• 한국재료학회지
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• 제19권4호
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• pp.207-211
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• 2009

In this study, we attempted to develop a convenient aluminizing process, using Al-Ti mixed slurry as an aluminum source, to control the Al content of the aluminized layer as a result of a one-step process and can be widely adopted for coating complex-shaped components. The aluminizing process was carried out by the heat treatment on disc and rod shaped S45C steel substrates with Al-Ti mixed slurries that were composed of various mixed ratios (wt%) of Al and Ti powders. The surface of the resultant aluminized layer was relatively smooth with no obvious cracks. The aluminized layers mainly contain an Fe-Al compound as the bulk phase. However, the Al concentration and the thickness of the aluminized layer gradually decrease as the Ti proportion among Al-Ti mixed slurries increases. It has also been shown that the Al-Ti compound layer, which formed on the substrate during heat treatment, easily separates from the substrate. In addition, the incorporation of Ti into the substrate surface during heat treatment was not observed.

• KSBB Journal
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• 제6권2호
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• pp.115-121
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• 1991

본 연구의 목적은 생물막 유동층 반응기내에서 높은 유기물 부하를 처리하는데 있어 지지체에 부착된 미생울의 특성과 유기물의 처리효율을 조사하는데 있다. 실험은 글루코오즈를 주 기질로 한 합성폐수를 이용하여, 상향유속은 0.47cm / sec, 체류시간을 5시간, 운전 온도는 $22{\pm}1{\circ}C$, pH는 $7{\pm}0.1$로 일정하게 하고 유기물 부하를 $10kgCOD\;/\;{\textrm{m}^3}$.day에서 $80kgCOD\;/\;{\textrm{m}^3}$.day로 증가시켰을 때, 각각 95%, 73%의 높은 COD 처리효율을 얻었다. 고정 생물막 반응기에 사용된 Andrew의 유기물 제거율 모델을 본 생물막 유동층 반응기에 적용시켜본 결과, 실제 유기물 제거율과 예측한 유기물 제거율은 85% 정도로 일치하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.99-102
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• 2000

Via for achieving reliable fabrication of MCM-D substrate was formed on the photosensitive BCB layer. MCM-D substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in photosensitive BCB layer, the process of BCB and plasme etch using $C_2$F$_{6}$ gas were evaluated. The thickness of BCB after soft bake was shrunk down to 60% of the original. AES analysis was done on two vias, one is etched in $C_2$F$_{6}$ gas and the other is non etched. On via etched in $C_2$F$_{6}$, native C was detected and the amount of native C was reduced after Ar sputter. On via non etched in $C_2$F$_{6}$, organic C was detected and amount of organic C was reduced a little after Ar sputter. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable via.ble via.

• 한국표면공학회지
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• 제29권5호
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• pp.430-436
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• 1996

We have grown superconducting thin films on various substrates using a pulsed laser deposition (PLD) method. $YBa_2Cu_3O_7-\delta$ (YBCO) superconducting thin films with the superconducting transition temperature ($T_{c. offset}$) of 87K were grown on Si substrates using yittria-stabilized zirconia (YSZ) and $CeO_2$ double buffer layers. We have developed a large area pulsed laser deposition system. The system was designed to deposit up to 6 different materials on a large area substrate up to 7.5cm in diameter without breaking a vacuum. The preliminary runs of the deposition of YBCO superconducting thin films on $SrTiO_3$ substrate using this system showed a very uniform thickness profile over the entire substrate holder area. $T_{c}$ of the deposited YBCO thin film, however, was scattered depending on the position and the highest value was 85K.

• 한국위성정보통신학회논문지
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• 제12권2호
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• pp.11-14
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• 2017

본 논문은 프리즘 구조물의 집광효과를 이용하여 옥외용 사이니지 이산형 LED 패널의 광학적 불연속성을 개선할 수 있는 방법적 접근에 관한 것이다. 광투과성이 우수한 Polycarbonate에 MEMS(Microelectromechanical systems) 공정 및 극초단파(Femto-second) 레이저를 이용하여 프리즘 형태를 패터닝을 하였다. 패터닝된 polycarbonate는 light guide film의 역할을 하여 서로 다른 디스플레이 패널에서 발생하는 빛을 프리즘 구조에 의해 한 곳으로 모이게 함을 확인하였다. Polycarbonate와 디스플레이 패널의 간격에 따라 디스플레이 패널간의 거리를 조절할 수 있었으며 한 곳으로 모인 빛은 마치 두 디스플레이 패널이 연결된 것과 같은 효과를 나타내었다. 이는 아웃도어 사이니지용 디스플레이 패널에서 발생하는 문제점인 광학적 불연속성을 개선할 수 있을 것으로 보인다.

