• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.124-128
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• 2005

To produce a highly sensitive uncooled microbolometer, the development of a high-performance thermometric material is essential. In this work, amorphous vanadium-tungsten oxide was developed as a thermometric material at a low temperature of $300^{\circ}C$, and the microbolometer, coupled with the material, was designed and fabricated using surface micromachining technology. The vanadium-tungsten oxide showed good properties for application to the microbolometer, Such as a high temperature coefficient of resistance of over -4.0 $\%$/K and good compatibility with the surface micromachining and integrated circuit fabrication process due to its low fabrication temperature. As a result, the uncooled microbolometer could be fabricated with high detectivity over $1.0\;{\times}\;10^9\;cmHz^{1/2}/W$ at a bias current of $7.5\;{\mu}A$ and a chopper frequency of 10-20 Hz

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.5
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• pp.1363-1371
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• 1996

This paper presents the design, fabrication, and testing of polysilicon electrostatic microactuators that resonate in the direction parallel to the silicon susbstrates. A set of six different designs has been developed using a theoretical model and design formulae developed for the mocroactuators. Microactuator prototypes are fabricated from a 2.1 $\mu{m}$-thick LPCVD polysilicon film, using a 4-mask surface-micromachining process. The prototypes are tested under a d.c. bias voltage of 45V with an a.c. drive voltage amplitude of 20 v.Measured resorant frequencies are in the ranges of 40-60 kHz, showing a good agreement to their theoretical estimates within error bounds of .$\pm$.5%. Important issues inthe design and microfabrication of the microactuators are discussed, together with potential applicaitons of the key technology involved.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.601-607
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• 2002

Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.12
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• pp.7-11
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• 2007

In this paper, we proposed the dual-mode stepped impedance ring resonator bandpass filter for MMIC (Microwave Monolithic Integrated Circuit) applications using the dielectric-supported air-gapped microstrip line (DAML). The ring resonator fabricated by surface micromachining technology. This filter consists of a DAML resonator layer and a CPW feed line. The DAML ring resonator is elevated with $10{\mu}m$ height from GaAs substrate surface. This bandpass filter is $1-{\lambda}g$ type stepped impedance ring resonator including dual-mode resonance. From the measurements, we obtained attenuation of over 15 dB and insertion loss of 2.65 dB at the center frequency of 97 GHz. Relative bandwidth is about 12 % at 97 GHz. Furthermore, the proposed bandpass filter is useful to integrate with conventional MMICs.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.12
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• pp.597-600
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• 2002

Film Bulk Acoustic wave Resonator (FBAR) using thin piezoelectric films can be made as monolithic integrated devices with compatibility to semiconductor process, leading to small size and low cost, high Q RF circuit elements with wide applications in communications area. This paper presents a MMIC compatible suspended FBAR using surface micromachining. Membrane is composed $Si_3N_4SiO_2Si _3N_4$ multi layer and air gap is about 50${\mu}{\textrm}{m}$. Firstly, We perform one dimensional simulation applying transmission line theorem to verify resonance characteristic of the FBAR. Process of the FBAR is used MEMS technology. Fabricated FBAR resonate at 2.4GHz, $K^2_{eff}$ and Q are 4.1% and 1100.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1215-1219
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• 2003

Light Guide Panel(LGP) is a key part of backlight unit(BLU) which transforms line-light of lamp to surface-light. Dot pattern is formed on the injected LGP surface by screen printing. This dot pattern is composed of several ten thousands micro dots of diameter 150-180$\mu\textrm{m}$ or so. The dot patterning by screen printing causes low productivity and low performance of TFT-LCD. This research develops the micromachining technology for LGP mould which could form micro dot pattern by injection molding, removing the existing screen printing process.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.6
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• pp.270-275
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• 2005

In order for the application of the in-vivo endoscopic biopsy, a micromirror which can be driven at a low voltage is required. In this paper, a two-step micromirror composed of bottom electrodes, moving plate and top mirror plate is proposed. Because an electrical wiring of two plates are separated, they can be actuated separately. Therefore, an intermediate moving plate plays an important role in reducing the driving voltage in half. The designed device was fabricated by the surface micromachining. Maximum rotation angle of $6.3^{\circ}$ was obtained by applying DC 48V, while a conventional one-step mirror pulled down at DC 120V. The designed structure can be used in microphotonic applications requiring low driving voltage.

• Laser Solutions
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• v.12 no.1
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.233-241
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• 2000

This paper presents comparative results of various commonly used anti-stiction methods for polysilicon surface micromachining using identical test structures. Four different types of cantilevers - single cantilevers, cantilevers with dimples, cantilevers with anti-stiction tip, cantilevers with plate - with different widths and lengths were employed as test structures. The detachment length of cantilevers was examined depending on the anti-stiction methods and test structure types. After sacrificial layer was removed, evaporation and sublimation drying methods were used in the drying step when takes place the stiction between structure and substrate. Various final rinsing liquids such as methanol, IPA, and DI water were employed to compare anti-stiction results depending on surface tension and rinsing temperature. For sublimation drying method, methanol was used as an intermediate rinsing liquid. Also, the influence of a stress gradient of the polysilicon was investigated by performing the identical anti-stiction experiments on identical test structures with a stress gradient. In conclusion, sublimation drying method showed superior results to various evaporation drying methods and hence it is considered the best method for releasing polysilicon microstructure in polysilicon surface micromachining.