Effects of Debinding Atmosphere on Properties of Sintered Reaction-bonded Si3N4 Prepared by Tape Casting Method |
Park, Ji-Sook
(Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology)
Lee, Sung-Min (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) Han, Yoon-Soo (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) Hwang, Hae-Jin (Department of Materials Science and Engineering, Inha University) Ryu, Sung-Soo (Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology) |
1 | J. S. Lee, J. H. Mun, B. D. Han, D. S. Park, and H. D. Kim, "Densification Behavior of Reaction-Bonded Silicon Nitride Prepared by Using Coarse Si Powders," J. Korean Ceram. Soc., 39 [1] 45-50 (2002). DOI |
2 | A. J. Moulson, "Review Reaction-bonded Silicon Nitride: Its Formation and Properties," J. Mater. Sci., 14 [5] 1017-51 (1979). DOI |
3 | J. R. G. Evans and A. J. Moulson, "The Effect of Impurities on the Densification of Reaction-bonded Silicon Nitride (RBSN)," J. Mater. Sci., 18 [12] 3721-28 (1983). DOI |
4 | G. Ziegler, J. Heinrich, and G. Wotting, "Review Relationships between Processing, Microstructure and Properties of Dense and Reaction-bonded Silicon Nitride," J. Mater. Sci., 22 [9] 3041-86 (1987). DOI |
5 | R. G. Pigeon, A. Varma, and A. E. Miller, "Some Factors Influencing the Formation of Reaction-bonded Silicon Nitride," J. Mater. Sci., 28 [7] 1919-36 (1993). DOI |
6 | Y. Zhou, X. Zhu, and K. Hirao, "Sintered Reaction-bonded Silicon Nitride with High Thermal Conductivity and High Strength," Int. J. Appl. Ceram. Technol., 5 [2] 119-26 (2008). DOI |
7 | M. N. Rahaman and A. J. Moulson, "The Removal of Surface Silica and its Effect upon Silicon Nitridation Kinetics," J. Mater. Sci. 16 [8] 2319-21 (1981). DOI |
8 | B. Lei, O. Babushkin, and R. Warren, "Nitridation Study of Reaction-bonded Silicon Nitride in situ by High Temperature X-Ray Diffraction," J. Eur. Ceram. Soc., 17 [9] 1113-18 (1997). DOI |
9 | B. T. Lee, Y. J. Yoon, and K. H. Lee, "Microstructural Characterization of Electroconductive -TiN Composites," Mater. Lett., 47 [1] 71-6 (2001). DOI |
10 | J. A. Mangels, "Sintered Reaction Bonded Silicon Nitride," Ceram. Eng. Sci. Proc., 2 [7-8] 589-603 (1982). |
11 | B. T. Lee, J. H. Yoo, and H. D. Kim, "Fabrication of Silicon Nitride Ceramics Using Semiconductor-Waste-Si Sludge," Korean J. Mater. Res., 9 [12] 1170-75 (1999). |
12 | Y. J. Park, M. J. Park, J. M. Kim, J. W. Lee, J. W. Ko, and H. D. Kim, "Sintered Reaction-bonded Silicon Nitrides with High Thermal Conductivity : The Effect of the Starting Si Powder and Diluents," J. Eur. Ceram. Soc., 34 [5] 1105-13 (2014). DOI |
13 | W. G. Yoon, J. J. Kim, and S. H. Cho, "Effects of Particle Size Distribution of Alumina on Behaviors of Tape Casting," J. Korean Ceram. Soc., 34 [11] 1173-81 (1997). |
14 | J. S. Sung, K. D. Koo, and C. K .Yoon, "Effect of Binder Burnout Temperature on Sintering Shrinkage of Multilayer Ceramics," J. Korean Ceram. Soc., 33 [12] 1373-79 (1996). |
15 | S. C. Singhal, "Thermodynamics and Kinetics of Oxidation of Hot-pressed Silicon Nitride," J. Mater. Sci., 11 [3] 500-9 (1976). DOI |
16 | B. R. Golla, J. W. Ko, J. M. Kim, and H. D. Kim, "Effect of Particle Size and Oxygen Content of Si on Processing, Microstructure and Thermal Conductivity of Sintered Reaction Bonded ," J. Alloys Compd., 595 60-6 (2014). DOI |
