• Title/Summary/Keyword: surface mount device

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An Inspection System for Measuring Feeding Accuracy of Tape Feeders (테이프 피더의 부품공급 정밀도 측정을 위한 검사 시스템)

  • Jo, Tae-Hun;Lee, Seong-Jun
    • Journal of Institute of Control, Robotics and Systems
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    • v.8 no.7
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    • pp.573-577
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    • 2002
  • A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++on Windows NT with easily usable GUI. Using this system, we can automatically measure and inspect the quality of all feeders in production process by analyzing the measurement results statistically.

The Temperature Properties of Inductor due to Current Injection (전류인가에 따른 인덕터의 온도 특성)

  • Kim, Ki-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.494-495
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    • 2007
  • As a pocket size electronic device have developed and electronic parts is increased, it need dual face soldering using SMT(Surface Mount Technology) and it can be getting high density soldering. Inductor is one of their electronic parts using SMT and inductor was developed to make electromagnetic energy. In this study, it is analyzed temperature properties of surface mount type Inductor due to current injection which is satisfied the demand of utmost small size and the substance of high density simultaneously.

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The Study on the optimized LED module of VMS for saving energy (에너지 절감을 위한 VMS LED 모듈 최적화 연구)

  • Kim, Young-Rok;Lee, Suk-Ki
    • International Journal of Highway Engineering
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    • v.13 no.4
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    • pp.231-238
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    • 2011
  • Variable message signs(VMS) in use are being displaying with the LED device as the luminous source, and it is a recent trend to be changed from the Lamp type to the Surface-Mount Devices(SMD) type. The LED device leads to get VMS display brightly and clearly, leading to have visibility and legibility better than the existing VMS. However, the lights which display off the road, the unnecessary energy, might have negative effect on ecosystem. This study developed the way of getting the lights be displayed only to drivers without the unnecessary energy and estimated the energy efficiency of the development by the optical testing. As a result, this study showed that the energy consumption of the developed display device appeared to decrease by about 36.1% compared to the existing device. Also the upward and downward angle of the lights changed from an angle of $24^{\circ}C$ to $0^{\circ}C$and from an angle of $-24^{\circ}C$ to $-11^{\circ}C$, respectively. Therefore, it anticipates that the developed device would benefit highway safety due to an improvement in visibility and legibility compared to the existing VMS and the energy consumption would be less lower than the existing VMS.

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향)

  • Lee, Young-Chul;Kim, Kwang-Seok;Ahn, Ji-Hyuk;Yoon, Jeong-Won;Ko, Min-Kwan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.48 no.11
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    • pp.1035-1040
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    • 2010
  • The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

Efficient Mechanism for QFN Solder Defect Detection (QFN 납땜 불량 검출을 위한 효율적인 검사 기법)

  • Kim, Ho-Joong;Cho, Tai-Hoon
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2016.05a
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    • pp.367-370
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    • 2016
  • QFN(Quad Flat No-leads package) is one of the SMD(Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network(CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image(Red, Blue, Green) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. Later, further research is needed to detect other QFN.

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Design and Control of Jetting Dispenser Driven by Piezoelectric Actuator (압전 작동기로 구동되는 젯팅 디스펜서의 설계 및 제어)

  • Choi, Min-Kyu;Nguyen, Quoc-Hung;Yun, Bo-Young;Choi, Seung-Bok
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.16 no.11 s.116
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    • pp.1165-1171
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    • 2006
  • This paper presents a new type of jetting dispenser for the integrated circuit (IC) fabrication and surface mount technology The proposed system is featured by the piezoelectric actuator and hydraulic magnification device. After describing structural component of the dispensing mechanism and its operation principle, both the fluid modeling and the hydraulic magnification modeling are undertaken with a lumped-parameter method based on the analogy of the fluid system and mechanical system. A mathematical governing equation is then derived by integrating the fluid model with the mechanical model of the driving piston and piezoelectric actuator. Subsequently, in order to achieve a desired dispensing amount, control algorithm adjusting duty cycle of the driving voltage is synthesized and control responses are presented in time domain.

Design and Control of Jetting Dispenser Driven by Piezoelectric Actuator (압전 작동기로 구동되는 젯팅 디스펜서의 설계 및 제어)

  • Choi Min-Kyu;Nguyen Quoc Hung;Yun Bo-Young;Choi Seung-Bok
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2006.11a
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    • pp.428-433
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    • 2006
  • This paper presents a new type of jetting dispenser for the integrated circuit(IC) fabrication and surface mount technology. The proposed system is featured by the piezoelectric actuator and hydraulic magnification device. After describing structural component of the dispensing mechanism and its operation principle, both the fluid modeling and the hydraulic magnification modeling are undertaken with a lumped-parameter method based on the analogy of the fluid system and mechanical system. A mathematical governing equation is then derived by integrating the fluid model with the mechanical model of the driving piston and piezoelectric actuator. Subsequently, in order to achieve a desired dispensing amount, control algorithm adjusting duty cycle of the driving voltage is synthesized and control responses are presented in time domain.

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A Tape Feeder Inspection System for Measuring Feeding Accuracy

  • Cho, Tai-Hoon
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.98.4-98
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    • 2001
  • A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens ...

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Experimental investigation of magnetic-mount PZT-interface for impedance-based damage detection in steel girder connection

  • Ryu, Joo-Young;Huynh, Thanh-Canh;Kim, Jeong-Tae
    • Structural Monitoring and Maintenance
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    • v.4 no.3
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    • pp.237-253
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    • 2017
  • Among various structural health monitoring technologies, impedance-based damage detection has been recognized as a promising tool for diagnosing critical members of civil structures. Since the piezoelectric transducers used in the impedance-based technique should be bonded to the surface of the structure using bonding layers (e.g., epoxy layer), it is hard to maintain the as-built condition of the bonding layers and to reconfigure the devices if needed. This study presents an experimental investigation by using magnetically attached PZT-interface for the impedance-based damage detection in bolted girder connections. Firstly, the principle of the impedance-based damage detection via the PZT-interface device is outlined. Secondly, a PZT-interface attachment method in which permanent magnets are used to replace the conventional bonding layers is proposed. Finally, the use of the magnetic attraction for the PZT-interface is experimentally evaluated via detecting the bolt-loosening events in a bolted girder connection. Also, the sensitivity of impedance signatures obtained from the PZT-interface is analyzed with regard to the interface's material.

Design of a Dual-Drive Mechanism for Precision Gantry

  • Park, Heung-Keun;Kim, Sung-Soo;Park, Jin-Moo;Daehie Hong;Cho, Tae-Yeon
    • Journal of Mechanical Science and Technology
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    • v.16 no.12
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    • pp.1664-1672
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    • 2002
  • Gantry mechanisms have been widely used for precision manufacturing and material handling in electronics, nuclear, and automotive industries. Dual-drive servo mechanism is a way to increase control bandwidth, in which two primary axes aligned in parallel are synchronously driven by identical servo motors. With this mechanism, a flexible coupling (compliance mechanism) is often introduced in order to avoid the damage by the servo mismatch between the primary drives located at each side of gantry. This paper describes the design guidelines of the dual-drive servo mechanism with focus on its dynamic characteristics and control ramifications. That is, the effect on the system bandwidth which is critical on the system performance, the errors and torques exerted on guide ways in case of servo mismatch, the vibration characteristics concerned with dynamic error and settling time, and the driving force required at each axis for control are thoroughly investigated.