• Title/Summary/Keyword: surface adhesion

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Thin Metal Meshes for Touch Screen Panel Prepared by Photolithography (포토리소그래피 공정으로 제작된 터치스크린패널용 금속메시)

  • Kim, Seo-Han;Song, Pung-Keun
    • Journal of the Korean institute of surface engineering
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    • v.49 no.6
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    • pp.575-579
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    • 2016
  • The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

A Study on the Adhesion of Zinc thin Film Deposited by Thermal Evaporation (열증착에 의한 아연박막 밀착성에 관한 연구)

  • 김영호;김경미;신순범;이상래
    • Journal of the Korean institute of surface engineering
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    • v.26 no.1
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    • pp.11-21
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    • 1993
  • The relationship between the amount of deposited-Zn and the adhesion of Zn film has beend investigated. This study changed the mild steel substrate temperature range of $100^{\circ}C$~$250^{\circ}C$, with the aim of studying the adhesion of Zn film coated by PVD on substrates in 10-2~10-3torr and deoxidant gas atmospheres 50%H2~50%N2 and 75%H2+25%N2. The result revealed that the adhesion of Zn film was remarkably good in a 75% H2+25%N2 gas atmosphere as well as deoxidant time was short, and with increasing the substrate tempera-ture up to $250^{\circ}C$. Whiled the amount of deposition tended to increase linearly with time at constant evaporation temperature. It was almost constant when the substrate temperature was lower than $200^{\circ}C$, slightly decreased between $200^{\circ}C$ and $250^{\circ}C$ and significantly decreased at $300^{\circ}C$.

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Cellular Adhesion and Growth on the Vertically Aligned Silicon Nanowire Arrays

  • Yun, Seo-Yeong;Park, Lee-Seul;Lee, Jin-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.266.2-266.2
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    • 2013
  • According to advanced nanotechnology, the nanostructured materials with various kinds and shape are synthesized easily or produced by process. Recently, researches about interaction between the nanostructured materials and biological system have been progressed actively. The surface topography may influence cellular responses, for example cell adhesion, cell morphology. In this work, we synthesized vertically aligned silicon nanowires (SiNWs) on the Au-covered Si(111) wafer by chemical vapor deposition (CVD) method. We accomplished to control of the SiNWs diameter by regulating thickness of Au film such as 1 nm and 10 nm. These substrates did not isolate cells and just provided surface topography for cell culture. Human Embryonic Kidney 293T cells (HEK 293T cells) were cultured on these substrates for 2 days. We studied the nanotopographical effects on cell morphology, adhesion, and growth which are evaluated on each SiNWs substrate comparing bare glass as control.

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Determination of the Failure Paths of Leadframe/EMC Joints

  • Lee, H.Y.;Kim, S.R.
    • Journal of the Korean institute of surface engineering
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    • v.33 no.4
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    • pp.241-250
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    • 2000
  • Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

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Effect of Al content on coating adhesion of hot rolled galvanized iron manufactured without pickling process (무산세 열연 용융아연도금강판의 도금밀착성에 미치는 도금욕 Al농도의 영향)

  • 전선호;최진원
    • Journal of the Korean institute of surface engineering
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    • v.32 no.1
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    • pp.31-42
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    • 1999
  • The effect was investigated that aluminium in the zinc bath has on the coating adhesion of Hot-rolled Galvanized Iron(HGI) manufactured without pickling process. It is thought that the coating adhesion of HGI manufactured without pickling process is good due to the fact that increasing aluminium content in the zinc bath makes zinc and aluminium diffuse to the cracks or pores in the scale formed through the reduction heat treatment, and Fe-Zn-Al compound with good ductility is formed in the scale layer and plays a role of anchor between zinc coating and substrate. It is possible that HGI with the good coating adhesion was produced without pickling treatment in the zinc bath with more that 3wt% of Al content even at the $550^{\circ}C$ of conventional reduction heating temperature. In creasing the temperature of heating section and aluminium content in the zinc bath prevents the Zn-Fe alloy. The corrosion resistance of HGI manufactured without pickling process is excellent because of the mixed reaction of zinc sacrifice and aluminium passivity film.

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THE EFFECT OF AN APPLIED BIAS UPON THE REFLECTANCE AND ADHESION OF SILVER FILMS BEING SPUTTER-DEPOSITED ON POLYESTER SUBSTRATE

  • Ri, Eui-Jae;Hoang, Tae-Su
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.257-264
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    • 1999
  • Thin reflective films are synthesized by using PVD methods with a bright metal of Al or Ag. For purposes of improving the reflectance and adhesion of such films particularly, substrate bias was applied during sputtering (namely, ion-plating) to enhance the deposition process with higher energy. And we succeeded in fabricating a quality silver film which possesses an adhesion of $85{\;}Kg/\textrm{cm}^2$ and a high reflectivity of more than 96%. Both of reflectivity and adhesion are better in case of bias sputtering as controlled than nonbias sputtering, particularly the bias of 50-100 V showed most effective. The microstructures of sample films were examined by using various equipments and the XRD spectrum in particular showed that <111> direction is the preferred growth orientation.

