• 제목/요약/키워드: stress fields

검색결과 836건 처리시간 0.035초

The Subsurface Stress Field Caused by Both Normal Loading and Tangential Loading

  • Koo Young- Phi;Kim Tae-Wan;Cho Yong-Joo
    • Journal of Mechanical Science and Technology
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    • 제19권11호
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    • pp.1967-1974
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    • 2005
  • The subsurface stress field caused by both normal loads and tangential loads has been evaluated using the rectangular patch solution. The effect of tangential loading on the subsurface stress field has been investigated in detail for both the cylinder-on-cylinder contact and a spur gear teeth contact. For the cylinder-on-cylinder contact, the subsurface stress fields are moved more to the direction of tangential loads and the positions where the maximum stress occur are getting closer to the surface with the increasing tangential loads. The subsurface stress fields of the gear teeth contact are expanded more widely to the direction of tangential loads with the increasing tangential loads. The friction coefficient of a gear teeth contact is low because they are operated in a lubricated condition, and therefore surface tractions in the EHL condition hardly affect on the subsurface stress field.

인장 및 압축 등방 잔류응력 측정을 위한 누프 압입시험의 응력환산계수 결정 (Determination of Knoop Indentation Stress Conversion Factors for Measuring Equibiaxial Residual Stress)

  • 정민재;김영천
    • Corrosion Science and Technology
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    • 제20권6호
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    • pp.484-490
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    • 2021
  • Instrumented indentation testing has been widely used for residual stress measurement. The Knoop indentation is mainly selected for determining anisotropic mechanical properties and non-equibiaxial residual stress. However, the measurement of equibiaxial stress state and compressive residual stress on a specimen surface using Knoop indentation is neither fully comprehended nor unavailable. In this study, we investigated stress conversion factors for measuring Knoop indentation on equibiaxial stress state through indentation depth using finite element analysis. Knoop indentation was conducted for specimens to determine tensile and compressive equibiaxial residual stress. Both were found to be increased proportionally according to indentation depth. The stress field beneath the indenter during each indentation test was also analyzed. Compressive residual stress suppressed the in-plane expansion of stress field during indentation. In contrast, stress fields beneath the indenter developed diagonally downward for tensile residual stress. Furthermore, differences between trends of stress fields at long and short axes of Knoop indenter were observed due to difference in indenting angles and the projected area of plastic zone that was exposed to residual stress.

Fatigue Crack-Tip Stress Mapping Using Neutron Diffraction

  • Choi, Gyudong;Lee, Min-Ho;Huang, E-Wen;Woo, Wanchuck;Lee, Soo Yeol
    • 한국재료학회지
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    • 제25권12호
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    • pp.690-693
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    • 2015
  • Fatigue crack growth experiments were carried out on a 304 L stainless steel compact-tension(CT) specimen under load control mode. Neutron diffraction was employed to quantitatively measure the residual strains/stresses and the evolution of stress fields in the vicinity of a propagating fatigue-crack tip. Three principal stress components (i.e. crack growth, crack opening, and through-thickness direction stresses) were examined in-situ under loading as a function of distance from the crack tip along the crack-propagation path. The stress/strain fields, measured both at the mid-thickness and near the surface of the CT specimen, were compared. The results show that much higher compressive residual stress fields developed in front of the crack tip near the surface than developed at the mid-thickness area. The change of the stresses ahead of the crack tip under loading is more significant at the mid-thickness area than it is near the surface.

압전재료에서 비정상적으로 전파하는 투과형 모드 III 균열 (Unsteadily Propagating Permeable Mode III Crack in Piezoelectric Materials)

  • 이광호
    • 대한기계학회논문집A
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    • 제36권9호
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    • pp.985-996
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    • 2012
  • 면외 기계적하중과 면내 전기적하중을 받는 압전재료에서 비정상적으로 전파하는 전기투과형 균열에 대하여 연구하였다. 비정상적으로 전파하는 균열에 대한 평형방정식을 개발하였고 근접해법으로 투과형균열에 대한 응력장 및 변위장을 얻었다. 압전상수, 유전율 그리고 균열선단속도 및 응력확대계수의 시간 변화율이 비정상적으로 전파하는 균열선단부근의 응력 및 변위장에 미치는 영향을 명확히 나타내었다. 이러한 응력장과 변위장을 사용하여 비정상적으로 전파하는 균열선단의 응력장 및 변위장의 특성에 대하여 토론하였다.

