• Title/Summary/Keyword: surface carrier density

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Geometrical and Electronic Structure of Epitaxial Graphene on SiC(0001) : A Scanning Tunneling Microscopy Study

  • Ha, Jeong-Hoon;Yang, Hee-Jun;Baek, Hong-Woo;Chae, Jung-Seok;Hwang, Beom-Yong;Kuk, Y.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.368-368
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    • 2010
  • Monolayers of graphite can be grown by fine controlled surface graphitization on the surfaces of various metallic and semiconducting materials. Epitaxial graphene grown on polished silicon carbide crystal surfaces has drawn much attention due to well known vacuum annealing procedures from surface analysis methods, especially scanning tunneling microscopy(STM) and scanning tunneling spectroscopy(STS). In this study, we have grown single layer and few layer graphene on silicon terminated 6H-SiC(0001) crystals. The growth of graphene layers were observed by low energy electron diffraction(LEED) patterns. Scanning tunneling microscopy and spectroscopy measurements were performed to illustrate the electronic structure which may display some clue on the influence of the underlying structure. Spatially resolved STS results acquired at the edges of epitaxial graphene show in detail the electron density of states, which is compared to theoretical calculations. STM measurements were also done on graphene films grown by chemical vapor deposition(CVD) and transferred onto a SiC(0001) crystal. These observations may provide a hint for the understanding of carrier scattering at the edges.

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Electrical Properties of ITO Thin Film Deposited by Reactive DC Magnetron Sputtering using Various Sn Concentration Target (반응성 DC 마그네트론 스퍼터링법으로 증착한 ITO 박막의 전기적 특성 평가)

  • Kim, Min-Je;Jung, Jae-Heon;Song, Pung-Keun
    • Journal of the Korean institute of surface engineering
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    • v.47 no.6
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    • pp.311-315
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    • 2014
  • Indium tin oxide (ITO) thin films (30 nm) were deposited on PET substrate by reactive DC magnetron sputtering using In/Sn(2, 5 wt.%) metal alloy target without intentionally substrate heating during the deposition under different DC powers of 70 ~ 110 W. The electrical properties were estimated by Hall-effect measurements system. The resistivity of ITO thin film deposited using In/Sn (5 wt.%) metal alloy target at low DC power increased with increasing annealing time. However, they increased with increasing annealing time at high DC power. In the case of ITO (Sn 2 wt%), we can't find clear change in resistivity with increasing annealing time. However, carrier density and mobility showed difference behavior due to change of oxygen vacancy.

A study of photoreflectance on the surface characteristics in n-GaAs treated with Ar plasma (아르곤 플라즈마로 처리한 n-GaAs의 표면특성에 관한 Photoreflectance 연구)

  • 이동율;김인수;김동렬;김근형;배인호;김규호;한병국
    • Journal of the Korean Vacuum Society
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    • v.6 no.4
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    • pp.359-363
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    • 1997
  • We have investigated the surface characteristics of n-GaAs (100) treated with Ar plasma (40 W, 5~120 sec) by photoreflectance (PR) measurement. With increasing Ar plasma treatment time, the intensity of $E_0$ peak observed to the minimum at 5 sec. The surface electric field ($E_0$), net carrier concentration ($N_P-N_A$), and surface state density ($Q_{SS}$ are $1.05{\times}10^5V/cm$ and $1.31{\tiems}10^{17}cm^{-3}$ and $1.64{\times}10^{-7}C/m^2$, respectively. These values were about 57.1, 81.4 and 56.9% smaller than those of bulk n-GaAs. On the other hand, the concentration of compensation centers ($N_A$) was maximum with value of $5.75{\times}10^{17}cm^{-3}$ at 5 sec. And penetration depth of defects generated after treated with Ar plasma was about 450 $\AA$ from surface.

