• Korean Journal of Agricultural and Forest Meteorology
• /
• v.20 no.1
• /
• pp.101-116
• /
• 2018

Sustainability science is an emerging transdisciplinary research which necessitates not only the communication and collaboration of scientists, practitioners and stakeholders from different disciplines and interests, but also the paradigm shift from deterministic and reductionist approaches to the old basic. Ecological-societal systems (ESS) are co-evolving complex systems having many interacting parts (or agents) whose random interactions at local scale give rise to spontaneous emerging order at global scale (i.e., self-organization). Here, the flows of energy, matter and information between the systems and their surroundings play a key role. We introduce a conceptual framework for such continually morphing dynamical systems, i.e. self-organizing hierarchical open systems (SOHOs). To understand the structure and functionality of SOHOs, we revisit the two fundamental laws of physics. Re-interpretation of these principles helps understand the destiny and better path toward sustainability, and how to reconcile ecosystem integrity with societal vision and value. We then integrate the so-called visioneering (V) framework with that of SOHOs as feedback/feedforward loops so that 'a nudged self-organization' may guide systems' agents to work together toward sustainable ESS. Finally, example is given with newly endorsed Sustainable Development Goals (SDG) Lab (i.e., 'Rural systems visioneering') by Future Earth, which is now underway in rural villages in Tanzania.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.1 no.1
• /
• pp.8-16
• /
• 2013

Currently, global warming has advanced by the usage of fossil fuels such as coal and petroleum. and the atmosphere temperature in the world of 100 years(1906~2005) has been risen $0.74^{\circ}C{\pm}0.18^{\circ}C$, IPCC announced that the global warming effect of last decade was nearly doubled compared to the changes($0.07^{\circ}C{\pm}0.02^{\circ}C$/10year) in the past 100 years. Moreover, due to the global warming, heat wave, heavy snow, heavy rain, super typhoon, were caused and are increasing to happen in the world continuously causing damages and destruction of social infrastructures, where concrete structures are suffering deterioration by long-term extreme climate changes. to solve these problems, the new construction technology and codes are necessary. In this study, to solve these problems, experiments on a variety of cases considering the temperature and humidity, the main factors of climate factors, were performed, and the cases are decided by temperature and humidity. The specimens were tested in compressive strength test and split tensile test by the curing age(3,7,28 days) morever, performance based design(PBD) method was applied by using the satisfaction curve developed from the experiment date. PBD is the design method that gathers the current experimental analysis and past experimental analysis and develops the material properties required for the structure, and carries out the design of concrete mix, and it is recently studied actively worldwide. Also, it is the ultimate goal of PBD to design and perform on structures have sufficient performance during usage and to provide the problem solving for various situations, Also, it can achieve maximum effect in terms of functionality and economy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.239-240
• /
• 2008

As semiconductor devices are scaled down for better performance and more functionality, the Cu-based interconnects suffer from the increase of the resistivity of the Cu wires. The resistivity increase, which is attributed to the electron scattering from grain boundaries and interfaces, needs to be addressed in order to further scale down semiconductor devices [1]. The increase in the resistivity of the interconnect can be alleviated by increasing the grain size of electroplating (EP)-Cu or by modifying the Cu surface [1]. Another possible solution is to maximize the portion of the EP-Cu volume in the vias or damascene structures with the conformal diffusion barrier and seed layer by optimizing their deposition processes during Cu interconnect fabrication, which are currently ionized physical vapor deposition (IPVD)-based Ta/TaN bilayer and IPVD-Cu, respectively. The use of in-situ etching, during IPVD of the barrier or the seed layer, has been effective in enlarging the trench volume where the Cu is filled, resulting in improved reliability and performance of the Cu-based interconnect. However, the application of IPVD technology is expected to be limited eventually because of poor sidewall step coverage and the narrow top part of the damascene structures. Recently, Ru has been suggested as a diffusion barrier that is compatible with the direct plating of Cu [2-3]. A single-layer diffusion barrier for the direct plating of Cu is desirable to optimize the resistance of the Cu interconnects because it eliminates the Cu-seed layer. However, previous studies have shown that the Ru by itself is not a suitable diffusion barrier for Cu metallization [4-6]. Thus, the diffusion barrier performance of the Ru film should be improved in order for it to be successfully incorporated as a seed layer/barrier layer for the direct plating of Cu. The improvement of its barrier performance, by modifying the Ru microstructure from columnar to amorphous (by incorporating the N into Ru during PVD), has been previously reported [7]. Another approach for improving the barrier performance of the Ru film is to use Ru as a just seed layer and combine it with superior materials to function as a diffusion barrier against the Cu. A RulTaN bilayer prepared by PVD has recently been suggested as a seed layer/diffusion barrier for Cu. This bilayer was stable between the Cu and Si after annealing at $700^{\circ}C$ for I min [8]. Although these reports dealt with the possible applications of Ru for Cu metallization, cases where the Ru film was prepared by atomic layer deposition (ALD) have not been identified. These are important because of ALD's excellent conformality. In this study, a bilayer diffusion barrier of Ru/TaCN prepared by ALD was investigated. As the addition of the third element into the transition metal nitride disrupts the crystal lattice and leads to the formation of a stable ternary amorphous material, as indicated by Nicolet [9], ALD-TaCN is expected to improve the diffusion barrier performance of the ALD-Ru against Cu. Ru was deposited by a sequential supply of bis(ethylcyclopentadienyl)ruthenium [Ru$(EtCp)_2$] and $NH_3$plasma and TaCN by a sequential supply of $(NEt_2)_3Ta=Nbu^t$ (tert-butylimido-trisdiethylamido-tantalum, TBTDET) and $H_2$ plasma. Sheet resistance measurements, X-ray diffractometry (XRD), and Auger electron spectroscopy (AES) analysis showed that the bilayer diffusion barriers of ALD-Ru (12 nm)/ALD-TaCN (2 nm) and ALD-Ru (4nm)/ALD-TaCN (2 nm) prevented the Cu diffusion up to annealing temperatures of 600 and $550^{\circ}C$ for 30 min, respectively. This is found to be due to the excellent diffusion barrier performance of the ALD-TaCN film against the Cu, due to it having an amorphous structure. A 5-nm-thick ALD-TaCN film was even stable up to annealing at $650^{\circ}C$ between Cu and Si. Transmission electron microscopy (TEM) investigation combined with energy dispersive spectroscopy (EDS) analysis revealed that the ALD-Ru/ALD-TaCN diffusion barrier failed by the Cu diffusion through the bilayer into the Si substrate. This is due to the ALD-TaCN interlayer preventing the interfacial reaction between the Ru and Si.