• 한국정밀공학회지
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• 제20권9호
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• pp.159-165
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• 2003

Most engineers interested in stress singularities have focused mainly on the research of power stress singularities for v-notched cracks in dissimilar materials. The logarithmic stress singularity was discussed a little in Bogy's paper. The power-logarithmic stress singularity was reported by Dempsey and Sinclair. It was indicated that the logarithmic singularity is only a special case of power-logarithmic stress singularities. Then, Dempsey reported specific cases which have power-logarithmic singularities even fur homogeneous boundary conditions. It was known that logarithmic stress singularities for v-notched cracks in dissimilar materials occurs when the surfaces of a v-notched crack have constant tractions. In this paper, using the complex potential method, the stresses and displacements having logarithmic stress singularities were obtained and the coefficients vectors were calculated by a numerical program code: Mathematica. It was shown that our analysis models don't have logarithmic stress singularities under the constant tractions, although the coefficient vectors are existing.

• 한국공작기계학회논문집
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• 제14권5호
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• pp.62-73
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• 2005

The objects of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of adhesive joint of different three type such as butt joint, T-shape, and single lap Joints. The criteria of peel occurrence at the bond terminus was suggested. Peel loads of three type adhesive joint (butt Joint, T-shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with stress singularity factor$(K_{prin})$ when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity $(K_{prin})$ can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress has not affected singularity at the bond terminus. Average principal stress$(K_{av})$ can use as the criteria of peel occurrence at the bond terminus.

• 대한기계학회논문집A
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• 제24권3호
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• pp.685-690
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• 2000

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. Th e time domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• 한국해양공학회지
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• 제17권6호
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• pp.72-76
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• 2003

This paper deals with the stress singularity developed in a polymer layer that is coated to a concrete surface, due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. The polymeric layer is assumed to be a linear viscoelastic material, and is thermorheologically simple. The order of the singularity is obtained, numerically, for a given viscoelastic model. Numerical results exhibit the relaxation of interface stresses, and large gradients are observed in the vicinity of the free surface. Results show that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model.

• 한국자동차공학회논문집
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• 제14권4호
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• pp.59-67
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• 2006

Recently, application of friction welded SUH35/SUH3 is increasing in the manufacturing process of automotive engine valves For securing its reliability and a reasonable strength evaluation method, it is necessary to assess stress singularity under the residual stress condition on the friction welded interface between dissimilar materials. In this paper, strength evaluation method of friction welded materials was investigated by boundary element method and static tensile testing. An advanced method of quantitative strength evaluation for SUH35/SUH3 friction welded material is to be suggested by establishing fracture criterion by using stress singularity factors.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.137-142
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• 2002

This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of Interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• 전산구조공학
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• 제10권2호
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• pp.131-138
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• 1997

이 논문에서는, 균일한 횡방향 인장변형률이 작용하는 조건에서 강체모재들을 결합하고 있는 점탄성 접착재층의 계면모서리에 발생하는 응력 특이성을 조사하고있다. Williams방법을 응용하여 라플라스 변형공간에서 특성방정식을 구하였고, 주어진 점탄성 모델에 대해서 변형공간에서의 특성방정식을 시간공간으로 해석적으로 전환하였다. 시간 공간에서의 특이차수는 수치적으로 계산하였다. 계면을 따라 발생하는 응력의 특성을 조사하는데 시간영역 경계요소법을 적용하였다. 수치해석 결과에 의하면, 특이차수는 시간이 경과함에 따라 커지는 반면에, 자유모서리 응력확대계수는 시간에 따라 이완되는 특성을 보여주고 있다.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• 한국생산제조학회지
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• 제8권1호
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• pp.35-44
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• 1999

In a view point of earth environmental protection and social requirement, adhesively bonded structures of aluminum alloys have become to be employed for the purpose of decreasing fuel ratio by weight reduction and to improve performance in various engineering fields such as aircrafts, automobiles, rolling stocks and so on. In spite of such wide applications in adhesively bonded structures of aluminum alloys, the quantitative fracture criterion and evolution method of its bonded strength have not been established yet. The objective of this paper is to establish fracture criterion considering stress singularity at interface edges in adhesively bonded structures of aluminum alloys. Through the analyses of boundary element method and static fracture experiments with three different types of specimens in the adhesively bonded joints of aluminum alloys, its fracture criterion was proposed and discussed about strength evolution of adhesively bonded structures.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.