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NIR reflecting properties of TiO2/Ag/TiO2 multilayers deposited by DC/RF magnetron sputtering (DC/RF 마그네트론 스퍼터링법을 이용한 TiO2/Ag/TiO2 하이브리드 다층박막의 적외선 반사 특성)

  • Kim, Seong-Han;Kim, Seo-Han;Song, Pung-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.158-158
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    • 2016
  • 최근 화석연료의 고갈과 환경 보전 및 에너지 절약에 대한 관심이 높아짐에 따라 화석연료의 소비를 최소화하고 실내조건을 쾌적하게 유지하려는 연구가 진행되고 있다. 국내의 경우 전체 에너지 소비의 30%이상을 차지하고 있는 건물부문에서의 에너지 소비를 줄이기 위한 활발한 연구가 진행되고 있으며 이에 따른 에너지절약 소재개발이 활발하게 진행되고 있다. 1975년 이후 여러 차례에 걸친 단열강화 조치를 통해 건물에서의 에너지 소모를 줄이고 있었으나 건물의 외벽에 대한 사항으로 한정되어있었고, 또한 건물의 창 면적이 증가함에 따라 창을 통한 열손실량과 열획득량이 더욱 증가하게 되었다. 이러한 문제를 해결하기 위해 열반사유리에 대한 많은 연구가 진행되고 있다. 열반사유리는 근적외선(열선)영역의 빛을 반사시켜 실내의 열손실량 및 외부에서의 열획득량을 감소시켜 에너지의 소비를 줄일 수 있는 유리을 말한다. 이러한 열반사유리은 fresnel 방정식을 통해 빛의 파장대에 따른 반사율 및 투과도를 예측할 수 있는데, 다층박막구조인 Oxide-Metal-Oxide(OMO)구조는 Oxide의 높은 굴절률과 Metal의 낮은 굴절률을 통해 가시광영역대의 높은 투과도와 근적외선 영역의 높은 반사율을 얻을 수 있다. 또한 Metal층을 삽입함으로서 flexible한 코팅이 가능하고, 높은 carrier density와 mobility로 표면 플라즈몬 공명을 통해 특정 파장대의 반사율을 높일 수 있으므로 많은 연구가 진행되고 있다. $TiO_2$는 고굴절률 및 낮은 광흡수성의 특성을 가지는 산화물반도체로 기존의 $In_2O_3$계 산화물에 비해 값이 싸고 높은 안정성과 광촉매특성을 보이므로 외부에 노출된 환경에 적합한 재료이다. Ag는 저굴절률과 낮은 광흡수성을 가지는 재료로 금속층에 적합하다. 본 연구에서는 fresnel 방정식을 통해 반사도 및 투과도를 예측하고 마그네트론 스퍼터링법으로 다층박막을 열선인 적외선 영역에서의 반사율 및 반사 효율을 평가하였다. Index-matching 시뮬레이션을 통해 $TiO_2/Ag/TiO_2$ 다층박막의 투과도와 반사도를 이론적으로 검토하였다. 시뮬레이션 프로그램은 Macleod프로그램을 이용하였고 재료 각각의 굴절률은 Ellipsometry를 이용하여 측정하였다. 두께 40 nm 와 8 ~ 16 nm를 가지는 $TiO_2$층과 Ag층을 각각 RF/DC 마그네트론 스퍼터링법을 이용하여 Glass기판 위에 증착하였다. 직경 3 in 의 $TiO_2$, Ag 소결체 타깃을 이용하였고 스퍼터링 파워는 각각 200 W, 50 W로 설정하였고, 스퍼터링 가스는 Ar가스의 유량을 20 sccm으로 설정하였다. 작업압력은 모두 1 Pa로 설정하였고 타깃 표면의 불순물 및 이물질 제거를 위해 Pre-sputtering을 10분 진행하였다. 박막의 두께는 reflectometer와 Alphastep을 이용하여 측정하였고 Hall effect measurement를 이용하여 비저항, carrier density, mobility등 전기적 특성을 측정하였다. 또한 UV-VIS spectrometer와 USPM-RU-W NIR Micro-Spectrophotometer를 통해 광학적 특성을 측정하였고 계산 값과 비교분석하였다. 또한 열반사 특성을 평가하기 위해 직접 set-up한 장비를 이용하였다. 단열 박스에 샘플을 장착해 적외선 램프를 조사하였을 때의 열 반사효율을 평가하였고, IR Camera를 이용하여 단열 박스 내부의 온도 변화를 관찰하였다.

