• 제목/요약/키워드: stress sensors

검색결과 282건 처리시간 0.027초

디지털-피지컬 구조를 이용한 신체 항상성 유지 공간 연구 (A Study on Usage of Integrated Digital-Physical Structure on Physical Homeostasis Space for Stress Reduction)

  • 강민수
    • 한국멀티미디어학회논문지
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    • 제23권4호
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    • pp.574-580
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    • 2020
  • Stress induces change to the body functions and causes chronic problems such as worsening a disease. Thus, humans want to evade anxiety and would try any means to reduce stressful situations. Generally, a person would handle their stress by either regulating their emotions or merely coping with the situation, for which the former is most widely used. Our research aims to effectively reduce stress by using the emotional response structure developed by Plutichik and the vitalization method. We extracted the relevant components of the stress-reduction method that would be applicable in any space using digital technologies such as sensors, IoT, and augmented reality. An architect or designer may incorporate these structural components into any structure to effectively reduce people's stress. The research aims to provide a new perspective of architectural space and to show applications of the stress-reducing architectural spaces, which should also fulfill the people's needs. Further research is needed to develop an automatic system to utilize spatial components more effectively.

Pilot 공벽변형법에 의한 암반응력 측정 장비의 개발 (Development of Rock Stress Measurement Probe Based on The Pilot Hole Wall Deformation Method)

  • 이기하;석도 양이;구호본;김승현
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 2009년도 춘계 학술발표회
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    • pp.1125-1132
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    • 2009
  • The theory and a probe of the pilot hole wall deformation method, which is a 3-dimensional stress measurement method based on the stress relief principle, were developed. A pilot hole is drilled from the bottom of a borehole and the stress measurement probe is inserted into the pilot hole. The borehole is advanced as the overcoring and the changes in the radius of the pilot hole in three directions and in the axial lengths between the borehole bottom and the pilot hole wall along four axial lines are measured by cantilever type-displacement sensors. The differences between the displacements by the elastic stress analysis and those measured by using the probe were within 3% in the uniaxial compression test of an acrylic resin plate having a hole.

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압력센서의 배선을 위한 다층 박막의 지지조건 변화에 따른 잔류응력 평가 (Evaluation of the Residual Stress with Respect to Supporting Type of Multi-layer Thin Film for the Metallization of Pressure Sensor)

  • 심재준;한동섭;한근조
    • 대한기계학회논문집A
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    • 제28권5호
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    • pp.532-538
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    • 2004
  • MEMS technology applying to the sensors and micro-electro devices is complete system. These microsystems are made by variable processes. Especially, the mentallization process has very important functions to transfer the power operating the sensor and signal induced from sensor part. But in the structures of MEMS the local stress concentration and deformation are often yielded by an irregular geometrical shape and different constraint. Therefore, this paper studies the effect of supporting type and thickness ratio about thin film of the substrate on the residual stress variation when the thermal loads is applied to the multi-layer thin film fabricated by metallization process. Specimens were made from several materials such as Al, Au and Cu. Then, uniform thermal load was applied, repeatedly. The residual stress was measured by FE Analysis and nano-indentation method using AFM. Generally, the specimen made of Al induced the larger residual stress than that of made of other materials. Specimen made of Cu and Au having the low thermal expansion coefficient induces the minimum residual stress. Similarly, the lowest indentation length was measured by nano-indentation method in the Si/Au/Cu specimen. Particularly, clusters are created in the specimen made of Cu by thermal load and the indentation length became increasingly large by cluster formation.

마이크로 스펙트로미터 적외선 센서용 저응력 SiNx Membrane상에서의 최적화된 Thermopile 제작 및 특성 (Characteristics and Fabrication of Optimal Thermopile on SiNx Membrane for Microspectrometer)

  • 김동식
    • 전자공학회논문지 IE
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    • 제44권1호
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    • pp.6-9
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    • 2007
  • 본 연구는 마이크로 스펙트로미터 적외선 센서용으로 thermopile 소자 구조를 이용하여 설계, 제작되어 특성을 평가하였다. MEMS 공정기술을 이용하여 열적 고립 구조를 갖는 Low-stress SiNx 멤브레인상에서 마이크로 thermopile 적외선 센서를 제작하고 특성을 평가하였다. 마이크로 thermopile 적외선 센서를 측정한 결과 열전대 길이, 개수, 멤브레인 넓이에 기전력이 비례하여 출력되고 열전대 물질의 선폭에는 반비례하는 것으로 나타났다. 5가지 요소를 독립적으로 변화시켜 측정한 결과 마이크로 thermopile 적외선 센서는 멤브레인 넓이가 다른 요소에 비해 더 큰 영향을 미쳤다. 이러한 결과로 미루어 본 연구에서 제작된 마이크로 thermopile 적외선 센서는 마이크로 스펙트로미터용 적외선 센서로서 활용이 가능할 것으로 생각되었다.

Effect of Stress on Current-Voltage Characteristics of ZnO Based Ceramics

  • Jung Ju-Yong;Kim Yeong-Cheol;Seo Hwa-Il;Chung Dong-Teak;Kim Young-Jung;Min Joon-Won
    • 반도체디스플레이기술학회지
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    • 제4권4호
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    • pp.1-4
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    • 2005
  • The chemical composition and uniaxial compressive stress are varied to observe their effect on the current-voltage characteristics of ZnO based ceramics. The variation of chemical composition produces two kinds of ceramics showing ohmic and nonohmic current-voltage characteristics. The current at a fixed voltage increased with the increase of the compressive stress for both ohmic and nonohmic ceramics. Ceramics showing nonohmic behavior exhibit better reversible return of current-voltage curve when the applied compressive stress is removed from the ceramics than those showing ohmic behavior do. We found an appropriate chemical composition showing linear relation between current and stress at a fixed voltage. The ceramic materials with an appropriate chemical composition can be used as a potential sensing material in pressure sensors.

