• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.315-318
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• 1999

Bi$_{2}Sr_{2}CaCu_{2}O_{\delta}$ superconducting films were rapidly fabricated on copper tape by liquid reaction between a Cu-free precursor and Cu tape (LiReac-PreCu) method. Those thick films were well oriented along the c-axis. The precursor was made by melt-quenched technology using twin roller. The melt-quenched films were transparent and glossy yellow in appearance. These films which were the compostion of Bi$_2SrCaO_y$, Bi$_3Sr_2CaO_z$ were placed on copper tape and then heated at various temperatures for several minutes in air. They were analyzed using X-ray powder diffraction, SEM, a DC four-probe method. The mechanism of superconducting phase formation . from the melt-quenched precursor on Cu tape was studied

• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.622-627
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• 2016

The effects of the debinding atmosphere on the properties of sintered reaction-bonded $Si_3N_4$ (SRBSN) ceramics prepared by tape casting method were investigated. Si green tape was produced from Si slurry of Si powder, using 11.5 wt% polyvinyl butyral as the organic binder and 35 wt% dioctyl phthalate as the plasticizer. The debinding process was conducted in air and $N_2$ atmospheres at $400^{\circ}C$ for 4 h. The nitridation process of the debinded Si specimens was performed at $1450^{\circ}C$, followed by sintering at $1850^{\circ}C$ and 20 MPa. The results revealed that the debinding atmosphere had a significant effect on $Si_3N_4$ densification and thermal conductivity. Owing to the higher sintered density and larger grain size, the thermal conductivity of $Si_3N_4$ specimens debinded in air was higher than that of the samples debinded in $N_2$. Thus, debinding in air could be suitable for the manufacture of high-performance SRBSN substrates by tape casting.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.49-53
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• 2013

Recently, studies about application of magnesium alloy sheet to automotive bodies are on the increase. For application to automotive bodies, researches about characteristics of resistance spot welding of magnesium alloy sheet are essential. Electrode life of resistance spot welding of magnesium alloy is very short due to sticking of magnesium alloy to copper alloy electrode. To increase electrode life, most effective method is inserting cover plate between electrode and magnesium sheet. But application of cover plate to actual process is difficult and decreases welding productivity. Process tape supplied automatically as cover plate can minimize lose of productivity and increase welding quality. In this study, resistance spot welding of magnesium alloy is carried out with applying process tape. Acceptable welding current region according to electrode force and welding time is determined.

• Progress in Superconductivity and Cryogenics
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• v.7 no.3
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• pp.34-38
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• 2005

Multi-stacked HTS tapes are needed to conduct large current in the power application. In this paper, magnetization losses of the multi-stacked YBCO coated conductor and the BSCCO tape have been measured and compared. Magnetization losses of single tape, 2-stacked, 3-stacked and 4-stacked HTS tapes have been presented in this paper. Multi-stacked tapes have been fabricated using face-to-face type stacking method. Measurements of magnetization loss were performed under various angle of external magnetic field to consider the anisotropic characteristics of HTS tapes. Test results show that loss density per unit volume decreased for both YBCO coated conductors and BSCCO tapes when the stacking number of tapes is increased. The magnetization losses of YBCO CC are larger than those of BSCCO tapes when the external magnetic field is increased.

• Progress in Superconductivity and Cryogenics
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• v.7 no.3
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• pp.13-16
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• 2005

Multi-stacked HTS tapes are needed to conduct large current in the power application. In this paper magnetization losses of the multi-stacked YBCO coated conductor and the BSCCO tape have been measured and compared. Magnetization losses of single tape, 2-stacked, 3-stacked and 4-stacked HTS tapes have been presented in this paper. Multi-stacked tapes have been fabricated using face-to-face type stacking method. Measurements of magnetization loss were performed under various stacked of external magnetic field to consider the anisotropic characteristics of HTS tapes. Test results show that loss density per unit volume decreased for both YBCO coated conductors and BSCCO tapes when the stacking number of tapes is increased. As the external magnetic field decreased, the ratio of decrement has risen because the full penetration magnetic field(Bp) of the multi-stacked tape is larger than that of the single tape.

• Proceedings of the KIEE Conference
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• summer
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• pp.1010-1012
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• 2004

AC loss is an important factor in the development of superconducting tapes and superconducting power applications. In this paper we measured and compared characteristics of BSCCO tape and YBCO Coated Conductor(YBCO CC). BSCCO tape was fabricated by PIT method. We measured critical current density and transport current loss of it. Also, YBCO CC tape consist of substrate. buffer, YBCO and metal layers. We measured critical current density on variations of external magnetic field and transport current loss of these cases. The results of measurement show that normalized critical current of YBCO CC is smaller then that of BSCCO tape in the external magnet field. According to the results. measured loss and calculated of the YBCO CC show the same tendency.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.277-280
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• 2002

It is well known that the critical current of a HTS tape has anisotropic characteristic in magnetic field. We are interested in critical current density distribution of a HTS tape. We assumed the experimentally obtained Ic-B curves do represent the local properties of HTS tapes and calculated the critical current density distribution of HTS tapes using numerical method. Also we predicted the critical current of the tapes.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2001.02a
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• pp.185-188
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• 2001

Magnetization loss of a Bi-2223 tape in magnetic fields parallel to the tape surface was measured by a magnetization method. The results indicate that the magnetization loss is hysteretic because the measured loss agrees well with calculated one from a critical state model. In the full field penetration case the magnetization loss increases with the frequency but in the partial field penetration case the influence of the frequency is opposite.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.673-676
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• 1999

We fabricated green sheet by tape casting method with fluormica glass-ceramic powders for fabrication of low temperature co-firing substrate. After ball milling with organic additives, we investigated green strength and density of green sheets which were casted by doctor blade machine. Green sheets were sintered at 700 ~ 1,00$0^{\circ}C$ for 1 ~3hrs. Microstructure, linear shrinkage and dielectric constant of substrates were surveyed.