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Process Temperature Dependence of Al2O3 Film Deposited by Thermal ALD as a Passivation Layer for c-Si Solar Cells

  • Oh, Sung-Kwen;Shin, Hong-Sik;Jeong, Kwang-Seok;Li, Meng;Lee, Horyeong;Han, Kyumin;Lee, Yongwoo;Lee, Ga-Won;Lee, Hi-Deok
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.6
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    • pp.581-588
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    • 2013
  • This paper presents a study of the process temperature dependence of $Al_2O_3$ film grown by thermal atomic layer deposition (ALD) as a passivation layer in the crystalline Si (c-Si) solar cells. The deposition rate of $Al_2O_3$ film maintained almost the same until $250^{\circ}C$, but decreased from $300^{\circ}C$. $Al_2O_3$ film deposited at $250^{\circ}C$ was found to have the highest negative fixed oxide charge density ($Q_f$) due to its O-rich condition and low hydroxyl group (-OH) density. After post-metallization annealing (PMA), $Al_2O_3$ film deposited at $250^{\circ}C$ had the lowest slow and fast interface trap density. Actually, $Al_2O_3$ film deposited at $250^{\circ}C$ showed the best passivation effects, that is, the highest excess carrier lifetime (${\tau}_{PCD}$) and lowest surface recombination velocity ($S_{eff}$) than other conditions. Therefore, $Al_2O_3$ film deposited at $250^{\circ}C$ exhibited excellent chemical and field-effect passivation properties for p-type c-Si solar cells.

Electrical Properties of the Amorphous BaTi4O9 Thin Films for Metal-Insulator-Metal Capacitors (Metal-Insulator-Metal 캐패시터의 응용을 위한 비정질 BaTi4O9 박막의 전기적 특성)

  • Hong, Kyoung-Pyo;Jeong, Young-Hun;Nahm, Sahn;Lee, Hwack-Joo
    • Korean Journal of Materials Research
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    • v.17 no.11
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    • pp.574-579
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    • 2007
  • Amorphous $BaTi_4O_9$ ($BT_4$) film was deposited on Pt/Si substrate by RF magnetron sputter and their dielectric properties and electrical properties are investigated. A cross sectional SEM image and AFM image of the surface of the amorphous $BT_4$ film deposited at room temperature showed the film was grown well on the substrate. The amorphous $BT_4$ film had a large dielectric constant of 32, which is similar to that of the crystalline $BT_4$ film. The leakage current density of the $BT_4$ film was low and a Poole-Frenkel emission was suggested as the leakage current mechanism. A positive quadratic voltage coefficient of capacitance (VCC) was obtained for the $BT_4$ film with a thickness of <70 nm and it could be due to the free carrier relaxation. However, a negative quadratic VCC was obtained for the films with a thickness ${\geq}96nm$, possibly due to the dipolar relaxation. The 55 nm-thick $BT_4$ film had a high capacitance density of $5.1fF/{\mu}m^2$ with a low leakage current density of $11.6nA/cm^2$ at 2 V. Its quadratic and linear VCCs were $244ppm/V^2$ and -52 ppm/V, respectively, with a low temperature coefficient of capacitance of $961ppm/^{\circ}C$ at 100 kHz. These results confirmed the potential suitability of the amorphous $BT_4$ film for use as a high performance metal-insulator-metal (MIM) capacitor.

Characterization of Non-polar 6H-SiC Substrates for Optoelectronic Device Applications (광전소자 응용을 위한 무극성 6H-SiC 기판의 특성)

  • Yeo, Im-Gyu;Lee, Tae-Woo;Choi, Jung-Woo;Seo, Jung-Doo;Ku, Kap-Ryeol;Lee, Won-Jae;Shin, Byung-Chul;Kim, Young-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.5
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    • pp.390-396
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    • 2009
  • The present research was focused to investigate the quality of non-polar SiC substrates grown by a conventional PVT method for optoelectronic applications. The half part of the PVT-grown 6H-SiC crystal boules was sliced along a-direction and m-direction to extensively analyze non-polar planes and then remaining part of that was sliced along the basal plane to produce wafers. The non-polar SiC m-plane and a-plane exhibited apparent peaks around 2 theta=$120^{\circ}$((3-300) plane) and 2 theta=$60^{\circ}$ ((11-20) plane), respectively. FWHM values of m-plane measured along a-direction and c-direction were 60 arc see and 57 arcsec respectively, a-plane measured along m-direction and c-direction were 41 arcsec and 51 arcsec respectively. The typical absorption spectra of SiC crystals indicated that each of SiC crystals were the 6H-SiC with fundamental absorption energy of about 3.04 eV. Non-polar planes contained no micropipe on etched surface. The carrier concentration and mobility of non-polar SiC wafers have estimated by Raman spectrum. It was observed that the carrier mobility is low in the area far from seed crystal with compared to other places.

