• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.418-418
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• 2012

Synthesis of nanocrystalline diamond powder was investigated via a gas-to-particle scheme using the hot filament chemical vapor deposition. Effect of substrate surface seeding by nano diamond powder, and that of the electrical conductance of the substrate were studied. The substrate temperature, methane content in the precursor gas, filament-substrate distance and filament temperature were $670^{\circ}C$, 5% methane in hydrogen, 10 mm and $2400^{\circ}C$, respectively. The powder formation by gas-to-particle mechanism were greatly enhanced by the substrate seeding by the nano diamond powder. It was attributed to the removal of the electrostatic force between the substrate and the seeded nano diamond particle by the thermal electron shower from the hot filament, via the depolarization of the substrate surface or the attached diamond powder and subsequent levitation into the gas phase to serve as the gas-phase nucleation site. The powder formation was greatly favoured by the conducting substrate relative to the insulating substrate, which proved the actual effect of the electric static force in the powder formation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.11 s.254
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• pp.1392-1400
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• 2006

Since the monolithic ceramic substrate was in introduced for automotive catalytic converters, the durability of the substrate has been a continuing requirement to reduce the emission, gas of vehicle. The substrate can occupy a volume as small as 82 $cm^3$ and as large as 8200 $cm^3$ to provide the required substrate for catalytic activity. The long-term durability varies with the size of the substrate from manufacture's point of view. Therefore this study presents that the response surface model using central composite design can explain size effect on the modulus of rupture in a cordierite ceramic monolithic substrate.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.343-347
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• 2004

We investigated the growth feasibility of polycrystalline Si film on mica substrate for the transfer of the layer to a plastic substrate. The annealing temperature was limited up to $600^{\circ}C$ because of crack development in the mica substrate. Amorphous Si film was deposited on mica substrate by PECVD and was crystallized by furnace annealing. During the annealing, bubbles were formed at the Si/mica interface. The bubble formation was avoided by the Ar-plasma treatment before amorphous Si deposition. A uniform and clean polycrystalline Si film was obtained by coating $NiCl_2$ on the amorphous Si film and annealing at $500^{\circ}C$ for 10 h. The conventional Si lithography was possible on the mica substrate and the devices fabricated on the substrate could be transferred to a plastic substrate.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.1
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• pp.19-29
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• 1991

This study was to investigate the influence of the substrate hardness on the hardness and adhesion of TiN thin film deposited by R.F. PACVD. Although the substrate hardness changed, chemical composition, stoichiometry and structure of TiN thin film did not change. ISE index was 1.96-1.99 for the substrate and was 1.57-1.79 for TiN thin film. And ISE index of TiN thin film was inverse proportion to the substrate hardness. When the substrate hardness was low, TiN thin film had many cracks around the indentation. But as the substrate hardness increased, TiN thin film had a few cracks and the deformation was limited within indentation. In having measured the adhesion of TiN thin film by SAT, the critical load (Lc) generally increased as the substrate hardness decreased.

• Journal of Environmental Science International
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• v.24 no.9
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• pp.1221-1231
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• 2015

The present study was conducted to find a way to recycle the coir substrate by investigating changes in its physical and chemical properties based on the number of use year. Specific gravity of unused coir substrate was $0.212g/cm^3$, while it was higher for the substrate used for 2 years. Porosity was different depending on the number of use year. The porosity of unused substrate was 51.9%, but it increased to 68.6% after used for 2 years. In general, physical and chemical properties were better in the coir substrate used for 2 years than in unused one. The number of leaves, leaf area, flesh weight and dry weight of oriental cabbage and lettuce were higher in coir substrate used for 2 years than those in unused one. Whereas, no significant difference was observed between the substrates used for one year and 2 years, indicating that the one time-used wast substrate could be recycled for cultivating vegetables. Growth of the vegetables was improved when organic fertilizer composed of complex organics with different mixing ratios was provided to the coir substrate, compared to untreated plot. The optimum mixing ratio of the wast substrate and complex organics was 2:8(v/v) for fertilization using wast coir substrate. Therefore, coir substrate generally wasted after being used for one time was reuseable by supplying organic fertilizer.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.2
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• pp.114-125
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• 2009

Effect of a finite square substrate plane on the radiation characteristics of a microstrip patch antenna is investigated. Effect of a finite square substrate plane on the resonance frequency and bandwidth is very small, while that on the radiation pattern is very large. The gain of front radiation and the direction of the maximum gain vary almost periodically with the length of a square substrate plane. The length of a square substrate plane for the maximum gam and the minimum gain of front radiation decrease as the electrical thickness of a substrate increases. The variation of the gain of front radiation with the length of a square substrate plane increases as the electrical thickness of a substrate increases. The variation of the radiation pattern with the length of a square substrate plane is almost determined by the electrical thickness of a substrate.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.129-135
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• 2018

