• 제목/요약/키워드: sticking

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AC PDP의 Image Sticking 현상 연구 (The Study on the image sticking phenomenon in AC PDP)

  • 함명수;최준영;유충희;김동현;이호준;박정후
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 제5회 영호남 학술대회 논문집
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    • pp.76-80
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    • 2003
  • Recently as new digital media like High Definition Television (HDTV) have been made popularization. However In case of image quality characteristics of AC PDP, the problem especially raised is 'image sticking' phenomenon, the phenomenon that the previously displayed pattern still remains after the image in realizing high picture quality. In this paper, Image sticking Phenomena observed in AC PDP are defined and classified, these effects are analyzed as luminance, color purity through chromaticity diagram and firing voltage state using light waveform.

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Bi 고온 초전도 박막의 부착 공정 (Sticking processing of Bi high $T_c$ superconducting thin films)

  • 천민우;김태곤;박용필
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 춘계학술대회 논문집
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    • pp.94-97
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    • 2005
  • Bismuth high Tc superconducting thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra low growth rate, and sticking processing of the respective elements are evaluated. The sticking processing of bismuth element in bismuth high Tc superconducting thin film formation was observed to show a unique temperature dependence; it was almost a constant value of 0.49 below about $730^{\circ}C$ and decreased linearly over about $730^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the bismuth phase formation in the co-deposition process.

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Experimental Study on Reduction of Temporal Dark Image Sticking on Bright Screen in AC-PDPs Using RF-Plasma Treatment on MgO layer

  • Park, Choon-Sang;Kim, Jae-Hyun;Tae, Heung-Sik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.101-103
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    • 2009
  • Minimizing the residual impurity level on the MgO layer is the key factor for reducing temporal dark image sticking on bright screen. In this paper, to reduce the residual impurity level on the MgO layer of 50-in. full-HD ac-PDP with He (35%) - Xe (11%) contents, RF-plasma treatments on the MgO layer are adopted under various gases for plasma treatment. As a result of monitoring the difference in the display luminance between the before and after 5-min. sustain discharge with a square-type image at peak luminance, the Ar and Ar>$O_2$ plasma treatments can reduce the temporal dark image sticking on the bright screen in an ac-PDP.

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Influence of Temporal Dark Image Sticking Characteristics on Bright Screen with Various He contents in 50-in. AC-PDPs

  • Kim, Sun-Ho;Park, Choon-Sang;Kim, Jae-Hyun;Tae, Heung-Sik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.716-718
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    • 2009
  • The effects of the temporal dark image sticking phenomena on bright screen were investigated with various He, Ne contents and a high Xe content fixed at 11% in the 50-in. ac-PDPs. In this work, the disappearance time and the display luminance between the before and after discharge in the discharge and non-discharge regions were measured with 0%, 35%, and 50% He contents. Consequently, the temporal dark image sticking on bright screen was reduced with the increase of He contents compared with the non-He (0%) content.

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The optimization of new alignment films in the TNLC for low image-sticking

  • Lee, Jong-Hyun;Yi, Jun-Sin;Jung, Hwan-Kyung;Lee, Seung-Guk;Nam, Hyo-Hak;Nam, Yoon-Joung;Choi, Sung-Woo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.513-516
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    • 2007
  • We introduce a new copolymer alignment film made by bridge-building structure. It is a better film to decrease the image-sticking level in LCD displays. It is noted that the image-sticking was decreased by preventing ion mixing between inter-layers through high hardness. We have investigated the electrical characteristics such as pretilt angle, Residual DC, VHR by changing cure temperature and process delay time conditions of the new alignment film. In this paper, we have investigated the solution for the deep-rooted image defect and incidentally got a contrast ratio improvement by high anchoring force and hardness elevation through the new copolymer alignment film.

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Investigation of Adhesion Mechanism at the Metal-Organic Interface Modified by Plasma Part I

  • Sun, Yong-Bin
    • 마이크로전자및패키징학회지
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    • 제9권4호
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    • pp.31-34
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    • 2002
  • For the mold die sticking mechanism, the major explanation is that the silica as a filler in EMC (epoxy molding compound) wears die surface to be roughened, which results in increase of adhesion strength. As the sticking behavior, however, showed strong dependency on the EMC models based on the experimental results from different semiconductor manufacturers, chemisorption or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2, N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic or vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

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AC PDP의 배경광 잔상특성 (Characteristics of Image Sticking Observed During Background Display in AC-PDP)

  • 류재화;임성현;김동현;김중균;이호준;박정후
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제53권2호
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    • pp.91-96
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    • 2004
  • In darkroom condition, it was observed that a white picture pattern lasted several minutes leaves a recognizable trace in subsequent black background picture. Although this is not a serious problem for the most current public display or home TV applications, the image sticking should be minimized for future high quality multimedia display applications. In order to characterize this picture memory effect having relatively long time scale, spatially resolved luminance measurement and light waveform measurement have been performed. Pixels located at the outer boundary of white pattern previously displayed shows highest luminance. These cells also shows fastest ignition at the ramp up reset sequence. The luminance and ignition voltage differences between boundary cells and the other cells are increased with display duration and number of sustain-pulse. It is speculated that image sticking observed at the boundary cell is originated from the transport of charged particles and re-deposition of reactive species such as Mg, O provided from strong sustain discharge region.

AC PDP의 Image sticking 현상에 대한 연구 (The study on the image sticking phenomenon in AC PDP)

  • 임성현;심경렬;김동현;이호준;박정후;김규섭
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 춘계합동학술대회 논문집
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    • pp.158-161
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    • 2002
  • Among the characteristics of image quality in AC PDP, the serious problem is the image sticking. It can be explained that the previous pattern still remains after the image is changed into different image. In this paper, in case that the length of sustain period and the continued time of still image is varied, the image sticking phenomenon is investigated as the Initial firing voltage at ramp up time during reset period.

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AC PDP의 Image Sticking 현상에 대한 기초 연구 (The Study on the image sticking phenomenon in AC PDP)

  • 함명수;이선홍;최준영;김동현;이호준;박정후
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2003년도 하계학술대회 논문집 C
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    • pp.1677-1679
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    • 2003
  • One of the main problems in AC PDP is that the previous bright image overlaps on the new image, that is called as image sticking. In this paper, Image sticking Phenomena observed in AC PDP are defined and classified, these effects are analyzed as luminance, color purity through chromaticity diagram and firing voltage state using light waveform.

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Bi-sticking Coefficient of Bi-superconducting Thin Film Prepared by IBS Method

  • Lee, Hee-Kab;Lee, Joon-Ung;Park, Yong-Pil
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.213-216
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    • 1999
  • BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristics temperature dependence : almost a constant value of 0.49 below 730$^{\circ}C$ and decreases linearly with temperature over 730$^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, Bi$_2$O$_3$ from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

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