• Journal of the Optical Society of Korea
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• 제7권3호
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• pp.166-173
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• 2003

This paper presents micromachining results on planar-lightwave-circuit (PLC) chips with Si substrate and the quartz substrate by using Ti:Sapphire femtosecond-pulsed laser. The ablation process with femtosecond laser pulses generates nothing of contamination, molten zone, microcracks, shock wave, delamination and recast layer. We also showed that the micromachine for PLC using femtosecond pulsed lasers is superior to that using nanosecond pulsed lasers. The insertion loss and the optical return loss of the 1 ${\times}$ 8 optical power splitters packaged with micromachined input- and output-port U-grooves were less than 11.0 ㏈ and more than 55 ㏈, respectively. The wavelength dependent loss (WDL) was distributed within $\pm$0.6 ㏈ and the polarization dependent loss (PDL) was less than 0.2 ㏈.

• 한국전기전자재료학회논문지
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• 제26권6호
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• pp.429-433
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• 2013

PTFE composites for use of microwave substrate were fabricated by impregnation and heat treatment fabrication with glass fabric. This study shows dielectric properties such as dielectric constant and loss can be controlled by thickness of PTFE composite with change of pressure condition in heating press process. The dielectric constant of the PTFE composites has decreasing tendency as given higher pressure condition. The dielectric loss has similar result too. Especially, the case of the dielectric loss was affected by the condition of pressure at heating press and had the best performance under 3 MPa. In order to see the reason why thickness conditions make different, their microstructures were also observed.

• 한국전기전자재료학회논문지
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• 제17권6호
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• pp.598-601
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• 2004

A microstrip filter has been designed and fabricated in hairpin form on a GaAs substrate and its characteristics such as the insertion loss, return loss, and bandwidth have been investigated. The presented filter is realized with relatively small size, 4.5 by 3.6 mm. The insertion loss and return loss of the filter are 1.17 dB and 30 dB, respectively. The filter exhibits 3 dB-bandwidth of 350 MHz at the center frequency, 5.890 GHz. The experimental results show good agreement with the numerical ones. However, the measured center frequency is about 100 MHz higher than the designed one.

• Journal of electromagnetic engineering and science
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• 제11권3호
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• pp.201-206
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• 2011

This paper presents a miniaturized epsilon negative (ENG) zeroth-order resonance (ZOR) patch antenna with an improved bandwidth. The miniaturization and the broad bandwidth of the ENG ZOR patch antenna are achieved by using a meandered via and a high permeability substrate instead of a straight via and a dielectric substrate. The use of a meandered via allows miniaturization of the ENG ZOR patch antenna without narrowing the bandwidth. The use of a high permeability substrate allows further miniaturization of the ENG ZOR patch antenna and improvement of the bandwidth. A high permeability substrate consisting of a multi-layered substrate is designed to have a small material loss. The antenna (kr=0.32) has a 10 dB fractional bandwidth of ~1 %, which is 1.74 times as broad as that of an antenna with a dielectric substrate.

• 한국인터넷방송통신학회논문지
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• 제18권1호
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• pp.159-165
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• 2018

논문은 밀리미터파 통신 및 레이더 응용을 위한 저손실 광대역 도파관 변환기를 제안한다. 기존 E-plane 프로브 변환기는 밀리미터파 대역에서 도파관 크기를 고려하여 매우 얇고 유연한 기판을 사용한다. 하지만, 이러한 기판은 휘어지기 쉬우며 이는 성능을 크게 저하시킨다. 이러한 문제점을 해결하기 위하여 변환기 프로브가 도파관 벽면 틈에 삽입되어 고정되는 연장된 E-plane 프로브 구조를 제안하고, 두께가 $127{\mu}m$이고 유전율 2.2인 기판을 사용하여 제작하였다. W-대역 (75-110 GHz)에서 측정된 백투백(back-to-back) 변환기의 삽입 손실은 3cm 길이 도파관을 포함하여 1.35 dB (${\pm}0.35dB$)이며, 반사 손실은 13.8 dB 이상으로 아주 우수한 특성을 보였다. 따라서, 제안된 변환기는 밀리미터파 초고속 흉신 또는 고감도 레이다에 효과적으로 활용될 수 있다.