In the stretchable electronic devices, the stretchable substrate is a very essential material which determines the stretchability, performances and durability of the stretchable electronic devices. In particular, the current stretchable materials have hysteresis making difficult to used as sensors and other electronic devices. In this study, we developed a PDMS-Ecoflex hybrid stretchable substrate mixed with PDMS and Ecoflex material in order to increase stretchability and improve hysteresis characteristics. Mechanical behavior of the hybrid substrate was evaluated using a tensile test, and optical transmittance of the hybrid substrate was also measured. As the content of Ecoflex increases, the PDMS-Ecoflex hybrid substrate becomes more flexible, and the elastic modulus decreases. In addition, the PDMS substrate failed a tensile strain of 270%, while the PDMS-Ecoflex hybrid substrate did not fail even at 500% strain indicating excellent stretchability. In the repeated tensile test, the hybrid substrate with 2:1 mixing ratio of PDMS and Ecoflex showed hysteresis. On the other hand, in the case of the hybrid substrate with the mixing ratio of 1:1, hysteresis did not occur at a strain of 50% and 100%. Hence, we developed a stretchable substrate with over 150% stretchability and no hysteresis characteristics. The optical transmittance of the Ecoflex substrate was 68.6%, whereas the transmittances of the hybrid substrate with mixing ratio of 2:1 and 1:1 were 78.6% and 75.4%, respectively. These results indicate that the PDMS-Ecoflex hybrid substrate is a potential candidate for a transparent stretchable substrate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.75-87
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• 2001

Three different kinds of substrate used in this study : bare Cu substrate, Ni-P/Cu substrate with a Ni-P layer thickness of $5\mu\textrm{m},$ and Au/Ni-P/Cu substrate with the Ni-P and Au layers of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness respectively. The wettability of various Sn-base solders was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the Au/Ni-F/Cu substrate, Sn-base solders wet better than any of the other substrate metal finishes tested. The interfacial reaction between various substrate and Sn-base solder was investigated at $70^{\circ}C,$ $100^{\circ}C,$ $120^{\circ}C,$ $150^{\circ}C,$ $170^{\circ}C$ and $200^{\circ}C$ for reaction times ranging from 0 day to 60 day. Intermetallic phases was formed along a Sn-base solder/ various substrate interface during solid-state aging. The apparent activation energy for growth of Sn-Ag/Cu, Sn-Ag-Bi/Cu, and Sn-Bi/Cu couples were 65.4, 88.6, and 127.9 Kj/mol, respectively. After isothermal aging, the fracture surface shoved various characteristics depending on aging temperature and time, and the types of BGA pad.

• Korean Journal of Materials Research
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• v.25 no.9
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• pp.487-491
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• 2015

In photovoltaic power generation where minority carrier generation via light absorption is competing against minority carrier recombination, the substrate thickness and material quality are interdependent, and appropriate combination of the two variables is important in obtaining the maximum output power generation. Medici, a two-dimensional semiconductor device simulation tool, is used to investigate the interdependency in relation to the maximum power output in front-lit Si solar cells. Qualitatively, the results indicate that a high quality substrate must be thick and that a low quality substrate must be thin in order to achieve the maximum power generation in the respective materials. The dividing point is $70{\mu}m/5{\times}10^{-6}sec$. That is, for materials with a minority carrier recombination lifetime longer than $5{\times}10^{-6}sec$, the substrate must be thicker than $70{\mu}m$, while for materials with a lifetime shorter than $5{\times}10^{-6}sec$, the substrate must be thinner than $70{\mu}m$. In substrate fabrication, the thinner the wafer, the lower the cost of material, but the higher the cost of wafer fabrication. Thus, the optimum thickness/lifetime combinations are defined in this study along with the substrate cost considerations as part of the factors to be considered in material selection.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.12
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• pp.6106-6113
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• 2013

Automotive three-way catalyst substrate has a cordierite ceramic honeycomb structure. The substrate in the high engine speed range doesn't satisfy the design fatigue life due to the low mechanical properties of cordierite ceramic. SiC ceramic has higher mechanical properties than cordierite ceramic. If the automotive three-way catalyst substrate is made from the SiC ceramic honeycomb structure, the substrate can be prevented from premature failure. In this study, the mechanical properties of SiC ceramic honeycomb substrate were estimated by FEA. The FEA results indicated that the MOR and elastic modulus for the SiC ceramic honeycomb substrate was much higher than those for the cordierite ceramic honeycomb substrate.