• The Transactions of the Korean Institute of Electrical Engineers
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• v.40 no.5
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• pp.496-500
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• 1991

The effects of annealing with and without magnetic field on magnetic properties of amorphous Fe-B-Si cores have been investigated as a function of toroidal stress. By decreasing the toroidal stress, the magnetic properties of the amorphous ribbon have beenimproved. Near 180 domain walls exist in the thermally annealed toroidal cores, but the domain walls exist in the thermally annealed toroidal cores, but the domain walls are not parallel to the longitudinal direction of the ribbon. In the specimen annealed with a magnetic field strength of 10 Oe in the longitudinal ribbon length axis, the domains are nearly parallel to the longitudinal direction due to the field induced uniaxial anisotropy resulting in further increase in the remanent magnetization and decrease in the coercive force and loss.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6898-6905
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• 2014

A stress ribbon bridge is a PSC structure that behaves as a reverse arch structure due to post-tensioned thin deck of the catenary type. In foreign countries, the stress ribbon bridge is recognized as the minimum destruction of nature and beautiful bridge, and has many construction examples as pedestrian and car bridges. On the other hand, there have been few studies in Korea. In this study, the FE Analysis model was established for different construction stages considering the nonlinear and time-dependent behaviors. The FE model was verified by a comparison with the numerical results and the behavior was analyzed for the different construction stages.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.48.1-48.1
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• 2011

In this presentation, We monitored weather data, such as global irradiance, ambient temperature, temperature of PV module, relative humidity and windspeed for 2 years, for determining accelerated test condition. then, we determined the temperature limit of accelerated test through weather data and FEM analysis. Detailed procedures will be summarized in this work. After analysing outdoor stress such as thermal stress, we decided main failure modes and mechanisms of PV module, especially solder joint of ribbon wire. we carried out the measurement of material properties such as thermal expansion coefficient for planning of accelerated test. we designed accelerated test based on FEM analysis results. we carried out thermal cycling test with 1 cell mini module for 3 months. We monitored the change of electrical performance every 1 week such as Voc, Isc, Pmax, etc. and then, we analized the ribbon wire/electrode intefaces. Detailed results will be summarized in this work.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.5
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• pp.2474-2480
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• 2013

A stress ribbon pedestrian bridge is the structure in which the axial force of prestressed deck, which is developed by introducing prestressed force into the thin deck with the very low value of span to deck-depth ratio which is installed on bearing cables with the specified sag, resists most of external loadings. Since the design of stress ribbon pedestrian bridges should be conducted by assuming the cross-section of deck, the area of bearing cables and post-tensioning cables, and the prestressed force of post-tensioning cables, it requires much more iterative processes than the design of general bridges. In this research, to minimize such iteration processes, regression equations which can reasonably assume the area of bearing cables and post-tensioning cables, and the prestressed force of post-tensioning cables, are suggested for the bridge length of 80m with the sag-span ratios of 1/30, 1/40, and 1/50.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of the Korean Society for Heat Treatment
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• v.30 no.6
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• pp.251-257
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• 2017

The effect of annealing temperature on the martensitic transformation behavior, tensile deformation chracteristics and shape recovery etc., has been studied in TiNi based shape memory ribbon fabricated by coldrolling of wire. TiNi based shape memory wire (${\phi}=500{\mu}m$) of which structure is intermetallic compound could be cold-rolled without process annealing up to the reduction rate in thickness of 50%, but a few cracks appear in cold-rolled ribbon in the reduction rate in thickness of 65%. The $B2{\rightarrow}R{\rightarrow}B19^{\prime}$ martensitic transformation or $B2{\rightarrow}B19^{\prime}$ martensitic transformation occurs in annealing conditions dissipating lattice defects introduced by coldrolling. However, in case of higher reduction rate or lower annealing temperature, martensitic transformation in cold-rolled and then annealed ribbons does not occur. The maximum shape recovery rate of cold-rolled ribbons with the reduction rate of 35 and 65% could be achieved at annealing temperatures of 250 and $350^{\circ}C$, respectively. The shape recovery rate seems to be related to the stress level of plateau region on stress-strain curve.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.11-13
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• 2002

The performance of DC current sensor based on giant magnetoimpedance (GMI) effect in amorphous ribbon has been tested. The ribbon after field annealing shows the maximum GMI ratio of 30 % at 100 kHz measuring frequency. In the sensor element of sample wound the circular form, GMI ratio and sensitivity are decreased due to internal stress. The sensor voltage output increases with applied DC current up to 1 A with a good linearity, of which direction can be known due to asymmetric characteristics.

• Wind and Structures
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• v.2 no.2
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• pp.95-104
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• 1999

The dynamic properties of one-span or multi-span reinforced concrete footbridges of catenary form (see e.g., Fig. 1) include the very low fundamental natural frequency, usually near the step-frequency of pedestrians, and the low damping of bending vibrations. The paper summarized the results of model as well as full-scale measurements with particular reference to the influence of torsional rigidity of the stress-ribbon on the magnitude of aerodynamic response, the results of measurements on footbridges of catenary form being completed by results obtained on footbridges of some other types. Additionally the influence of the local broadening of the bridge deck on the bridge response was tested. Starting from these results the criterion has been derived for the decision, whether the flutter analysis is necessary for the design of the footbridge.

• Structural Engineering and Mechanics
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• v.34 no.2
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• pp.213-229
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• 2010

An analytical method is proposed for the evaluation of the static response of a prestresse-dribbon concrete pedestrian bridge, which may also be applied for the roofing of large areas. On the basis of an established analogy with a suspension bridge system, a procedure is presented for the prestresse-dribbon direct analysis, leading to the introduction of two dimensionless parameters as governing factors of the design, namely the thinness and the prestressing steel ratio. The exposed procedure, applied by a simple computer program, allows a quick evaluation of the response and permits the investigation of the influence of the aforementioned parameters on it, by means of comprehensive diagrams. The presented diagrams may be directly used for the preliminary design of a pedestrian bridge of this type, for the whole practical range of span lengths. A design example is also included, showing the applicability of the proposed procedure.

• Journal of the Korean Solar Energy Society
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• v.38 no.1
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• pp.45-55
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• 2018

Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi${\cdots}$) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> $200^{\circ}C$) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.