High Performance GaN-Based Light-Emitting Diodes by Increased Hole Concentration Via Graphene Oxide Sheets

  • Jeong, Hyun;Jeong, Seung Yol;Jeong, Hyun Joon;Park, Doo Jae;Kim, Yong Hwan;Kim, HyoJung;Lee, Geon-Woong;Jeong, Mun Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.244.1-244.1
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    • 2013
  • The p-type GaN which act as a hole injection layer in GaN-based LEDs has fundamental problems. The first one arises from the difficulty in growing a highly doped p-GaN (with a carrier concentration exceeding ~1018 $cm^{-3}$). And the second one is the absence of appropriate metals or conducting oxides having a work function that is larger than that of p-type GaN (7.5 eV). Moreover, the LED efficiency is decreases gradually as the injection current increases (the so-called 'efficiency droop' phenomenon). The efficiency droop phenomenon in InGaN quantum wells (QWs) has been a large obstacle that has hindered high-efficiency operation at high current density. In this study, we introduce the new approaches to improve the light-output power of LEDs by using graphene oxide sheets. Graphene oxide has many functional groups such as the oxygen epoxide, the hydroxyl, and the carboxyl groups. Due to nature of such functional groups, graphene oxide possess a lot of hole carriers. If graphene oxide combine with LED top surface, graphene oxide may supply hole carriers to p-type GaN layer which has relatively low free carrier concentration less than electron concentration in n-type GaN layer. To prove the enhancement factor of graphene oxide coated LEDs, we have investigated electrical and optical properties by using ultra-violet photo-excited spectroscopy, confocal scanning electroluminescence microscopy.

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A Novel Analysis Of Amorphous/Crystalline Silicon Heterojunction Solar Cells Using Spectroscopic Ellipsometer (Spectroscopic Ellipsometer를 이용한 a-Si:H/c-Si 이종접합 태양전지 박막 분석)

  • Ji, Kwang-Sun;Eo, Young-Ju;Kim, Bum-Sung;Lee, Heon-Min;Lee, Don-Hee
    • New & Renewable Energy
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    • v.4 no.2
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    • pp.68-73
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    • 2008
  • It is very important that constitution of good hetero-junction interface with a high quality amorphous silicon thin films on very cleaned c-Si wafer for making high efficiency hetero-junction solar cells. For achieving the high efficiency solar cells, the inspection and management of c-Si wafer surface conditions are essential subjects. In this experiment, we analyzed the c-Si wafer surface very sensitively using Spectroscopic Ellipsometer for < ${\varepsilon}2$ > and u-PCD for effective carrier life time, so we accomplished < ${\varepsilon}2$ > value 43.02 at 4.25eV by optimizing the cleaning process which is representative of c-Si wafer surface conditions very well. We carried out that the deposition of high quality hydrogenated silicon amorphous thin films by RF-PECVD systems having high density and low crystallinity which are results of effective medium approximation modeling and fitting using spectroscopic ellipsometer. We reached the cell efficiency 12.67% and 14.30% on flat and textured CZ c-Si wafer each under AM1.5G irradiation, adopting the optimized cleaning and deposition conditions that we made. As a result, we confirmed that spectroscopic ellipsometry is very useful analyzing methode for hetero-junction solar cells which need to very thin and high quality multi layer structure.

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Effect of Al2O3 Surface Passivation by Thermal Oxidation of Aluminum for AlGaN/GaN Structure (Al의 열산화 방법을 이용한 AlGaN/GaN 구조의 표면 Al2O3 패시베이션 효과)

  • Kim, Jeong-Jin;Ahn, Ho-Kyun;Bae, Seong-Bum;Pak, Young-Rak;Lim, Jong-Won;Moon, Jae-Kyung;Ko, Sang-Chun;Shim, Kyu-Hwan;Yang, Jeon-Wook
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.11
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    • pp.862-866
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    • 2012
  • Surface passivation of AlGaN/GaN heterojunction structure was examined through the thermal oxidation of evaporated Al. The Al-oxide passivation increased channel conductance of two dimensional electron gas (2DEG) on the AlGaN/GaN interface. The sheet resistance of 463 ohm/${\Box}$ for 2DEG channel before $Al_2O_3$ passivation was decreased to 417 ohm/${\Box}$ after passivation. The oxidation of Al induces tensile stress to the AlGaN/GaN structure and the stress seemed to enhance the sheet carrier density of the 2DEG channel. In addition, the $Al_2O_3$ films formed by thermal oxidation of Al suppressed thermal deterioration by the high temperature annealing.