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Effect of Specific Interaction of Multi-Ligands on the Specific Interaction between Particle and Cell (멀티 리간드의 특이적 상호작용이 입자-세포간 상호작용에 미치는 영향)

  • Yoon, Jung Hyun;Lee, Sei Young
    • Journal of Biomedical Engineering Research
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    • v.43 no.2
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    • pp.94-101
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    • 2022
  • Recent advancement of micro/nano technology enables the development of diverse micro/nano particle-based delivery systems. Due to the multi-functionality and engineerability, particle-based delivery system are expected to be a promising method for delivery to the target cell. Since the particle-based delivery system should be delivered to the various kinds of target cell, including the cardiovascular system, cancer cell etc., it is frequently decorated with multiple kinds of targeting molecule(s) to induce specific interaction to the target cell. The surface decorated molecules interact with the cell surface expressed molecule(s) to specifically form a firm adhesion. Thus, in this study, the probability of adhesion is estimated to predict the possibility to form a firm adhesion for the multi-ligand decorated particle-based delivery system.

Studies on the Characteristics of EVA Foam by Solvent Treatment (용매 처리에 의한 EVA foam 표면 특성에 관한 연구)

  • Chun, Jae Hwan;Kim, Gu Ni;Hong, Soon Yeong;Yoo, Chong Sun;Oh, Sang Taek
    • Journal of Adhesion and Interface
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    • v.2 no.3
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    • pp.9-15
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    • 2001
  • To estimate the effect of the surface state of the EVA foam on an adhesion, the surface was treated with solvents having different values of a solubility parameter and a surface tension. The morphology and the contact angle were measured by SEM and contact angle tester, respectively. The value of the critical surface tension(${\gamma}_{c,0}$) of the EVA foam calculated by Zismann plot was 27.08 dyne/cm. The surface state and the ${\gamma}_c$ of the EVA foam were changed by solvent treatment. The swelling ratio of EVA foam was influenced by solubility parameter of a solvent, on the other hand the degree of change in the surface state was dependent on a surface tension of a solvent. When a surface tension of solvent. When a surface tension of solvent is lower than ${\gamma}_{c,0}$ of the EVA foam, the wettability of a solvent was good and the surface state was greatly changed. The adhesion strength of EVA foam was greatly improved to above 600% as compared to that of the untreated one. As the ${\gamma}_c$ of EVA was closed to the surface tension of the primer, the good adhesion strength was obtained.

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Laser Copper Patterning by wettability improvement of Silicon (레이저에 의한 실리콘 표면의 습윤성 향상과 구리 패터닝)

  • Kim, Dong-Yung;Lee, Kyoung-Cheol;Lee, Cheon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.1080-1083
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    • 2002
  • In this paper, we have studied with regard to the use of lasers for modifying the surface properties of silicon in order to improve it's wettability and adhesion characteristics. Using an Nd:YAG pulse laser, the wettability and adhesion characteristics of silicon surface have been developed by an Nd:YAG pulse laser. It was found that the laser treatment of silicon surfaces modified the surface energy. In the result of wetting experiments, by the sessile drop technique using the distilled water, wetting characteristic of silicon after the laser irradiation shows a decreased value of the contact angle. In case of the laser treated silicon surface, laser direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films$(Cu(HCOO)_2{\cdot}4H_2Q)$, using a focused $Ar^+$ laser beam$(\lambda=514.5nm)$ on the silicon substrates. The deposited patterns were measured by energy dispersive X-ray(EDX), Scanning Electron Microscopy(SEM) and surface profiler($\alpha$-step) to examine the cross section of deposited copper lines and linewidth.

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Adhesion Characteristic and Porosity Change of Alkali Silicate Impregnant of Concrete (Silicate계 콘크리트 함침제 도포에 따른 부착특성 및 공극변화)

  • Song, Hun;Chu, Yong-Sik;Lee, Jong-Kyu;Lim, Young-Chul
    • Journal of the Korean Ceramic Society
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    • v.47 no.4
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    • pp.276-282
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    • 2010
  • There are the impregnating layer formation by surface protective materials or impregnants and the adhesion method by polymer, FRP sheet or steel plate in the surface protective method of concrete structure. The surface impregnation method by impregnants improves the durability of concrete structure by modifying the structure of the concrete surface and also have a merit that can be shortly applied in place without the decrease of concrete surface appearance and is easily applied again. This study is interested in manufacturing the concrete surface impregnants including lithium and potassium silicate for the repair of the exposed concrete and the color concrete requiring the advanced function in view of the concrete appearance. The durability and porosity properties was tested for the review of application. The result of this study show that the effective content of silicate ranges 5 to 20% and the separate application of the first impregnant and the second impregnant is effective for the optimum performance. The adhesion in tension is slightly increased but the reinforcement of concrete substrate is slight. So, the concrete impregnant of this study is more desirable for the improvement of durability rather than the reinforcement.