• Journal of the Korean Society for Precision Engineering
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• v.20 no.9
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• pp.159-165
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• 2003

Most engineers interested in stress singularities have focused mainly on the research of power stress singularities for v-notched cracks in dissimilar materials. The logarithmic stress singularity was discussed a little in Bogy's paper. The power-logarithmic stress singularity was reported by Dempsey and Sinclair. It was indicated that the logarithmic singularity is only a special case of power-logarithmic stress singularities. Then, Dempsey reported specific cases which have power-logarithmic singularities even fur homogeneous boundary conditions. It was known that logarithmic stress singularities for v-notched cracks in dissimilar materials occurs when the surfaces of a v-notched crack have constant tractions. In this paper, using the complex potential method, the stresses and displacements having logarithmic stress singularities were obtained and the coefficients vectors were calculated by a numerical program code: Mathematica. It was shown that our analysis models don't have logarithmic stress singularities under the constant tractions, although the coefficient vectors are existing.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.5
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• pp.62-73
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• 2005

The objects of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of adhesive joint of different three type such as butt joint, T-shape, and single lap Joints. The criteria of peel occurrence at the bond terminus was suggested. Peel loads of three type adhesive joint (butt Joint, T-shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with stress singularity factor$(K_{prin})$ when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity $(K_{prin})$ can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress has not affected singularity at the bond terminus. Average principal stress$(K_{av})$ can use as the criteria of peel occurrence at the bond terminus.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.3 s.174
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• pp.685-690
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• 2000

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. Th e time domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Journal of Ocean Engineering and Technology
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• v.17 no.6
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• pp.72-76
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• 2003

This paper deals with the stress singularity developed in a polymer layer that is coated to a concrete surface, due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. The polymeric layer is assumed to be a linear viscoelastic material, and is thermorheologically simple. The order of the singularity is obtained, numerically, for a given viscoelastic model. Numerical results exhibit the relaxation of interface stresses, and large gradients are observed in the vicinity of the free surface. Results show that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.4
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• pp.59-67
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• 2006

Recently, application of friction welded SUH35/SUH3 is increasing in the manufacturing process of automotive engine valves For securing its reliability and a reasonable strength evaluation method, it is necessary to assess stress singularity under the residual stress condition on the friction welded interface between dissimilar materials. In this paper, strength evaluation method of friction welded materials was investigated by boundary element method and static tensile testing. An advanced method of quantitative strength evaluation for SUH35/SUH3 friction welded material is to be suggested by establishing fracture criterion by using stress singularity factors.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.137-142
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• 2002

This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of Interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Computational Structural Engineering
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• v.10 no.2
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• pp.131-138
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• 1997

This paper concerns the stress singularity at the interface corner of the viscoelastic adhesive layer bonded between rigid adherends, subjected to a uniform transverse tensile strain. The characteristic equation is derived in the Laplace transformed space, following Williams, and the transformed characteristic equation is inverted analytically into real time space for the viscoelastic model considered here. The order of the singularity is obtained numerically. The time-domain boundary element method is employed to investigate the nature of stresses along the interface. Numerical results show that the order of the singularity increases with time while the free-edge stress intensity factors are relaxed with time.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.1
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• pp.35-44
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• 1999

In a view point of earth environmental protection and social requirement, adhesively bonded structures of aluminum alloys have become to be employed for the purpose of decreasing fuel ratio by weight reduction and to improve performance in various engineering fields such as aircrafts, automobiles, rolling stocks and so on. In spite of such wide applications in adhesively bonded structures of aluminum alloys, the quantitative fracture criterion and evolution method of its bonded strength have not been established yet. The objective of this paper is to establish fracture criterion considering stress singularity at interface edges in adhesively bonded structures of aluminum alloys. Through the analyses of boundary element method and static fracture experiments with three different types of specimens in the adhesively bonded joints of aluminum alloys, its fracture criterion was proposed and discussed about strength evolution of adhesively bonded structures.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.