• 한국인터넷방송통신학회논문지
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• 제18권5호
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• pp.63-68
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• 2018

본 논문에서는 24GHz ISM 밴드(24-24.25GHz)에서 SIW를 이용한 SoS(System on Substrate)구현을 위한 제반 설계를 하고자하며 그 일환으로 SIW, 전환기 및 MPAA를 SoS형태로 동일 기판에 집적하여 그 특성을 분석하였다. 기판은 비유 전율이 3.48이고 두께가 20mil인 Rogers사의 Ro4350을 사용하였다. 최적 설계결과 길이 11.55mm의 SIW의 삽입손실은 0.32dB를 보였으며 $50{\Omega}$ 마이크로 스트립으로 신호전환 하는 데 0.19dB의 삽입손실이 발생하였다. SoS형태로 동일 기판에 집적된 MPAA의 특성은 단독 MPAA의 특성과 매우 유사했다. 그러나 집적된 MPAA는 단독 MPAA에 비해 이득 면에서는 SIW와 전환기의 삽입손실 만큼(0.58dB) 감소했으며 SLL은 0.7dB만큼 감소하였다. 반면에 대역폭은 670MHz에서 800MHz로 19.4%만큼 증가하였다.

• 마이크로전자및패키징학회지
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• 제15권3호
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• pp.53-58
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• 2008

본 연구에서는 상용화된 2.4 GHz 영역대에서 사용되어지는 WiFi용 DPDT(Double Pole Double throw) switch 칩을 laser 비아 가공과 도금 공정을 이용하여 폴리머 기판내에 내장시켜 그 특성을 분석하였으며 통상적으로 실장되는 wire 본딩방식으로 패키징된 기판과 특성차이를 분석 비교하였다. 폴리머는 FR4기판과 아지노 모토사의 ABF(Ajinomoto build up film)를 이용하여 패턴도금법으로 회로를 형성하였다. ABF공정의 최적화를 위해 폴리머의 경화정토를 DSC (Differenntial Scanning Calorimetry) 및 SEM (Scanning Electron microscope)으로 분석하여 경화도에 따라 도금된 구리패턴과의 접착력을 평가하였다. ABF의 가경화도가 $80\sim90%$일 경우 구리층과 최적의 접착강도를 보였으며 진공 열압착공정을 통해 기공(void)없이 칩을 내장할 수 있었다. 내장된 기관과 와이어 본딩된 기판의 측정은 S 파라미터를 이용하여 삽입손실과 반사손실을 비교 분석하였으며 그 결과 삽입손실은 두 경우 유사하게 나타났지만 반사손실의 경우 칩이 내장된 경우 6 GHz 까지 -25 dB 이하로 안정적으로 나오는 것을 확인할 수 있었다.

• ETRI Journal
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• 제39권6호
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• pp.866-873
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• 2017

We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature co-fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At $175^{\circ}C$, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current ($I_{RM}$), reverse recovery time ($T_{rr}$), and reverse recovery charge ($Q_{rr}$) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to $300A/{\mu}s$.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.1664-1667
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• 2003

Aperture-coupled microstrip antenna is one type of microstrip antennas. This type of antenna has bandwidth wider than simple microstrip antenna. Herein, we use two substrates, that have the same dielectric constant 2.47 (PTFE-quartz) in which upper substrate is a rectangular patch. The microstrip patch is fed by a microstrip line which is printed on lower substrate, through an aperture or slot in the common ground plane of patch and microstrip feed. This antenna is analyzed by using Finite Difference Time Domain (FDTD) method the specific design frequency 10 GHz and match impedance is 50 ohms. The simulation results of its characteristics are input impedance, return loss, VSWR and radiation patterns respectively.

• 한국전기전자재료학회논문지
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• 제14권6호
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• pp.481-486
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• 2001

ZnO thin films on glass substrate were depostied by RF magnetron reactive sputter with various argon/oxygen gas ratios and substrate temperatures. Crystallinities, surface morphologies, chemical compositions, and electrical properties of the films were investigated by XRD, SEM, XPS and electrometer(keithley 617). All films showed a strong preferred orientation along the c-axis on glass substrate, and the chemical stoichiometry was obtained at Ar/O$_2$.=50/50. The propagation velocity of ZnO SAW filter was about 2,590 m/sec and insertion loss was a minimum value of abut -21dB.