17 | W. Y. Park, D. S. Park, H. D. Kim, and B. D. Han, "Sintering and Mechanical Properties of Silicon Nitride Prepared with a Low-cost Silicon Nitride Powder," J. Korean Ceram. Soc., 38 [11] 987-92 (2001). |
18 | J. S. Park, H. J. Lee, S. S. Ryu, S. M. Lee, H. J. Hwang, and Y. S. Han, "Optimization of Binder Burnout for Reaction Bonded Substrate Fabrication by Tape Casting Method," J. Korean Ceram. Soc., 52 [6] 435-40 (2015). DOI |
19 | K. Negita, "Effective Sintering Aids for Ceramics," J. Mater. Sci. Lett., 4 [6] 755-58 (1985). DOI |
20 | M. Liehr, J. E. Lewis, and G. W. Rubloff, "Kinetics of High-temperature Thermal Decomposition of on Si(100)," J. Vac. Sci. Technol. A, 5 [4] 1559-62 (1987). DOI |
21 | F. W. Smith and G. Ghidini, "Reaction of Oxygen with Si(111) and (100): Critical Conditions for the Growth of ," J. Electrochem. Soc., 129 [6] 1300-6 (1982). DOI |
22 | Y. Zhou, H. Hyuga, D. Kusano, Y. I. Yoshizawa, T. Ohji, and K. Hirao, "Review Article: Development of High-Thermal-Conductivity Silicon Nitride Ceramics," J. Asian. Ceram. Soc., 3 221-29 (2015). DOI |
23 | D. Starodub, E. P. Gusev, E. Garfunkel, and T. Gustafsson, "Silicon Oxide Decomposition and Desorption during the Thermal Oxidation of Silicon," Surf. Rev. Lett., 6 [1] 45-52 (1999). DOI |
24 | E. A. Gulbransen and S. A. Jansson, "The High-Temperature Oxidation, Reduction, and Volatilization Reactions of Silicon and Silicon Carbide," Oxid. Met., 4 [3] 181-201 (1972). DOI |
25 | X. Zhu, Y. Zhou, K. Hirao, T. Ishigaki, and Y. Sakka, "Potential Use of only in Producing Dense Ceramics with High Thermal Conductivity by Gas Pressure Sintering," Sci. Technol. Adv. Mater., 11 [6] 1-11 (2010). |
26 | M. Kitayama, K. Hirao, M. Toriyama, and S. Kanzaki, "Thermal Conductivity of : I, Effects of Various Microstructural Factors," J. Am. Ceram. Soc., 82 [11] 3105-12 (1999). DOI |
27 | X. Zhu, Y. Zhou, and K. Hirao, "Processing and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride. I: Effect of Si Powder Characteristics," J. Am. Ceram. Soc., 89 [11] 3331-39 (2006). DOI |
28 | K. H. Kwak, C. Kim, I. S. Han, and K. S. Lee, "Thermal Shock and Hot Corrosion Resistance of Fabricated by Nitrided Pressureless Sintering," J. Korean Ceram. Soc., 46 [5] 478-83 (2009). DOI |
29 | J. S. Lee, J. H. Mun, B. D. Han, D. S. Park, and H. D. Kim, "Effect of Raw-Si Particle Size on the Mechanical Properties of Sintered RBSN," J. Korean Ceram. Soc., 38 [8] 740-48 (2001). |
30 | M. J. Choi, T. W. Roh, C. Park, D. S. Park, and H. D. Kim, "The Study of Reaction Bonded Silicon Nitride Fabricated Under Static Nitrogen Pressure," J. Korean Ceram. Soc., 37 [5] 505-10 (2000). |
31 | S. K. Lee, J. D. Morreti, M. J. Readey, and B. R. Lawn, "Thermal Shock Resistance of Silicon Nitrides Using an Indentation-Quench Test," J. Am. Ceram. Soc., 85 [1] 279-81 (2002). DOI |
32 | K. Hirao, Y. Zhou, H. Hyuga, T. Ohji, and D. Kusano, "High Thermal Conductivity Silicon Nitride Ceramics," J. Korean Ceram. Soc., 49 [4] 380-84 (2012). DOI |
33 | B. C. Bae, D. S. Park, W. C. Seo, K. S. Bang, and C. Park, "Microstructural Development of Ceramics Containing Aligned Whisker Seeds," J. Ocean Eng. Technol., 23 [5] 32-8 (2009). |