함수구배재료에서 임의의 방향을 따라 비정상적으로 전파하는 모드 III 균열해석 (Analysis of Unsteady Propagation of Mode III Crack in Arbitrary Direction in Functionally Graded Materials)

  • 이광호;조상봉;황재석
    • 대한기계학회논문집A
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    • 제39권2호
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    • pp.143-156
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    • 2015
  • 함수구배재료의 모드 III 균열이 물성치 구배방향과 다른 방향으로 비정상적으로 전파할 때 전파균열선단부근의 응력 및 변위장에 대하여 연구하였다. 함수구배재료는 밀도가 일정한 상태에서 전단탄성계수가 선형적으로 변화하는 경우와 밀도와 전단탄성계수가 지수형적으로 변화하는 경우로 가정했다. 조화함수의 해를 얻기 위하여 일반적인 편미분방정식의 동적평형방정식을 라플라스 방정식으로 변환하였다. 라플라스 방정식으로부터 균열속도 변화률, 응력확대계수의 변화률 등에 의존되는 응력장과 변위장을 근접해법으로 얻었다. 본 연구에서 얻어진 응력장과 변위장을 사용하여 재료의 비 균질성, 균열속도의 변화률, 응력확대계수의 변화률 등을 고려한 상태에서 균열이 임의의 방향으로 전파할 때 균열선단부근의 응력 및 변위 그리고 응력확대계수에 대하여 연구하였다.

전기적 항복영역을 갖는 전왜균열에 대한 응력강도계수 계산 (Evaluation of Stress Intensity Factors for an Electrostrictive Crack with an Electric Yielding Zone)

  • 범현규;정은도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.469-472
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    • 2000
  • a crack with electrically impermeable surfaces in an electrostrictive material subjected to uniform electric loading is analysed. A strip yield zone model is employed to investigate the effect of electric yielding on stress intensity factor. complete forms of electric fields and elastic fields for the crack are derived by using complex function theory. /the stress intensity factors are obtained based on the strip yield zone model.

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하중형상과 콘크리트 부재의 강도모형 (Strength Models dependent on Load Configurations)

  • 홍성걸
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2008년도 추계 학술발표회 제20권2호
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    • pp.843-846
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    • 2008
  • Rationality of strength models for structural concrete depends on how to treat loads on boundaries and load paths within members. Differentiation between strut-and-tie models and stress fields approaches for shear strength models is discussed in this paper for salient use of current design formula in design code provisions. How to model configuration of loads and stress states along the boundary for the regions under provides a key to realistic construction of stress fields together with STM.

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극저주파 자기장 노출에 의한 세포 유해성 평가 (Cellular Risk Assessment of Cells Exposed to Extremely Low Frequency Electromagnetic Fields)

  • 강흥식;이성표;노명규;김기정;김기광
    • 디지털융복합연구
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    • 제19권5호
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    • pp.207-214
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    • 2021
  • 인간은 환경적으로 다양한 전자기파에 노출되어 있으나 전자기파에 대한 유해성 평가 및 이를 위한 시스템의 개발은 미진한 상태이다. 따라서 우리는 전자기파에 대한 생물학적 유해성 평가를 위한 시스템을 개발하고, 시스템을 통한 생물학적 유해성 평가를 하고자 한다. 본 연구에서는 극저주파 자기장 발생장치를 설계 및 제작하였으며 장치의 출력 신뢰성을 확인하였다. 이 장치를 활용하여 고자기장인 6 mT와 60 Hz에 노출된 세포의 세포스트레스 유도과립(Cellular stress-granules)의 형성 및 세포 분열 주기에 대한 영향을 확인하였다. 그 결과 6, 12 그리고 36시간 동안의 고자기장의 노출은 세포스트레스 유도과립의 형성 및 세포 분열 주기에 영향을 주지 않았다. 이러한 결과들은 극저주파 고자기장에 대한 생물학적 유해성 판단을 위한 중요한 기초 자료로 사용될 수 있을 것으로 판단된다.

X방향의 선형함수구배인 재료에서 전파하는 균열의 동적응력확대계수 $K_{IIID}$ (Dynamic Stress Intensity Factor $K_{IIID}$ for a Propagating Crack in Liner Functionally Gradient Materials Along X Direction)

  • 이광호
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 추계학술대회논문집A
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    • pp.3-8
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    • 2001
  • Dynamic stress intensity factors (DSIFs) are obtained when a crack propagates with constant velocity in rectangular functionally gradient materials (FGMs) under dynamic mode III load. To obtain the dynamic stress intensity factors, it is used the general stress and displacement fields of FGMs for propagating crack and the boundary collocation method (BCM). The stress intensity factors and energy release rates are the greatest in the increasing properties $(\xi>0)$, next constant properties $(\x=0)$ and decreasing properties $(\xi<0)$ under constant crack tip properties and crack tip speed.

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무잔류 응력상태 결정을 통한 표면 잔류응력장 평가에의 레이저 간섭계 적용 (Application of Laser Interferometry for Assessment of Surface Residual Stress by Determination of Stress-free State)

  • 김동원;이낙규;최태훈;나경환;권동일
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.25-30
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    • 2003
  • The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film/substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 ${\mu}m$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI.

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