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압전필름센서에 의한 구조물의 응력집중의 측정 (Measurement of Structural Stress Concentration by PVDF Film Sensors)

  • 권일범;김치엽;최만용;임종묵;김인걸
    • 한국구조물진단유지관리공학회 논문집
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    • 제4권4호
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    • pp.109-119
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    • 2000
  • PVDF film sensor was applied to measure the stress concentration for monitoring the structural integrity. The strain calibration of this film sensor was performed by the bending test of aluminum beam. The PVDF sensor and the electrical strain gage were bonded on the beam. When the beam was loaded, the output of electrical strain gage was compared with the output of the PVDF sensor. The waveform of PVDF sensor output was shown as the same form of the output of electrical strain gage. The gain was determined as 1.7 by comparing these two signals to determine the exact value of the strain. In order to experiment the stress concentration, the stress field was analyzed by finite element analysis. The tensile test of notched steel specimens was conducted to develop the measurement technique of stress concentration. The output voltage ratio between the PVDF sensor near the notch and the PVDF sensor far from the notch could give the information about the load bearing capacity of steel specimen.

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무구속 심탄도 모니터링 시스템을 이용한 스트레스 분석 기초연구 (Basic Study for Stress Analysis Using an Unconstrained BCG Monitoring System)

  • 노윤홍;정도운
    • 센서학회지
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    • 제20권2호
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    • pp.118-123
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    • 2011
  • Heart related diseases mainly caused by heavy work load and increasing stress in human daily life. Therefore, researches on mobile healthcare monitoring for daily life has been carried out. Notably, wearable healthcare monitoring system which has least restriction has been tried to provide an emergency alert of abnormal heart rate. In this study, we developed chair type unconstrained BCG measurement system which able to perform continuous heart status monitoring at the office and daily life in the unconstrained way. Furthermore, adaptive threshold is used to detect the heart rate from BCG signals. The HRV(heart rate variability) is calculated from heart rate interval. ECG signal measured using conventional method and BCG signal measured using unconstraint system are carried out simultaneously for the purpose of performance evaluation. From the comparison result, BCG signal shows a similar heart beat characteristic as ECG signal. This proves the possibility of practical implementation of unconstraint healthcare monitoring system. In addition, medical examination like valsalva maneuver is performed to observe the changes in HRV due to stress. By performing valsalva maneuver, heart is said to be placed under an artificial physical stress condition. Under this artificial physical stress condition, the time and frequency domain of HRV parameters are evaluated.

지능형 복합재 구조물에 삽입된 광섬유센서의 피로거동에 관한 연구 (A study on the fatigue behavior of optical fiber sensors embedded in smart composite structures)

  • 장태성;김호;이정주
    • 대한기계학회논문집A
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    • 제22권3호
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    • pp.579-587
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    • 1998
  • In this study, fatigue behavior of the optical fiber sensor embedded in composite laminate was investigated. Static tensile and fatigue tests were performed for three types of laminated composite specimens with embedded optical fiber sensor in the neutral plane ; [0/sub 6//OF/0/sub 6/]/sub T/, [0/sub 2//90/sub 4//OF/90/sub 4//0/sub 2/]/sub T/ and [0/sub 3//90/sub 3//OF/90/sub 3//0/sub 3/]/sub T/. The fracture of the embedded optical fiber sensor was detected by the intensity drop off of laser signal transmitted through the optical fiber sensors embedded within laminated composite specimen. The maximum fatigue stress applied to laminated specimen was compared with the average tensile stress at which the fracture of the embedded optical fiber within the laminate occurred under static tensile loading. From the experiments, firstly it is observed that the decrease in the life of optical fiber sensors embedded within unidirectional-ply laminate by the fatigue loading is relatively small compared to that of cross-ply laminate. Secondly, the optical fiber embedded in unidirectional-ply laminate is fractured by the fatigue damage due to the growth of internal defects of optical fiber, however the optical fiber embedded in cross-ply laminate is fractured by the growth of transverse matrix crack.

재료에 따른 반도체 센서 배선의 피로 수명 평가에 관한 연구 (The Study of Fatigue Lifetime Evaluation on the Interconnect of semiconductor sensor according to the various materials)

  • 심재준;한동섭;한근조;김태형
    • 한국항해항만학회:학술대회논문집
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    • 한국항해항만학회 2005년도 추계학술대회 논문집
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    • pp.283-288
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    • 2005
  • 기존의 기계적인 센서들보다 높은 민감도와 선형성을 가지는 반도체 센서들은 크기가 작고 일괄공정에 의해 제작될 수 있는 반도체 공정 기술로 제작되므로 다양한 산업에서 적용되고 있다. 하지만 열과 반복적인 외부 하중은 센서의 수명에 치명적인 영향을 미치고 있고, 특히 외부에서 가해지는 열은 센서를 구성하는 구조물보다 신호를 전달하는 배선의 피로 수명에 지대한 영향을 미치고 있으므로 이에 대한 영향성을 분석할 수 있는 프로세스를 확립하고, 이후 다양한 재료의 반복적인 열하중에 대한 피로 수명을 평가하여 사용 온도에 대한 적절한 재료를 선정할 수 있는 자료를 제시하고자 하였다.

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