for the microscopic deflection with high frequency. In experimental works, the effects of bump size on flying characteristics of the tape were evaluated and examined. For the vertical deformation of the running tape. the numerical results and its trend agree qualitatively with the experimental ones.

Study on the Optimal Release Condition of Wafer Level Molding Process using Plasma Surface Treatment Method (플라즈마 표면처리 방법을 이용한 웨이퍼레벨 몰딩 공정용 기판의 최적 이형조건 도출)

  • Yeon, Simo;Park, Jeonho;Lee, Nukkyu;Park, Sukhee;Lee, Hyejin
    • Journal of Institute of Convergence Technology
    • /
    • v.5 no.1
    • /
    • pp.13-17
    • /
    • 2015
  • In wafer level molding progress, the thermal releasing failure phenomenon is shown up as the important problem. This phenomenon can cause the problem including the warpage, crack of the molded wafer. The thermal releasing failure is due to the insufficiency of adhesion strength degradation of the molding tape. To solve this problem, we studied experimental method increasing the release property of the molding tape through the plasma surface treatment on the wafer substrate. In this research, the vacuum plasma treatment system is used for release property improvement of the molding tape and controls the operating condition of the hydrophilic($O_2$, 100kW, 10min) and hydrophobic($C_2F_6$, 200kW, 10min). In order to perform the peeling test for measuring the releasing force precisely, we remodel the micro scale material property evaluation system developed by Korea institute of industrial technology. In case of hydrophilic surface treatment on the wafer substrate, we can figure out the releasing property of molding tape increase. In order to grasp the effect that it reaches to the release property increase when repeating the hydrophilic treatment, we make an experiment with twice treatment and get the result to increase about 12%. We find out the hydrophilic surface treatment method using plasma can improve releasing property of molding tape in the wafer level molding process.

A Novel Patterning Method for Silver Nanowire-based Transparent Electrode using UV-Curable Adhesive Tape (광경화 점착 테이프를 이용한 은 나노와이어 기반 투명전극 패터닝 공법)

  • Ju, Yun Hee;Shin, Yoo Bin;Kim, Jong-Woong
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.27 no.3
    • /
    • pp.73-76
    • /
    • 2020
  • Silver nanowires (AgNWs) intrinsically possess high conductivity, ductility, and network structure percolated in a low density, which have led to many advanced applications of transparent and flexible electronics. Most of these applications require patterning of AgNWs, for which photolithographic and printing-based techniques have been widely used. However, several drawbacks such as high cost and complexity of the process disturb its practical application with patterning AgNWs. Herein, we propose a novel method for the patterning of AgNWs by employing UV-curable adhesive tape with a structure of liner/adhesive layer/polyolefin (PO) film and UV irradiation to simplify the process. First, the UV-curable adhesive tape was attached to AgNWs/polyurethane (PU), and then selectively exposed to UV irradiation by using a photomask. Subsequently, the UV-curable adhesive tape was peeled off and consequently AgNWs were patterned on PU substrate. This facile method is expected to be applicable to the fabrication of a variety of low-cost, shape-deformable transparent and wearable devices.

Analysis of normal Bone propagation characteristics in a high-temperature superconducting tape (고온 초전도체 테이프의 상전도 영역 전파 특성 해석)

  • 정신근;설승윤
    • Progress in Superconductivity and Cryogenics
    • /
    • v.3 no.1
    • /
    • pp.11-15
    • /
    • 2001
  • Stability of a Bi-2223/Ag tape was studied by using a numerical model considering the temperature distribution of cross-sectional area. The dynamic evolution of normal zone of a HTS tape can be shown by the developed two-dimensional Program using finite difference method. Two kinds of analyses are compared to quantify the critical disturbance energy for quenching HTS tapes. One is the length-thickness(x-r) side and the other is the length-width(x-z) side. For each case. the governing energy balance equations and corresponding boundary conditions are formulated. The results of analyses shows that the critical disturbance energies for each cases seem to be very close for considered Bi-2223/Ag tape .

  • PDF

Analysis on Quench Propagation Characteristics of HTS Tape (고온 초전도 테이프 선재의 퀀치 전파 특성 해석)

  • Lee, Ji Gwang;Kim, Ji Hun;Ryu, Gyeong U;Cha, Gwi Su;Han, Song Yeop
    • Progress in Superconductivity and Cryogenics
    • /
    • v.2 no.1
    • /
    • pp.35-35
    • /
    • 2000
  • The main issues for the power application of High Tc superconducting tape are lower AC loss and higher stability conditions. HTS tape has large stability margin by high heat capacity of superconductor itself and high temperature margin. But, it can be damaged by continuous heat generation at quench point, because normal zone propagation velocity by generating heat is very low. Here, we analyze the quench propagation characteristics using finite element method for BSCCO-2223 HTS tape.

Fabrication of Joining of 37 Multi-filamentary BSCCO(2223) Tape (37심 BSCCO(2223) 다심 초전도선재의 접합공정 연구)

  • 김정호;오승진;김규태;김호진;주진호;나완수
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
    • /
    • 2001.02a
    • /
    • pp.3-5
    • /
    • 2001
  • We evaluated the electrical properties of 37 multifilamentary jointed tapes processed by superconducting joint. In the superconducting joining method. a lap-joint was used. Tapes were selectively etched and exposed superconducting cores of the two tapes were brought into contact with each other and then only the joined region was uniaxially pressed in the range of 1,000 to 2,500 MPa. The current carrying capacity and n-value of the jointed tape were evaluated as a function of uniaxial pressure. The highest current carrying capacity and n-value were obtained to be 58%, 26% for the jointed tape to the tape itself.

  • PDF