• 연구논문집
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• 통권24호
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• pp.63-79
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• 1994

This article reports a experimental study of the method to achieve a bond joint at lower temperature in a short time. DC magnetron sputtering of Sn, Sn/Pb, Sn/In and Sn/Cu on copper substrate was provided as an interlayer for Cu to Cu bonding under the air environment. Various examination was conducted and investigated on the effect of experimental parameters such as coating materials, coating time(or coating thickness), bonding temperature and bonding time etc. Bonding was performed at the temperature of $210^\circC-320^\circC$ for 0sec and interfacial reaction between the coated layer and copper substrate was examined using optical, scanning electron microscope and x-ray diffractometer. From the obtained results, it was found that intermetallic compounds layer consisted of $\eta-phase(Cu_6Sn_5)$ and $\beta-phase(Cu_3Sn)$ was formed at the joint interface for almost all coating materials. But the dominant phase formed in the preetched Cu substrate coated with Sn was $\beta-phase$. A characteristic morphology looks like a reaction ring, which was believed as the strong interconnecting regions between two substrates, was found to be formed on the reaction surface of copper substrates. The morphologies and compositions of the intermetallics, which depends on the regions of the reaction surface, was appeared as greatly different. Based on above results, the new bonding process to make the joint at lower temperature for short time can be admitted as a feasible process.

• 한국표면공학회지
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• 제34권1호
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• pp.3-9
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• 2001

The purpose of this study is to evaluate the properties of the functional gradient thermal barrier coatings by plasma spray process. The evaluations of mechanical and thermal properties such as fatigue, oxidation and wear-resistance at high temperatures have been conducted. Furthermore, residual stress and bond strength have been evaluated. The range of thickness of coated layers was 550~600$\mu\textrm{m}$. The range of hardness of layers was 800~900 Hv and the porosity range of coatings was about 7 to 14%. The top coating layer of $ZrO_2$ in thermal barrier was composed of tetragonal structure after spraying. The coated layers of $ZrO_2$ on the Inconel substrate is the best resistance for thermal fatigue. Those coatings had the least compressive stress in comparison with other coatings. In high temperature oxidation test, the coatings on Inconel substrate was better than the coatings on SUS substrate. The bond strength of the concave type was greater than that of linear types and convex types coatings.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.408-411
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• 2003

Al doped Zinc Oxide(ZnO:Al) films, which is widely used as a transparent conductor in optoelectronic devices such as solar cell, liquid crystal display, plasma display panel, thermal heater, and other sensors, were prepared by using the capacitively coupled DC magnetron sputtering method. The influence of the substrate temperature, working gas pressure, discharge power and doping amounts of Al on the electrical, optical and morphological properties were investigated experimentally. The effect of bias voltage on the electrical properties of ZnO thin film were also studied. Films with lowest resistivity of $5.4{\times}10^{-4}\;{\Omega}-cm$ have been achieved in case of films deposited at 1mtorr, $400^{\circ}C$ with a substrate bias of +10V for 840nm in film thickness.

• Journal of the Korean Physical Society
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• 제73권10호
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• pp.1473-1478
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• 2018

In this study, we have developed a simple and cost-effective method to prevent edge bead formation by covering the edge of a chip-level substrate with heat-resistant tape during patterning using SU-8. Edge beads are a fundamental problem in photoresists and are particularly notable in high-viscosity fluids and thick coatings. Edge beads can give rise to an air gap between the substrate and the patterning mask during UV exposure, which results in non-uniform patterns. Furthermore, the sample may break since the edge bead is in contact with the mask. In particular, the SU-8 coating thickness of the chip-level substrates used in MEMS or BioMEMS may not be properly controlled because of the presence of edge beads. The proposed method to solve the edge bead problem can be easily and economically utilized without the need for a special device or chemicals. This method is simple and prevents edge bead formation on the sample substrate. Despite the small loss in the taping area, the uniformity of the SU-8 coating is improved from 50.9% to 5.6%.

• Design & Manufacturing
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• 제15권1호
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• pp.32-40
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• 2021

Mold design for in-mold coating was carried out to achieve simultaneous injection molding and two-color coating for car gas cap cover. The developed mold includes one core and three cavities which are composed of a substrate cavity and two coating cavities. To provide a sealing edge for complete seal during the second coating, the first coated material was used at the boundary between the first coating and the second one, and injection molded substrate was used at the parting line. The materials used were PC/ABS for substrate and 2-component Polyurea for coating. Through experiments, it was found that the suggested sealing edges were effective for complete seal during the second coating. In cavity pressure traces, there were three peaks caused by mold closing, coating-material injection and cleaning-piston advancement inside the mixing head. The cavity pressure increased with decreasing coating thickness.