• 제목/요약/키워드: surface mount device

검색결과 44건 처리시간 0.033초

Feeder Re-assign Problem in a Surface Mount Device with a Piano-Type Multi-Headed Gantry

  • Tae, Hyunchul;Kim, Byung-In
    • Industrial Engineering and Management Systems
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    • 제12권4호
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    • pp.330-335
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    • 2013
  • A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

SMD의 패드 정렬이 PCB 전송 특성에 미치는 영향 (Effects on PCB Transmission Characteristics by SMD Pad Alignment)

  • 김창균;이성수
    • 전기전자학회논문지
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    • 제22권3호
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    • pp.874-877
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    • 2018
  • 인쇄 회로 기판(PCB: printed circuit board)에는 다수의 표면 실장 부품(SMD: surface mount device)이 장착되어 상호 연결되며, 이들을 연결하는 배선의 전송 특성이 나빠지면 시스템의 성능이 감소하게 된다. PCB와 SMD를 연결하는 패드는 PCB 전송 특성에 큰 영향을 미치기 때문에 패드의 위치도 최적화되어야 한다. 본 논문에서는 패드 정렬이 PCB 전송 특성에 미치는 영향을 시뮬레이션 하였다. 주파수가 비교적 낮은 경우에는 패드 정렬이 PCB 전송 특성에 큰 영향을 미치지 않지만 주파수가 높아지거나 패드 크기가 커질수록 패드 정렬에 따른 영향이 커진다. 따라서 목표 주파수와 패드 크기에 따라 세심하게 패드 정렬을 선택할 필요가 있다. 특히 12~18 GHz의 Ku-밴드 주파수 대역에서는 기존의 중앙 정렬 패드보다 제안하는 측면 정렬 패드가 전체적으로 유리하다.

Fiber sensor를 이용한 미소칩 미삽 방지 표면실장기술 (The surface mounting technology to prevent improper fine chip insertions by using fiber sensors)

  • 김영민;김현종;엄순천;공헌택;김치수
    • 한국산학기술학회논문지
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    • 제12권9호
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    • pp.4138-4146
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    • 2011
  • 표면실장기술(SMT: Surface Mount Technology)에 있어서 휴대폰 및 평판 디스플레이가 점점 가볍고 얇아지면서 이 제품에 사용되는 전자부품이 작아지고 있어, 0402, 0603 Chip등과 같은 SMD(Surface Mount Device) 부품을 실장하는 기술이 대두되고 있다. 따라서 Chip Mounter 제조회사들은 미삽이나 오삽을 방지하기 위한 실장기술에 대해 지속적인 연구를 해오고 있다. 본 연구는 이러한 미삽 오삽 방지를 실현하기 위하여 Fiber sensor를 이용하여 기계적 구조를 마련하고, 이를 활용한 시스템 알고리즘을 개선하는 기술을 제시한다.

A Machine Vision System for Inspecting Tape-Feeder Operation

  • Cho Tai-Hoon
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • 제6권2호
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    • pp.95-99
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    • 2006
  • A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.

이형 부품 표면실장기에 대한 겐트리 경로 문제의 최적 알고리즘 (Optimization Algorithm of Gantry Route Problem for Odd-type Surface Mount Device)

  • 정재욱;태현철
    • 산업경영시스템학회지
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    • 제43권4호
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    • pp.67-75
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    • 2020
  • This paper proposes a methodology for gantry route optimization in order to maximize the productivity of a odd-type surface mount device (SMD). A odd-type SMD is a machine that uses a gantry to mount electronic components on the placement point of a printed circuit board (PCB). The gantry needs a nozzle to move its electronic components. There is a suitability between the nozzle and the electronic component, and the mounting speed varies depending on the suitability. When it is difficult for the nozzle to adsorb electronic components, nozzle exchange is performed, and nozzle exchange takes a certain amount of time. The gantry route optimization problem is divided into the mounting order on PCB and the allocation of nozzles and electronic components to the gantry. Nozzle and electronic component allocation minimized the time incurred by nozzle exchange and nozzle-to-electronic component compatibility by using an mixed integer programming method. Sequence of mounting points on PCB minimizes travel time by using the branch-and-price method. Experimental data was made by randomly picking the location of the mounting point on a PCB of 800mm in width and 800mm in length. The number of mounting points is divided into 25, 50, 75, and 100, and experiments are conducted according to the number of types of electronic components, number of nozzle types, and suitability between nozzles and electronic components, respectively. Because the experimental data are random, the calculation time is not constant, but it is confirmed that the gantry route is found within a reasonable time.

SMD 타입 태양전지 어레이를 이용한 USN용 전원 공급 장치 (Power Supply for USN by Using SMD Type Solar Cell Array)

  • 김성일
    • 신재생에너지
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    • 제5권3호
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    • pp.22-25
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    • 2009
  • For increasing the output voltage, six SMD(surface mount device) type AlGaAs/GaAs solar cells were connected in series. The electrical properties of the array were measured and compared with one sun (100 mW/$cm^2$) and indoor light (480 lux) conditions. Under one sun condition, output power was 21.57 mW and it was $14.67\;{\mu}W$ under indoor light condition. Under the indoor light condition, the intensity of the light is very low compared to one sun condition. Thus the Voc(open circuit voltage) and Isc (short circuit current) of the sample under indoor light condition decreased very much compared to that of under the one sun condition. This kind of solar cell power supply can be used as a power source for ubiquitous sensor network (USN).

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다기능 표면실장기의 공정계획 프로그램 개발 (Development of the Process Planning Program for a Multi-functional Surface Mounting Device)

  • 손진현;유성열;강장하;박성수;오병준;성필영
    • 산업공학
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    • 제10권1호
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    • pp.155-167
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    • 1997
  • The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.

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SMD기계의 PCB 생산순서 결정을 위한 발견적 기법 (Heuristics for Sequencing Printed Circuit Boards on a Surface Mount Device Placement Machine)

  • 송창용;신성환
    • 산업공학
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    • 제13권2호
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    • pp.195-203
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    • 2000
  • This paper considers the problem of sequencing printed circuit boards(PCBs) on an automatic surface mount device(SMD) placement machine in order to minimize total setup time. Since the total set of component feeders needed by all boards cannot be loaded simultaneously on the magazine, the setup must be made between two successive boards in the sequence. It is assumed that the setup time depends on the number of component feeders to be replaced in the magazine. An important characteristic is that each feeder occupies a different number of slots in the magazine. This problem is equivalent to travelling salesman problem(TSP) except that the distances between two cities, that is, the setup times between two boards, are not known in advance. So, TSP-based heuristics with new distance functions are presented and their performances are compared through various test problems. Computational results indicate that our heuristics outperform existing methods.

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SMD 타입 태양전지 어레이를 이용한 white GaN LED용 전원 공급 장치 (Power Supply for White GaN LED by Using SMD Type Solar Cell Array)

  • 김성일;이윤표
    • 신재생에너지
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    • 제5권4호
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    • pp.34-37
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    • 2009
  • Using six SMD(surface mount device) type AlGaAs/GaAs single junction solar cells connected in series, a power source was fabricated for a white GaN LED. The electrical properties of the power source was measured and analyzed under one sun (100mW/$cm^2$) and various indoor light (300 - 900 lux) conditions. Under 600 lux indoor light condition, output power was 17.06 ${\mu}W$ and it was 30.75 ${\mu}W$ under 900 lux indoor light condition. Using the fabricated solar cell power supply, we have turned on the white GaN LED. It was worked well under 15 ${\mu}W$(at 480 lux) power supplied from solar cell array. This kind of solar cell power supply can be used as a power source for ubiquitous sensor network (USN).

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